Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride （TDE-85/MeTHPA） epoxy resin modified by polyurethane （PU） was prepared with 1,4-butanediol （1,4-BDO）, trimethylol propane （TMP） and...Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride （TDE-85/MeTHPA） epoxy resin modified by polyurethane （PU） was prepared with 1,4-butanediol （1,4-BDO）, trimethylol propane （TMP） and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric network I is obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network II is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer（PUP）. The graft chemical bonds are formed between polymer networks I and II that therefore increase the degree of blend and compatibility between epoxy polymer and PU.展开更多
The epoxy shape memory polymer(SMP)with adjustable phase transition temperature is a kind of high-performance shape mem-ory polymer,which can change its phase transition temperature and improve its mechanical properti...The epoxy shape memory polymer(SMP)with adjustable phase transition temperature is a kind of high-performance shape mem-ory polymer,which can change its phase transition temperature and improve its mechanical properties through the process of photo curing.An epoxy SMP constitutive model combining phase transition and viscoelasticity is established by discretizing the epoxy SMP into several glass phase units and rubbery phase units in this paper.The model includes the viscoelastic constitutive equa-tions of glass phase units and rubber phase units,the parameter expression during shape memory process,and material parameter equation during photocuring process.And the stress relaxation behavior of epoxy SMP at different temperatures and the change of material parameters during the photo-curing process are simu-lated numerically,and the simulation results perform consistency with the experimental data.The model can not only relate shape memory effect and phase transformation in physics but also better characterize the viscoelastic properties of SMP and predict the shape memory response of SMP.展开更多
基金Project(2003AA84ts04) supported by the National High-Tech Research and Development Program of China
文摘Diglycidyl 4,5-epoxy tetrahydro phthalate/methyl tetrahydrophthalic anhydride （TDE-85/MeTHPA） epoxy resin modified by polyurethane （PU） was prepared with 1,4-butanediol （1,4-BDO）, trimethylol propane （TMP） and polyurethane prepolymer synthesized by polypropylene glycol and toluene diisocynate. Chemical reaction and curing mechanism of this system were discussed by incorporating the results of infra spectrum analysis. The results indicate that the epoxy polymeric network I is obtained by the curing reaction between TDE-85 and MeTHPA, while the PU polymeric network II is obtained by the chain-extended and crosslinking reaction between 1,4-BDO, TMP and polyurethane prepolymer（PUP）. The graft chemical bonds are formed between polymer networks I and II that therefore increase the degree of blend and compatibility between epoxy polymer and PU.
基金This work was supported by the National Key Research and Development Program of China[2017YFC0307604].
文摘The epoxy shape memory polymer(SMP)with adjustable phase transition temperature is a kind of high-performance shape mem-ory polymer,which can change its phase transition temperature and improve its mechanical properties through the process of photo curing.An epoxy SMP constitutive model combining phase transition and viscoelasticity is established by discretizing the epoxy SMP into several glass phase units and rubbery phase units in this paper.The model includes the viscoelastic constitutive equa-tions of glass phase units and rubber phase units,the parameter expression during shape memory process,and material parameter equation during photocuring process.And the stress relaxation behavior of epoxy SMP at different temperatures and the change of material parameters during the photo-curing process are simu-lated numerically,and the simulation results perform consistency with the experimental data.The model can not only relate shape memory effect and phase transformation in physics but also better characterize the viscoelastic properties of SMP and predict the shape memory response of SMP.
