Preparation and Properties of Cu-Containing High-entropy Alloy Nitride Films by Magnetron Sputtering on Titanium Alloy

Magnetron sputtering deposition with regulated Cu target power was used for depositing Cu-containing high-entropy alloy nitride(Cu-(HEA)N)films on TC4 titanium alloy substrates.The microscopic morphologies,surface compositions,and thicknesses of the films were characterized using SEM+EDS;the anti-corrosion,wear resistance and antibacterial properties of the films in simulated seawater were investigated.The experimental results show that all four Cu-(HEA)N films are uniformly dense and contained nanoparticles.The film with Cu doping come into contact with oxygen in the air to form cuprous oxide.The corrosion resistance of the(HEA)N film without Cu doping on titanium alloy is better than the films with Cu doping.The Cu-(HEA)N film with Cu target power of 16 W shows the best wear resistance and antibacterial performance,which is attributed to the fact that Cu can reduce the coefficient of friction and exacerbate corrosion,and the formation of cuprous oxide has antibacterial properties.The findings of this study provide insights for engineering applications of TC4 in the marine field.

Electroless plating and growth kinetics of Ni-P alloy film on SiC_p/Al composite with high SiC volume fraction

After Sn/Pd activating, the SiCp/Al composite with 65% SiC (volume fraction) was coated by electroless Ni?P alloy plating. Surface morphology of the composite and its effect on the Ni?P alloy depositing process and bonding action of Ni and P atoms in the Ni?P alloy were studied. The results show that inhomogeneous distribution of the Sn/Pd activating points results in preferential deposition of the Ni?P alloy particles on the Al alloy and rough SiC particle surfaces and in the etched caves. The Ni?P alloy film has an amorphous structure where chemical bonding between Ni and P atoms exists. After a continuous Ni?P alloy film formed, electroless Ni?P alloy plating is not affected by surface morphology and characteristics of the SiCp/Al composite any longer, but by the electroless plating process itself. The Ni?P alloy film follows linear growth kinetics with an activation energy of 68.44 kJ/mol.

Preparation of Mg-Yb alloy film by electrolysis in the molten LiCl-KCl-YbCl_3 system at low temperature

The electrochemical behavior of Yb3+ and electrodeposition of Mg-Yb alloy film at solid magnesium cathode in the molten LiCl-KCl-YbCl3(2 wt.%) system at 773 K was investigated.Transient electrochemical techniques,such as cyclic voltammetry,chronopotentiometry and chronoamperometry were used in order to explore the deposition mechanism of Yb.The reduction process of Yb3+ is stepwise reactions which are single-electron and double-electron reversible charge transfer reactions.The speed control step was a diffu...

Magnetic Properties and Heat-Treatment of Electrodeposited Sm-Co Alloy Films

Dense, adhesive and uniform Sm-Co alloy films were prepared by potentiostatic electrolysis on copper substrates in urea-acetamide-NaBr-KBr melt at 353 K, which were observed by SEM. The electroreduction of Co2+ and Sm3+ was investigated by cyclic voltammetry. The reduction of Co2+ is an irreversible process. Sm3+ can not be reduced alone, but Sm-Co can be co-deposited by induced deposition. The films could be crystallized by heat-treatment at different temperature from 723 to 923 K under Ar atmosphere. The annealed time was chosen as 30 s. The phases of deposited and annealed films were investigated by XRD. The content of Sm was analyzed by Inductive Coupled Plasma Emission Spectrometer (ICPES). The hysteresis loops of the Sm-Co alloy films have been measured by Vibrating Sample Magnetometer (VSM). The experimental results reveal that, the heat-treatment has important influence on coercive field Hc and remanent squareness S of Sm-Co alloy films; the deposited Sm-Co alloy films are amorphous, while the annealed those become polycrystalline; in addition, the magnetocrystalline anisotropy and preferring orientation of films depend strongly on the contents of crystal phases.

Electrodeposition of Er-Ni Alloy Film in Dimethylsulfoxide

The cyclic voltammetry and chronoamperometry were used to investigate the electrochemical behaviors of Er(Ⅲ) and Ni(Ⅱ) in LiClO 4 DMSO(dimethylsufoxide) system on Pt and Cu electrodes. Experimental results indicated that the reduction of Er(Ⅲ) to Er and Ni(Ⅱ) to Ni were irreversible in one step on Pt and Cu electrodes. The diffusion coefficient and electron transfer coefficient of Er(Ⅲ) in 0.01 mol·L -1 ErCl 3 -0.1 mol·L -1 LiClO 4 DMSO system at 303K were 1.47×10 -10 m 2·s -1 and 0.108 respectively, and the diffusion coefficient and electron transfer coefficient of Ni(Ⅱ) in 0.01 mol·L -1 NiCl 2-0.1 mol·L -1 LiClO 4 DMSO system at 303K were 3.38×10 -10 m 2·s -1 and 0.160 respectively. The homogeneous, strong adhesive Er Ni alloy films with metallic lu- stre was prepared by potentiostatic electrolysis on Cu electrode in ErCl 3 NiCl 2 LiClO 4 DMSO system at -1.90～ -2.55 V (vs SCE).

Electrochemical Preparation of La-Ni Alloy Film in Acetamide-Urea-NaBr Melting System

The reduction of Ni(Ⅱ) is an irreversible reaction and La(Ⅲ) cannot be reduced to La directly but be co-deposited inductively in the present of Ni(Ⅱ) in the Acetamide-Urea-NaBr molten salt electrolyte at 353 K. The uncrystallized alloy film of La-Ni is obtained by potentiostatic electrolysis, and the amount of La grows with increasing cathodic overpotential, molar ratios of La(Ⅲ) to Ni(Ⅱ) and the electrolysis time. The maximum amount of La in alloy film reaches to 78.81% (mass fraction) in present study.

Electrodeposition of Pr-Fe alloy films in urea-dimethylsulfoxide

Cyclic voltammetry and chronoamperometry were used to investigate theelectrochemical behavior of Pr^(3+) ions in a system of 0.01 mol centre dot dm^(-3) Pr(CH_3SO_3)_3 +0.01 mol centre dot dm^(-3) FeCl_2 + 3.0 mol centre dot dm^(-3) urea + DMSO on a R electrode. Someelectrochemical parameters were measured. Potentiostatic depositions between -1.6 and -2.4 V wereapplied to deposit Pr-Fe films in urea-DMSO mixed solution. The Pr content in the alloy films was inthe range of 34.89 wt. percent to 37.15 wt. percent. The Pr-Fe alloy films are proven to beamorphous by XRD (X-ray diffraction).

Electrochemical Preparation of La-Fe Alloy Films in Dimethylsulfoxide (DMSO)

The cyclic voltammetry and potential step methods were used to investigate the electrochemical behavior of Fe 2+ and La 3+ in FeCl 2 LiCl DMSO and LaCl 3 LiCl DMSO systems on Pt, Cu and Ni cathodes. The electroreduction of Fe 2+ to Fe is irreversible in one step,while the electroreduction of La 3+ to La is quasi reversible. The diffusion coefficient of La 3+ in LaCl 3 LiCl DMSO system at 298 K was 3 1×10 -6 cm 2·s -1 . The diffusion coefficient and transfer coefficient of Fe 2+ in FeCl 2 LiCl DMSO system at 298 K were 2 54×10 -6 cm 2·s -1 and 0 24, respectively. La Fe alloy films containing La from 22 7% to 37 1% (mass fraction) were prepared by potentiostatic electrolysis on Cu substrates at a deposition potential from -1 750 to -2 450 V (vs SCE). The fine La Fe alloy films were also obtained by pulse electrolysis at a pulse current densities from 2 to 6 mA·cm -2 . The surfaces of these alloy films are smooth, adhesive and uniform, and have metallic luster.

Microstructure and abrasive wear behaviour of anodizing composite films containing Si C nanoparticles on Ti6Al4V alloy

Anodized composite films containing Si C nanoparticles were synthesized on Ti6Al4 V alloy by anodic oxidation procedure in C4O6H4Na2 electrolyte. Scanning electron microscopy(SEM), energy dispersive spectroscopy(EDS) and X-ray photoelectron spectroscopy(XPS) were employed to characterize the morphology and composition of the films fabricated in the electrolytes with and without addition of Si C nanoparticles. Results show that Si C particles can be successfully incorporated into the oxide film during the anodizing process and preferentially concentrate within internal cavities and micro-cracks. The ball-on-disk sliding tests indicate that Si C-containing oxide films register much lower wear rate than the oxide films without Si C under dry sliding condition. Si C particles are likely to melt and then are oxidized by frictional heat during sliding tests. Potentiodynamic polarization behavior reveals that the anodized alloy with Si C nanoparticles results in a reduction in passive current density to about 1.54×10-8 A/cm2, which is more than two times lower than that of the Ti O2 film(3.73×10-8 A/cm2). The synthesized composite film has good anti-wear and anti-corrosion properties and the growth mechanism of nanocomposite film is also discussed.

Studies on Preparation of Co-Bi Alloy Films by Electrodeposition From Nonaqueous Medium

Cyclic voltammetry and potentiostatic electrolysis were used to investigate the preparation of Co-Bi alloy films in a LiClO 4-DMSO system. The experimental results indicate that the Co-Bi alloy films containing 14 35%-29 77% Co can be prepared via potentionstatic electrolysis on Cu substrates, at deposition potential -1 10--1 65 V( vs. SCE) and by controlling the system composition and deposition condition. They are uniform gray films with a metallic luster and they are adhered firmly to the Cu substrate. The films were analyzed by EDS, SEM and XRD. After heat treatment of crystallization at 275 ℃ for 1 h, the alloy phase of Co-Bi can be confirmed via the XRD pattern.

Preparation of Dy-Bi alloy films by electrodeposition in organic bath

The cyclic voltammetry and potentiostatic electrolysis were used toinvestigate the preparing of Dy-Bi alloy films in LiCl-DMSO (dimethylsulfoxide) system. The effectsof several factors including the potential of deposition, concentrations of main salts, and theconcentration ratio of DyCl_3 to Bi(NO_3)_3 were studied. Dy-Bi alloy films containing 4.82%-80.62%(mass fraction) dysprosium were prepared in DyCl_3-Bi(NO_3)_3-LiCl-DMSO system by controlling thesystem composition and deposition conditions. The films are gray, uniform, metallic luster andadhere firmly to the copper substrates analyzed by SEM (scanning electron microscope), EDS (X-rayenergy dispersive analysis), and XRD (X-ray diffraction). After heat treatment at 718 K for 1 h, thealloy phase of Dy-Bi was found in XRD patterns.

STUDY ON CO-ELECTRODEPOSITION OF Bi-Fe ALLOY FILMS IN ORGANIC BATH

The cyclic voltametry and potentiostatic electrolysis was used to investigate the preparation of Bi-Fe alloy films in LiClO4-DMSO (dimethylsulfoxide) system. The effects of several factors including the potential of deposition, current density and concentration of iron and bismuth in the solution on the Fe content in the alloy deposits were studied. Experimental results indicated that the amorphous alloy films of Bi-Fe containing Fe 4.40wt%-33.67wt% could be prepared by controlling the system composition and deposition conditions. They were gray, uniform, metallic luster and adhered firmly to the copper substrates analyzed by EDS, SEM and XRD. After heat treatment of crystallization at 270℃ for 1h, the crystal phase of Bi-Fe can be found in XRD patterns.

Sweep potential deposition of Tm-Ni-Co alloy films in dimethylsulfoxide

The Tm-Ni-Co alloy films have been prepared by the sweep potential deposition technique. The surface appear-ance of Tm-Ni-Co alloy films was silver smooth and adhesive. The surfaces of Tm-Ni-Co alloy films observed by scanningelectron microscope (SEM) were uniform, adhesive and compact. The sizes of metallic grains were about 80-100nm,100-200nm, 50-60nm, and 90-120nm at 1mV·s^(-1), 5mV·s^(-1), 10mV·s^(-1) and 50mV·s^(-1), respectively. The Tm-Ni-Co alloy film wasamorphous as proven by the X-ray diffraction(XRD).

Electrochemical investigation on the formations of Dy-Ni alloy films in dimethylformamide

The elexctrochemical properties of Dy (III), Ni(II) + Ni(II) indimethylformamide were studied by cyclic voltammetry on Pt or Cuelectrode. Black, metallic lustered, compact and well adhesive Dy-Nialloy films can be co-deposited on Cu electrode bysweeping-potential-deposition method within some potentials. SEM,EDAX and XRD were used to analyze the alloy films. The Dy content inthe Dy-Ni alloy film is up to 56.91/100 (mass fraction) and the Dy-Ni alloy films are amorphous.

Preparation of Er-Fe Alloy Films in Dimethylsulfoxide by Electrodeposition Method

Cyclic voltammetry and chronoamperometry were used to investigate the electrochemical behavior of Fe(Ⅱ) and Er(Ⅲ) in a LiClO 4 DMSO(dimethylsufoxide) system at Pt and Cu electrodes. Experimental results indicate that the reductions of Fe(Ⅱ) to Fe(0) and Er(Ⅲ) to Er(0) were irreversible at Pt and Cu electrodes. The diffusion coefficient and the electron transfer coefficient of Fe(Ⅱ) in a 0 01 mol/L FeCl 2 0 1 mol/L LiClO 4 DMSO system at 303 K were 1 70×10 -10 m 2/s and 0 08 respectively, the diffusion coefficient and the electron transfer coefficient of Er(Ⅲ) in a 0 01 mol/L ErCl 3 0 1mol/L LiClO 4 DMSO system at 303 K were 1 47×10 -10 m 2/s and 0 108 respectively. The homogeneous, strong adhesive Er Fe alloy films containing Er of 31 39%-42 12% in mass fraction with metallic lustre were prepared by potentiostatic electrolysis on a Cu electrode in a ErCl 3 FeCl 2 LiClO 4 DMSO system at -1 75--2 50 V( vs . SCE).

Effect of Ti Content on Properties of Al-Ti Alloy Film for Address Lines of TFT-LCDs

mploying pure aluminum for address lines of TFT-LCDs has a severe problem of hillock formation at elevated temperature. However, in the case of large TFT-LCDs more than 254 mm, it is impossible to use refractory metals for address lines because of their high resistivity. The Al-Ti alloy films for address lines of TFT-LCDs were studied and it was found that Al-Ti alloy film has excellent resistance of Al-Ti alloy to hillocks. The effect of Ti content on properties of Al-Ti alloy film was investigated.

Oxidation of Ion Plated Ni—Cr Alloy Film at 300℃

Investigation by using LAS 3000 surface analysis system showed that the oxide of Fe, Cr,Al formed during oxidation were Cr_2O_3,Fe_2O_3 and Al_2O_3,but only small amount of nickel oxide was found. The composition of oxide layers for different oxidation durations varied in a similar way. In all cases,there exists an oxygen concentration peak in the composition profile of oxide layer. There is a transitional zone between oxide layer and alloy film.The thickness of oxide layer increases logarithmically with the time of oxida- tion.The ion plated Ni-Cr alloy film has very dense oxide layer and good oxidation resistance.

Formation and Characterization of Pd,Pt and Pd-Pt Alloy Films on Polyimide by Catalyst-Enhanced Chemical Vapor Deposition

Platinum, palladium and their alloy films on polyimide were formed by catalyst-enhanced chemical vapor deposition （CVD） in the carrier gas （N2, O2） at 220-300℃ under reduced pressure and normal pressure. The deposition of palladium complexes [ Pd（（η3-allyl）（hfac） and Pd（hfac）2 ] gives pure palladium film, while the deposition of platinum needs the enhancement of palladium complex by mixing precursor platinum complex Pt（COD）Me2 and palladium complex in the same chamber. The co-deposition of Pd and Pt metals was used for the deposition of alloy films. During the CVD of palladium-platinum alloy, the Pd/Pt atomic ratios vary under different co-deposition conditions. These metal films were characterized by XPS and SEM, and show a good adhesive property.

THE LUBRICATING PROPERTIES OF ION-PLATING FILMS OF Pb-Sn ALLOY

Experimental results of the lubricating behaviour of Pb-Sn alloy films formed by ion-plating on brass substrates are given. It is shown that the film microhardness, friction coefficient and wear life per thickness are under the influence of the substrate. The wear failure of film appears to be film adhesion and transferring by the mating surface.

ELECTROCHEMICAL PROPERTIES OF THE HYDROGEN ABSORPTION OF AMORPHOUS Ml－Ni ALLOY FILMS

The amorphous Ml-Ni films were prepared by means of ion beam sputtering the electrochemical hydrogen storage,discharge ability and durability of amorphous film electrodes are investigated,The results show that the maximum capacities of the amorphous MlNi_(1.79),MlNi_(2.52),and MlNi_(3.44) samples are 90,100 and 142 mAh/g,respectively,and the MlNi_(3.44) amorphous film does not off and disintegrate into fine particles a fier more than 580 cycles.