We present a study of the fabrication of monolayer MoS_2 on n-Si(111) substrates by modified thermal evaporation deposition and the optoelectrical properties of the resulting film. The as-grown MoS_2 ultrathin film is...We present a study of the fabrication of monolayer MoS_2 on n-Si(111) substrates by modified thermal evaporation deposition and the optoelectrical properties of the resulting film. The as-grown MoS_2 ultrathin film is about 10 nm thick, or about a few atomic layers of MoS_2. The film has a large optical absorption range of 300-700 nm and strong luminescence emission at 682 nm. The optical absorption range covered almost the entire ultraviolet to visible light range, which is very useful for making high-efficiency solar cells. Moreover, the MoS_2/Si heterojunction exhibited good rectification characteristics and excellent photovoltaic effects. The power conversion efficiency of the heterojunction device is about 1.79% under white light illumination of 10 m W/cm^2. The results show that the monolayer MoS_2 film will find many applications in high-efficiency optoelectronic devices.展开更多
Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroformin...Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper(Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0 °C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs.展开更多
基金supported in parts by the National Natural Science Foundation of China (No. 60976071)the Scientific Project Program of Suzhou City (No. SYG201121)
文摘We present a study of the fabrication of monolayer MoS_2 on n-Si(111) substrates by modified thermal evaporation deposition and the optoelectrical properties of the resulting film. The as-grown MoS_2 ultrathin film is about 10 nm thick, or about a few atomic layers of MoS_2. The film has a large optical absorption range of 300-700 nm and strong luminescence emission at 682 nm. The optical absorption range covered almost the entire ultraviolet to visible light range, which is very useful for making high-efficiency solar cells. Moreover, the MoS_2/Si heterojunction exhibited good rectification characteristics and excellent photovoltaic effects. The power conversion efficiency of the heterojunction device is about 1.79% under white light illumination of 10 m W/cm^2. The results show that the monolayer MoS_2 film will find many applications in high-efficiency optoelectronic devices.
基金supported by the State Key Development Program for Basic Research of China(No.2011CB013105)
文摘Micro vapor chamber(MVC) for light emitting diodes(LEDs) can be designed and fabricated to enhance the heat dissipation efficiency and improve the reliability. In this paper, we used photoresist SU-8 and electroforming copper(Cu) to fabricate three kinds of wick structures, which are star, radiation and parallel ones, and the substrate is silicon with thickness of 0.5 mm. Electroforming Cu on silicon to make micro wick structure was a critical step, the ampere-hour factor was used, and accordingly the electroforming time was predicted. The composition of electroforming solution and parameters of electroforming were optimized too. After charging and packaging, thermal behavior tests were carried out to study the heat dissipation performance of MVCs. When the input power was 8 W, the parallel wick structure reached the equivalent temperature of 69.0 °C in 226 s, while the others were higher than that. The experimental results prove that the wick structures have significant influence on the heat transfer capability of MVCs.
