Finite Element Analyses and Instrumentation Layout for Single Coil Testing of TF Coils in HT-7U

The HT-7U tokamak is a magnetically-confined full superconducting fusion device, consisting of superconducting toroidal field (TF) coils and superconducting poloidal field (PF) coils. These coils are wound with cable-in-conductor (CICC) which is based on UNK NbTi wires made in Russian '. A single D-shaped toroidal field magnet coil will be tested for large and expensive magnets systems before assembling them in the toroidal configuration. This paper describes the layout of the instrumentation for a superconducting test facility based on the results of a finite element modeling of the single coil of toroidal magnetic field (TF) coils in HT-7U tokamak device. At the same time, the design of coil support structure in the test facility is particularly discussed in some detail.

Multi-scale Modeling and Finite Element Analyses of Thermal Conductivity of 3D C/SiC Composites Fabricating by Flexible-Oriented Woven Process

Thermal conductivity is one of the most significant criterion of three-dimensional carbon fiber-reinforced SiC matrix composites(3D C/SiC).Represent volume element(RVE)models of microscale,void/matrix and mesoscale proposed in this work are used to simulate the thermal conductivity behaviors of the 3D C/SiC composites.An entirely new process is introduced to weave the preform with three-dimensional orthogonal architecture.The 3D steady-state analysis step is created for assessing the thermal conductivity behaviors of the composites by applying periodic temperature boundary conditions.Three RVE models of cuboid,hexagonal and fiber random distribution are respectively developed to comparatively study the influence of fiber package pattern on the thermal conductivities at the microscale.Besides,the effect of void morphology on the thermal conductivity of the matrix is analyzed by the void/matrix models.The prediction results at the mesoscale correspond closely to the experimental values.The effect of the porosities and fiber volume fractions on the thermal conductivities is also taken into consideration.The multi-scale models mentioned in this paper can be used to predict the thermal conductivity behaviors of other composites with complex structures.

Characterization of Coal Tar Pitch and Paving Pitch by UV,EA and NMR

In order to enlarge the use of coal tar pitch(CTP) in paving road,CTP and 60th paving pitch (PP) were extracted by n-heptane,toluene and ethanol step by step in a Soxhlet apparatus.The three fractions of CTP and PP were detected using UV-absorption(UV-A),elemental analyses(EA) and nuclear magnetic resonance(NMR) firstly as a whole unit after quality characterization of physical nature of CTP and PP were finished.The CTP had more saturate aliphatic and residue compounds dissolved in ethanol.On the other hand there were more continental type structures of aromatic ring than that of PP.There was almost no residue in PP after extracted by ethanol.The results explained why CTP was crisp in cold winter and was soften in summer.The following research will focus on how to change the chemical construction of CTP into the relative similar structures with those of PP through adding polymer.

Major and trace element geochemistry of the mid-Bay of Bengal surface sediments: implications for provenance

The major and trace elements in 110 surface sediment samples collected from the middle of the Bay of Bengal（mid-Bay of Bengal） are analyzed to investigate provenance. Si levels are highest, followed by Al, and the distributions of these two elements are identical. The average CIA＊（chemical index of alteration） value is 72.07,indicating that the degree of weathering of the sediments in the study area is intermediate between those of sediments of the Himalayan and Indian rivers. Factor analyses and discrimination function analyses imply that the two main provenances are the Himalayan and the Indian continent. The inverse model calculation of the Tinormalized element ratios of the Bay of Bengal sediments indicate an estimated average contribution of 83.5%and 16.5% from the Himalayan and peninsular Indian rivers to the study area, respectively. The Himalayan source contributes more sediment to the eastern part of the study area, whereas the western part receives more sediment from the Indian Peninsula than did the eastern part. The primary mechanisms for deposition of sediments in the study area are the transport of Himalayan matter by turbidity currents and river-diluted water and the transport of Indian matter to the study area by a surface circulation in the Bay of Bengal, particularly the East India Coastal Current.

Assessing the influence of jet-grouting underpinning on the nearby buildings

This paper focuses on the underpinning-induced ground movement due to jet-grouting. Jet-grouting technique can cause distortions as a result of an inaccurate processing sequence and/or errors made at different stages of work execution. The aim of this paper is to determine the minimum value of such movement on the basis of the findings obtained at two similar construction sites located in the Historical Center of Moscow, considering that the maximum value is usually unpredictable. Numerical simulation of the process of soil eroding agrees well with the observational data at the current stage. It was found that the minimum value of deformations （only settlement was considered in this study） due to jetgrouting is no less than 2-3 mm. By contrast, the negative scenario of deformation due to foundation underpinning is clearly demonstrated. Also, this paper provides some general solutions for excavation supporting system as well as for underpinning design.

Reliability Evaluation of QFN Devices Soldered Joints with Creep Model

The solder joint reliability of quad flat non-lead （QFN） package,which has become very popular over the past few years,has received intense interest.The finite element method （FEM） is essential to evaluate the reliability of QFN device.In this paper,Garofalo-Arrheninus model was implemented to simulate the deformation of QFN soldered joints.Equivalent creep strain of the soldered joints was calculated by means of finite element analyses,and was used to evaluate the reliability of QFN packages.It is found that the critical soldered joint of QFN is located the package corner while the maximum creep strain is obtained at the top interface of peripheral soldered joint.The creep strain is provided with periodicity and additivity as the thermal cycling.Nonlinear analysis of QFN package with different lead counts was presented as well,in which the phenomenon that the value of induced creep strain arise as the package size decreasing is noted.Moreover,SnPb and two lead-free solders,namely,Sn3.5Ag/Sn3.8Ag0.7Cu,were both taken into consideration.Simulated results indicate that the creep strain value of lead-free soldered joints is lower than that of SnPb soldered joints,which can be attributed to the difference of stiffness and coefficient of thermal expansion among three solders.Garofalo-Arrheninus model is used to calculate the creep strain of the QFN device for the first time in this study.The results provide an important basis for evaluating the reliability of QFN package.