In this paper, we investigate the performance of the bulk fin field effect transistor （FinFET） through a three- dimensional （3D） full band Monte Carlo simulator with quantum correction. Several scattering mechanis...In this paper, we investigate the performance of the bulk fin field effect transistor （FinFET） through a three- dimensional （3D） full band Monte Carlo simulator with quantum correction. Several scattering mechanisms, such as the acoustic and optical phonon scattering, the ionized impurity scattering, the impact ionization scattering and the surface roughness scattering are considered in our simulator. The effects of the substrate bias and the surface roughness scattering near the Si/SiO2 interface on the performance of bulk FinFET are mainly discussed in our work. Our results show that the on-current of bulk FinFET is sensitive to the surface roughness and that we can reduce the substrate leakage current by modulating the substrate bias voltage.展开更多
在鳍型场效应晶体管(SOI FinFET)相关静电防护技术研究基础上,提出了一种新型的体区接触固定型绝缘体上硅鳍型场效应晶体管泄放钳位装置(Fix-base SOI FinFET Clamp)。该新型结构的器件解决了基区接触浮空在静电防护设计时引起的一系列...在鳍型场效应晶体管(SOI FinFET)相关静电防护技术研究基础上,提出了一种新型的体区接触固定型绝缘体上硅鳍型场效应晶体管泄放钳位装置(Fix-base SOI FinFET Clamp)。该新型结构的器件解决了基区接触浮空在静电防护设计时引起的一系列问题,而且对正常的FinFET工艺具有良好的兼容性。通过计算机辅助工艺设计(TCAD)仿真论证了Fix-base SOI FinFET Clamp具有明显效果,详细阐述和讨论了SOI FinFET和Fix-base SOI FinFET Clamp工作状态下的电流和热分布。展开更多
单粒子瞬态(SET)的电路仿真通常是注入双指数电流源来模拟,然而,纳米FinFET器件的SET采用单个双指数电流源模拟会带来较大误差。TCAD仿真结果较准确,但耗时较长,为了较为准确地电路仿真SET,提出了一种SET的复合双指数电流源模型。利用T...单粒子瞬态(SET)的电路仿真通常是注入双指数电流源来模拟,然而,纳米FinFET器件的SET采用单个双指数电流源模拟会带来较大误差。TCAD仿真结果较准确,但耗时较长,为了较为准确地电路仿真SET,提出了一种SET的复合双指数电流源模型。利用TCAD对电学特性校准的14 nm SOI FinFET器件的SET进行仿真,通过分析瞬态电流波形,对比双指数模型特点,提取特征参数,并利用遗传算法对模型参数进行优化处理,得到了关于线性能量转移(LET)的复合双电流源参数的解析模型。利用此复合双指数电流源模型与TCAD得到的瞬态电流波形、峰值和收集电荷量进行对比检验。结果显示,本文模型得到的SET电流波形与TCAD的基本吻合,与TCAD相比,模型的峰值电流的平均误差和最大误差分别为3.00%、5.06%;收集电荷量的平均误差和最大误差分别为4.02%、7.17%。展开更多
In this paper, we investigate the temperature and drain bias dependency of single event transient （SET） in 25-nm fin field-effect-transistor （FinFET） technology in a temperature range of 0-135 ℃ and supply voltag...In this paper, we investigate the temperature and drain bias dependency of single event transient （SET） in 25-nm fin field-effect-transistor （FinFET） technology in a temperature range of 0-135 ℃ and supply voltage range of 0.4 V- 1.6 V. Technology computer-aided design （TCAD） three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135 ℃. The charge collected increases from 45.5 ℃ to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V. Furthermore, simulation results and the mechanism of temperature and bias dependency are discussed.展开更多
In this paper the physical characteristics of FINFET (fin-field effect transistor) transistor behavior are investigated. For the analysis, semi-classical electron transfer method was used based on drift diffusion appr...In this paper the physical characteristics of FINFET (fin-field effect transistor) transistor behavior are investigated. For the analysis, semi-classical electron transfer method was used based on drift diffusion approximation by TCAD (Tiber CAD) software. Simulations show that the output resistance of FINFET along very small gate (gate length and fin height of 50 nm) is negative. The negative resistance is used in oscillators.展开更多
The conformal mapping of an electric field has been employed to develop an accurate parasitic capacitance model for nanoscale fin field-effect transistor（Fin FET） device. Firstly, the structure of the dual-layer spa...The conformal mapping of an electric field has been employed to develop an accurate parasitic capacitance model for nanoscale fin field-effect transistor（Fin FET） device. Firstly, the structure of the dual-layer spacers and the gate parasitic capacitors are thoroughly analyzed. Then, the Cartesian coordinate is transferred into the elliptic coordinate and the equivalent fringe capacitance model can be built-up by some arithmetical operations. In order to validate our proposed model, the comparison of statistical analysis between the proposed calculation and the 3D-TCAD simulation has been carried out, and several different material combinations of the dual-k structure have been considered. The results show that the proposed analytical model can accurately calculate the fringe capacitance of the Fin FET device with dual-k spacers.展开更多
This paper reports the physical realization of the Bipolar Field-Effect Transistor （BiFET） and its onetransistor basic building block circuits. Examples are given for the one and two MOS gates on thin and thick, pur...This paper reports the physical realization of the Bipolar Field-Effect Transistor （BiFET） and its onetransistor basic building block circuits. Examples are given for the one and two MOS gates on thin and thick, pure and impure base, with electron and hole contacts, and the corresponding theoretical current-voltage characteristics previously computed by us, without generation-recombination-trapping-tunneling of electrons and holes. These examples include the one-MOS-gate on semi-infinite thick impure base transistor （the bulk transistor） and the impurethin-base Silicon-on-Insulator （SOI） transistor and the two-MOS-gates on thin base transistors （the FinFET and the Thin Film Transistor TFF）. Figures are given with the cross-section views containing the electron and hole concentration and current density distributions and trajectories and the corresponding DC current-voltage characteristics.展开更多
基金Project supported by the National Basic Research Program of China (Grant No. 2011CBA00604)
文摘In this paper, we investigate the performance of the bulk fin field effect transistor （FinFET） through a three- dimensional （3D） full band Monte Carlo simulator with quantum correction. Several scattering mechanisms, such as the acoustic and optical phonon scattering, the ionized impurity scattering, the impact ionization scattering and the surface roughness scattering are considered in our simulator. The effects of the substrate bias and the surface roughness scattering near the Si/SiO2 interface on the performance of bulk FinFET are mainly discussed in our work. Our results show that the on-current of bulk FinFET is sensitive to the surface roughness and that we can reduce the substrate leakage current by modulating the substrate bias voltage.
文摘在鳍型场效应晶体管(SOI FinFET)相关静电防护技术研究基础上,提出了一种新型的体区接触固定型绝缘体上硅鳍型场效应晶体管泄放钳位装置(Fix-base SOI FinFET Clamp)。该新型结构的器件解决了基区接触浮空在静电防护设计时引起的一系列问题,而且对正常的FinFET工艺具有良好的兼容性。通过计算机辅助工艺设计(TCAD)仿真论证了Fix-base SOI FinFET Clamp具有明显效果,详细阐述和讨论了SOI FinFET和Fix-base SOI FinFET Clamp工作状态下的电流和热分布。
文摘单粒子瞬态(SET)的电路仿真通常是注入双指数电流源来模拟,然而,纳米FinFET器件的SET采用单个双指数电流源模拟会带来较大误差。TCAD仿真结果较准确,但耗时较长,为了较为准确地电路仿真SET,提出了一种SET的复合双指数电流源模型。利用TCAD对电学特性校准的14 nm SOI FinFET器件的SET进行仿真,通过分析瞬态电流波形,对比双指数模型特点,提取特征参数,并利用遗传算法对模型参数进行优化处理,得到了关于线性能量转移(LET)的复合双电流源参数的解析模型。利用此复合双指数电流源模型与TCAD得到的瞬态电流波形、峰值和收集电荷量进行对比检验。结果显示,本文模型得到的SET电流波形与TCAD的基本吻合,与TCAD相比,模型的峰值电流的平均误差和最大误差分别为3.00%、5.06%;收集电荷量的平均误差和最大误差分别为4.02%、7.17%。
基金Project supported by the State Key Program of the National Natural Science of China (Grant No. 60836004)the National Natural Science Foundation of China (Grant Nos. 61076025 and 60906014)
文摘In this paper, we investigate the temperature and drain bias dependency of single event transient （SET） in 25-nm fin field-effect-transistor （FinFET） technology in a temperature range of 0-135 ℃ and supply voltage range of 0.4 V- 1.6 V. Technology computer-aided design （TCAD） three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135 ℃. The charge collected increases from 45.5 ℃ to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V. Furthermore, simulation results and the mechanism of temperature and bias dependency are discussed.
文摘In this paper the physical characteristics of FINFET (fin-field effect transistor) transistor behavior are investigated. For the analysis, semi-classical electron transfer method was used based on drift diffusion approximation by TCAD (Tiber CAD) software. Simulations show that the output resistance of FINFET along very small gate (gate length and fin height of 50 nm) is negative. The negative resistance is used in oscillators.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61574056 and 61204038)the Natural Science Foundation of Shanghai,China(Grant No.14ZR1412000)
文摘The conformal mapping of an electric field has been employed to develop an accurate parasitic capacitance model for nanoscale fin field-effect transistor（Fin FET） device. Firstly, the structure of the dual-layer spacers and the gate parasitic capacitors are thoroughly analyzed. Then, the Cartesian coordinate is transferred into the elliptic coordinate and the equivalent fringe capacitance model can be built-up by some arithmetical operations. In order to validate our proposed model, the comparison of statistical analysis between the proposed calculation and the 3D-TCAD simulation has been carried out, and several different material combinations of the dual-k structure have been considered. The results show that the proposed analytical model can accurately calculate the fringe capacitance of the Fin FET device with dual-k spacers.
基金This investigation and Jie Binbin have been supported by the CTSAH Associates (CTSA)founded by the late Linda Su-Nan Chang Sah,in memory of her 70th year.
文摘This paper reports the physical realization of the Bipolar Field-Effect Transistor （BiFET） and its onetransistor basic building block circuits. Examples are given for the one and two MOS gates on thin and thick, pure and impure base, with electron and hole contacts, and the corresponding theoretical current-voltage characteristics previously computed by us, without generation-recombination-trapping-tunneling of electrons and holes. These examples include the one-MOS-gate on semi-infinite thick impure base transistor （the bulk transistor） and the impurethin-base Silicon-on-Insulator （SOI） transistor and the two-MOS-gates on thin base transistors （the FinFET and the Thin Film Transistor TFF）. Figures are given with the cross-section views containing the electron and hole concentration and current density distributions and trajectories and the corresponding DC current-voltage characteristics.
