A novel A1GaN/GaN high electron mobility transistor （HEMT） with a source-connected T-shaped field-plate （ST-FP HEMT） is proposed for the first time in this paper. The source-connected T-shaped field-plate （ST-FP...A novel A1GaN/GaN high electron mobility transistor （HEMT） with a source-connected T-shaped field-plate （ST-FP HEMT） is proposed for the first time in this paper. The source-connected T-shaped field-plate （ST-FP） is composed of a source-connected field-plate （S-FP） and a trench metal. The physical intrinsic mechanisms of the ST-FP to improve the breakdown voltage and the FP efficiency and to modulate the distributions of channel electric field and potential are studied in detail by means of two-dimensional numerical simulations with Silvaco-ATLAS. A comparison to the HEMT and the HEMT with an S-FP （S-FP HEMT） shows that the ST-FP HEMT could achieve a broader and more uniform channel electric field distribution with the help of a trench metal, which could increase the breakdown voltage and the FP efficiency remarkably. In addition, the relationship between the structure of the ST-FP, the channel electric field, the breakdown voltage as well as the FP efficiency in ST-FP HEMT is analyzed. These results could open up a new effective method to fabricate high voltage power devices for the power electronic applications.展开更多
We present an AIInN/AlN/GaN MOS-HEMT with a 3 nm ultra-thin atomic layer deposition （ALD） Al2O3 dielectric layer and a 0.3 μm field-plate （FP）-MOS-HEMT. Compared with a conventional AIInN/AlN/GaN HEMT （HEMT） wi...We present an AIInN/AlN/GaN MOS-HEMT with a 3 nm ultra-thin atomic layer deposition （ALD） Al2O3 dielectric layer and a 0.3 μm field-plate （FP）-MOS-HEMT. Compared with a conventional AIInN/AlN/GaN HEMT （HEMT） with the same dimensions, a FP-MOS-HEMT with a 0.6 μm gate length exhibits an improved maximum drain current of 1141 mA/mm, an improved peak extrinsic transconductance of 325 mS/mm and effective suppression of gate leakage in both the reverse direction （by about one order of magnitude） and the forward direction （by more than two orders of magnitude）. Moreover, the peak extrinsic transconductance of the FP-MOS-HEMT is slightly larger than that of the HEMT, indicating an exciting improvement of transconductance performance. The sharp transition from depletion to accumulation in the capacitance-voltage （C-V） curve of the FP-MOS-HEMT demonstrates a high-quality interface of Al2O3/AlInN. In addition, a large off-state breakdown voltage of 133 V, a high field-plate efficiency of 170V/#m and a negligible double-pulse current collapse is achieved in the FP-MOS-HEMT. This is attributed to the adoption of an ultra-thin Al2O3 gate dielectric and also of a field-plate on the dielectric of an appropriate thickness. The results show a great potential application of the ultra-thin ALD-Al2O3 FP-MOS-HEMT to deliver high currents and power densities in high power microwave technologies.展开更多
基于垂直双扩散金属氧化物(VDMOS)场效应晶体管终端场限环(FLR)与场板(FP)理论,在场限环上依次添加金属场板与多晶硅场板,并通过软件仿真对其进行参数优化,最终实现了一款700 V VDMOS终端结构的优化设计。对比场限环终端结构,金属场板...基于垂直双扩散金属氧化物(VDMOS)场效应晶体管终端场限环(FLR)与场板(FP)理论,在场限环上依次添加金属场板与多晶硅场板,并通过软件仿真对其进行参数优化,最终实现了一款700 V VDMOS终端结构的优化设计。对比场限环终端结构,金属场板与多晶硅复合场板的终端结构,能够更加有效地降低表面电场峰值,增强环间耐压能力,从而减少场限环个数并增大终端击穿电压。终端有效长度仅为145μm,击穿电压能够达到855.0 V,表面电场最大值为2.0×105V/cm,且分布比较均匀,终端稳定性和可靠性高。此外,没有增加额外掩膜和其他工艺步骤,工艺兼容性好,易于实现。展开更多
The aim of this study was to determine the capacity of copper to modify synaptic hyperexcitability generated by penicillin G. This epileptogenic drug was studied with CA1 neurons of the rat hippocampus. Hippocampal sl...The aim of this study was to determine the capacity of copper to modify synaptic hyperexcitability generated by penicillin G. This epileptogenic drug was studied with CA1 neurons of the rat hippocampus. Hippocampal slices were extracted from adult male Wistar rats (n = 16). The field potentials (FP) were registered in CA1 neurons after electrical stimulation from the stratum radiatum. The mean voltage and duration of FP were measured during control, penicillin G, copper and washout stages. Copper (100 μM) significantly decreased mean FP voltage compared to the control and penicillin stages. However, during the washout stage, the mean FP voltage was significantly higher than in the penicillin stage. Regarding the FP duration, 100 μM of copper significantly decreased the mean FP during the penicillin stage. After the washing stage, the mean FP lasted significantly longer. Thus, administering copper modified CA1 synapses by blocking hippocampal neuronal excitability was generated by the epileptic agent.展开更多
The relationship between A1GaN/GaN HEMT gate field plate （FP） and surface-state-related gate lag phenomena is investigated by two-dimensional numerical transient simulations to study the mechanism of the influence o...The relationship between A1GaN/GaN HEMT gate field plate （FP） and surface-state-related gate lag phenomena is investigated by two-dimensional numerical transient simulations to study the mechanism of the influence of FPs on current collapse. The simulations reveal that adding a field plate has a noticeable impact on the extent of current collapse while it has no influence on lapsed time. The FP is found to suppress current collapse through reducing the ionization probability of surface states by enhancing free hole accumulation next to the AIGaN surface between gate and drain.展开更多
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61574112,61334002,61306017,61474091,and 61574110)the Natural Science Basic Research Plan in Shaanxi Province,China(Grant No.605119425012)
文摘A novel A1GaN/GaN high electron mobility transistor （HEMT） with a source-connected T-shaped field-plate （ST-FP HEMT） is proposed for the first time in this paper. The source-connected T-shaped field-plate （ST-FP） is composed of a source-connected field-plate （S-FP） and a trench metal. The physical intrinsic mechanisms of the ST-FP to improve the breakdown voltage and the FP efficiency and to modulate the distributions of channel electric field and potential are studied in detail by means of two-dimensional numerical simulations with Silvaco-ATLAS. A comparison to the HEMT and the HEMT with an S-FP （S-FP HEMT） shows that the ST-FP HEMT could achieve a broader and more uniform channel electric field distribution with the help of a trench metal, which could increase the breakdown voltage and the FP efficiency remarkably. In addition, the relationship between the structure of the ST-FP, the channel electric field, the breakdown voltage as well as the FP efficiency in ST-FP HEMT is analyzed. These results could open up a new effective method to fabricate high voltage power devices for the power electronic applications.
基金Project supported by the Fundamental Research Funds for the Central Universities,China(Grant No.JY10000925002)the National Key Science and Technology Special Project(Grant No.2008ZX01002-002)+1 种基金the National Natural Science Foundation of China(Grant Nos.60736033,60976068 and 61076097)New Teacher Foundation for Doctoral Program of Ministry of Education of China(Grant No.200807011012)
文摘We present an AIInN/AlN/GaN MOS-HEMT with a 3 nm ultra-thin atomic layer deposition （ALD） Al2O3 dielectric layer and a 0.3 μm field-plate （FP）-MOS-HEMT. Compared with a conventional AIInN/AlN/GaN HEMT （HEMT） with the same dimensions, a FP-MOS-HEMT with a 0.6 μm gate length exhibits an improved maximum drain current of 1141 mA/mm, an improved peak extrinsic transconductance of 325 mS/mm and effective suppression of gate leakage in both the reverse direction （by about one order of magnitude） and the forward direction （by more than two orders of magnitude）. Moreover, the peak extrinsic transconductance of the FP-MOS-HEMT is slightly larger than that of the HEMT, indicating an exciting improvement of transconductance performance. The sharp transition from depletion to accumulation in the capacitance-voltage （C-V） curve of the FP-MOS-HEMT demonstrates a high-quality interface of Al2O3/AlInN. In addition, a large off-state breakdown voltage of 133 V, a high field-plate efficiency of 170V/#m and a negligible double-pulse current collapse is achieved in the FP-MOS-HEMT. This is attributed to the adoption of an ultra-thin Al2O3 gate dielectric and also of a field-plate on the dielectric of an appropriate thickness. The results show a great potential application of the ultra-thin ALD-Al2O3 FP-MOS-HEMT to deliver high currents and power densities in high power microwave technologies.
文摘基于垂直双扩散金属氧化物(VDMOS)场效应晶体管终端场限环(FLR)与场板(FP)理论,在场限环上依次添加金属场板与多晶硅场板,并通过软件仿真对其进行参数优化,最终实现了一款700 V VDMOS终端结构的优化设计。对比场限环终端结构,金属场板与多晶硅复合场板的终端结构,能够更加有效地降低表面电场峰值,增强环间耐压能力,从而减少场限环个数并增大终端击穿电压。终端有效长度仅为145μm,击穿电压能够达到855.0 V,表面电场最大值为2.0×105V/cm,且分布比较均匀,终端稳定性和可靠性高。此外,没有增加额外掩膜和其他工艺步骤,工艺兼容性好,易于实现。
文摘The aim of this study was to determine the capacity of copper to modify synaptic hyperexcitability generated by penicillin G. This epileptogenic drug was studied with CA1 neurons of the rat hippocampus. Hippocampal slices were extracted from adult male Wistar rats (n = 16). The field potentials (FP) were registered in CA1 neurons after electrical stimulation from the stratum radiatum. The mean voltage and duration of FP were measured during control, penicillin G, copper and washout stages. Copper (100 μM) significantly decreased mean FP voltage compared to the control and penicillin stages. However, during the washout stage, the mean FP voltage was significantly higher than in the penicillin stage. Regarding the FP duration, 100 μM of copper significantly decreased the mean FP during the penicillin stage. After the washing stage, the mean FP lasted significantly longer. Thus, administering copper modified CA1 synapses by blocking hippocampal neuronal excitability was generated by the epileptic agent.
文摘The relationship between A1GaN/GaN HEMT gate field plate （FP） and surface-state-related gate lag phenomena is investigated by two-dimensional numerical transient simulations to study the mechanism of the influence of FPs on current collapse. The simulations reveal that adding a field plate has a noticeable impact on the extent of current collapse while it has no influence on lapsed time. The FP is found to suppress current collapse through reducing the ionization probability of surface states by enhancing free hole accumulation next to the AIGaN surface between gate and drain.
