Optimizing Heat Sink Performance by Replacing Fins from Solid to Porous inside Various Enclosures Filled with a Hybrid Nanofluid

The current study generally aims to improve heat transfer in heat sinks by presenting a numerical analysis of natural convection of an enclosure with hot right and cool left walls,and thermally insulated top and bottom walls.The cold wall included configurations(half circle/half square)in various sizes(S=0.1,0.2,and 0.3),numbers(N=1,2,3,and 4),and locations(C=0.35,and 0.65).A heat sink is constructed of Aluminum attached to the hot wall,and composed of five fins with protrusions.Fins of the heat sink will be examined in a solid and porous structure.The enclosure is filled with a hybrid nanofluid of Nanoparticles(MWCNT and Fe3O4)and water.The current study utilized COMSOL Multiphysics software due to its efficacy in addressing scientific and technical challenges involving partial differential equations.The solving of the governing equations is achieved using the finite element method with various parameters:Rayleigh number(Ra=10^(3)–10^(6)),Darcy number(Da=10^(-2),10^(-3)),solid volume fraction(ϕ=0–0.06)to determine stream function,isotherms lines,and average Nusselt number(Nu).The results of numerical simulations show that heat sink with solid fins have a 97%higher stream function when Ra is raised from 10^(3) to 105.Whilst with porous fin heat sink,a stream function 96%for Da=10^(-3) and 94%for Da=10^(-2).Changing solid fins to porous increases stream functions by 9%at Da=10^(-3) and 20%at Da=10^(-2).It has been found that Ra increases Nu by 44%for solid fins and 50%for porous fins.Making solid fins porous increases Nu by 54%at Ra=10^(6).The high increase in the percentage of(Nu)indicates the importance of the improvement in heat transfer,and this distinguishes the results of the current study from previous studies.Nu values were found highest for(half square)compared to(half circle),with 2%increases for numbers,11.6%for sizes,and 11%for location.Solid volume fractions for all Ra at a solid-finned heat sink increased Nu by 23%.

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.

Planing process of fin heat sinks

Based on analyzing the traditional process to manufacture fin heat sinks(FHS) ,the production of FHS by the planing process was proposed ,the mechanism of the fins curl was investigated and the fins surface finish was analyzed . Through controlling chip curl based on the continuous strip chips ,flat straight fins were processed . Compared with the traditional processes ,this process makes full use of material and the processed FHS has better heat transfer capacity ,higher heat transfer efficiency and more reliability . The tool geometrical parameters and pro- cessing performance affect the fins curl . The opti mumprocessing parameters are :a cutter edge inclination angle of 0°,a rake angle between 50°and 55°,and a planing depth from 0 .2 mmto 0 .3 mm. The planing speed has little effect on the fins curl .

Experimental Verification of Model for Liquid-Cooled Staggered Pin Fin Heat Sinks with Top Bypass Flow

Pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow were experimentally evaluated. The authors considered liquid-cooling applications because there were few data available comparing to air-cooling applications. Empirical equations to predict heat transfer on the endwall were developed by obtaining experimental data on the copper base plate with acrylic pins. A new model for predicting pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow based on mass, momentum, and energy conservation within the two control volumes is proposed. The first control volume in the model is located within the finned area, and the second is located in the gap between the tip of the pins and the flow channel. This model combines two conditions according to the boundary-layer thickness. A comparison between experimental and calculated results revealed that dimensionless pressure drops and the Nusselt number could be predicted within 30% error for the former and 50% error for the latter.

Evaluation on Heat Transferring Performance of Fabric Heat Sink by Finite Element Modeling

Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of this new kind of heat sink. In this study,the finite element method (FEM) was used to predict the heat transferring performance of fabric heat sink under the condition of natural convection and forced convection, and its heat transferring performance was compared with that of pin fin heat sink. The results showed that in the condition of natural convection the heat transferring performance of pin fin heat sink was better than that of fabric heat sink, and vice versa under the forced convection condition.

Evaluation on Heat Transferring Performance of Fabric Heat Sink by Finite Element Modeling

Considering current technology limitation in manufacturing present pin fin heat sinks, a new fabric heat sink has been previously designed. However, there is a lack of an understanding of the heat transferring performance of this new kind of heat sink. Nowadays, finite element analysis has been generally developed for determining heat transfer from in-line and staggered pin fin heat sinks used in electronic packaging applications. In this study, this method is used to predict the heat transfer performance of the new heat sink with woven fabric structure, called fabric pin fin heat sink. Effect of the fin length and the material types made of heat sink on the thermal-structure response of the pin fin was investigated under forced convection. The results show that the minimum temperature of heat sink decreases with an increase of pin fin length,but the decreasing amplitude has decreased. Moreover, the heat transfer performance of fabric heat sink made of continuous carbon Fibers/Polymer (PPS) is worse than that of copper and of aluminum.

Heat Transfer Characteristics of Square Micro Pin Fins under Natural Convection

In order to comply with the recent demand for downsizing of the electric equipment, the minia- turization and the improvement in heat transfer performance of a heat sink under natural air-cooling are increasingly required. This paper describes the experimental and numerical investigations of heat sinks with miniature/micro pins and the effect of the pin size, pin height and the number of pins on heat transfer characteristics of heat sinks. Five types of basic heat sink models are investigated in this study. The whole heat transfer area of heat sinks having the different pin size, pin height and the number of pins respectively is kept constant. From a series of experiments and numerical analyses, it has been clarified that the heat sink temperature rises with increase in the number of pins. That is, the heat sink with miniaturized fine pins showed almost no effect on the heat transfer enhancement. This is because of the choking phenomenon occurred in the air space among the pin fins. Reflecting these results, it is confirmed that the heat transfer coefficient reduces with miniaturization of pins. Concerning the effects of the heat transfer area on the heat sink performance, almost the same tendency has been observed in other three series of large surface area, that is, higher pin height. Furthermore as a result of studying non-dimensional convection heat transfer performance, it was found that the relation between the Nusselt number (Nu) and the Rayleight number (Ra) is given by Nu = 0.16 Ra0.52.

Air Cooling of Mini-Channel Heat Sink in Electronic Devices

Heat transfer experiments were conducted to investigate the thermal performance of air cooling through mini-channel heat sink with various configurations. Two types of channels have been used, one has a rectangular cross section area of 5 × 18 mm2 and the other is triangular with dimension of 5 × 9 mm2. Four channels of each configuration have been etched on copper block of 40 mm width,30 mm height, and 200 mm length. The measurements were performed in steady state with air flow rates of 0.002 - 0.005 m3/s, heating powers of 80 - 200 W and channel base temperatures of 48°C, 51°C, 55°C and 60°C. The results showed that the heat transfer to air stream is increased with increasing both of air mass flow rate and channel base temperature. The rectangular channels have better thermal performance than trian- gular ones at the same conditions. Analytical fin approach of 1-D and 2-D model were used to predict the heat transfer rate and outlet air temperature from channels heat sink. Theoretical results have been compared with experimental data. The predicted values for outlet air temperatures using the two models agree well with a deviation less than ±10%. But for the heat transfer data, the deviation is about +30% to –60% for 1-D model, and –5% to –80% for 2-D model. The global Nusselt number of the present experimental data is empirically correlated as with accuracy of ±20% for and compared with other literature correlations.

大功率LED筒灯散热性能分析与优化

过热失效是大功率LED灯具的主要失效方式之一。文中采用流体分析软件Flo EFD对40 W大功率LED筒灯模型进行热分析,探讨了其散热结构的优化方向,并对比评估了蜂窝散热器、柱状散热器和翅片散热器3种模型的散热性能。研究结果表明,翅片散热器在3种模型中表现最佳,其散热效果主要受散热片厚度和间距的影响。通过优化散热器结构,可以有效提升大功率LED筒灯的散热效率,延长其使用寿命。

基于响应面的车用功率模块Pin-Fin优化设计

集成Pin-Fin散热器可以降低功率模块的结-流热阻,提升车用电机控制器的功率密度和可靠性,是车用功率模块先进热管理技术的发展趋势。然而,Pin-Fin散热器的设计面临电-热-流多物理场耦合的挑战,难于解析表征与定量优化,设计的周期长、成本高。基于响应面优化方法,该文提出一种集成Pin-Fin散热器的模型化设计方法,建立集成Pin-Fin形貌结构与阵列排布的数学描述,给出Pin-Fin散热器热-流性能的理论模型,建立Pin-Fin的多目标优化模型,获得Pin-Fin散热器结构的最优设计。为了验证理论模型和优化设计的可行性和有效性,搭建面对面变流器对拖实验平台,对标商业化车用功率模块的Pin-Fin设计,采用大量固定工况,以及实际车用工况实验结果,对比验证优化后的Pin-Fin能降低车用功率模块7.62%的结-流热阻,减小65%的功率模块损伤,提升车用电机控制器寿命1.8倍,为车用功率模块低热阻集成Pin-Fin散热器提供新的研究思路。

不同散热翅片结构下的芯片散热性能分析

为了缓解芯片热点散热问题,基于一种结合微通道和针翅形散热片的混合散热器,提出了3种具有不同截面形状翅片的微通道散热器,运用计算流体力学方法展开相关研究,分析了3种微通道散热器的背景区域和热点区域的温度场以及流场分布特性,选取散热器峰值温度、温差、压降和等效热阻作为性能参数,评估3种散热器的散热性能.结果表明,在4种冷却液入口流速(0.2 m·s^(-1)、0.4 m·s^(-1)、0.6 m·s^(-1)、0.8 m·s^(-1))下,圆柱形翅片的微通道散热器均呈现出最低的峰值温度、最小的温差和最低的等效热阻,以入口冷却液流速为0.2 m·s^(-1)为例,圆柱形、四棱柱形、三棱柱形翅片的微通道散热器热源面的最高温度分别为358 K、360 K、364 K,温差分别为21.3 K、22.1 K、23.7 K,说明圆柱形翅片具有最佳综合传热性能.

微小型毛细泵环热控制系统及其制造技术

针对当前微电子芯片高热流密度问题,设计一种微小型毛细泵吸环路(Capillary pumped loops,CPL)热控制系统。介绍制造该微小型CPL的方法:采用犁切—挤压成形微沟槽翅结构和刨削成形整体式翅片散热片,毛细吸液芯则采用商用多孔泡沫金属或丝网材料。该微小型CPL系统由蒸发器、冷凝器、蒸汽联管、液体联管以及液体工质组成。蒸发器中含有多尺度多维交错互通微沟槽翅强化沸腾结构,冷凝器为微沟槽翅结构与翅片散热片组成的复合结构,可有效提高系统蒸发冷凝效率。整个系统利用工质蒸发冷凝相变传热,通过毛细泵吸作用和蒸发气体压力保证循环,依靠饱和毛细芯对气体的阻碍作用保证工质的单向流动,无需机械泵和阀控制。

IGBT热管式整体翅片散热器优化分析

本文建立了IGBT热管散热器模型,并用实验数据验证所建立的三维热管散热器模型及基于有限体积法的数值模拟结果的可靠性,然后研究翅片厚度t和翅片间距s对散热器散热性能的影响。结果表明:数值模型可靠;当t由0.5 mm增至1 mm时整体翅片热管散热器的摩擦系数f增加45%,而传热因子j最大增加30%;当s由1.2 mm增至2 mm时散热器的摩擦系数f减小15%,而j的变化较小且s=1.2 mm时j的平均值最大。

高热流密度器件水冷散热器结构性能的实验研究

与平行流水冷散热相比,现阶段对喷射流水冷散热的研究报道较少。为了研究喷射流结构的散热效果,本文设计了两种喷射流结构的水冷散热器,搭建了以去离子水为冷却介质的液冷散热器实验台,调节实验的热流密度及冷却水流量在不同条件下观察芯片温度及散热器底板温度的变化,得到了不同热流密度下芯片温度、散热器底板温度及热阻随冷却水流量的变化规律。散热器内部针翅结构和冷却水流动方式的改变可使芯片温度降低5~8℃,散热器底板平均温度也相应降低4℃左右,且底板温度梯度较小。同时,热阻的变化随流量增大逐渐变缓,散热器结构改进使热阻减小了7%~8%。实验结果表明,改进结构的散热器能有效加强边角区域流体的扰动,提升散热器整体的换热效率,表明喷射流水冷散热是一种高效的散热方式。

流体横掠方形微针肋阵列热沉的传热特性

本文以去离子水为冷却工质,对流体横向冲刷方形微针肋阵列热沉的传热特性进行了实验研究.结果表明流体横掠微针肋热沉具有优越的换热特性。实验得出,冷却液的雷诺数对热沉的换热性能影响显著;总热阻随着泵功的增大而降低;对流换热热阻在总热阻中所占比例较小,流体吸热焓变热阻成为影响热沉性能的主导因素.

LED板状肋片散热器性能的方向效应

为考察装配板状肋片散热器的多角度照射型LED灯的自然对流散热性能的方向效应,以一款LED投光灯的关键散热结构为研究对象,采用实验测量法验证数值模拟的计算精度,并将数值模拟的温度和流体数据用于分析3种驱动电流和7个出光倾角下最大温升和温度均匀性的散热机制。结果表明:不同倾角下的散热器肋间风道内的流速分布的较大差异,是导致最大温升和温度均匀性变化的根本原因;最高温度点的上、下游流速的差值可用于定量解释温度均匀性的变化规律。不同倾角下肋片间距对最大温升的影响趋势表明:最佳间距附近的散热器性能对倾角的敏感度最高,散热能力的方向效应不容忽视。

大功率LED平板型翅片散热器的优化设计

针对一款阵列型大功率LED投光灯的散热特点,使用计算流体力学软件Icepak,仿真模拟其关键散热部分,并应用中心组合设计及响应面分析法对平板型散热器进行了优化;选取翅片高度、翅片间距和翅片厚度为3个响应因子,散热器的温度为响应值;运用Design Expert 8.06软件对数据进行分析和优化计算,得到了三因子与散热器温度的回归方程以及三因子之间相互作用的三维响应面图.结果表明:三因子的最佳取值为翅片高度23.92 mm,翅片间距5.99 mm,翅片厚度1.03 mm,在此条件下散热器温度为45.182 2℃,与Icepak模拟仿真值相比,误差仅为+0.575%;说明使用此方法求得平板型散热器优化的数学模型是可行的.

微/小圆柱针肋热沉传热特性

圆柱形微/小针肋热沉热阻由底板及微/小肋热传导热阻、冷却液与肋间对流换热热阻以及冷却液吸热焓变热阻等组成。以去离子水为冷却液,恒定热流下,进行了叉排排布的不同尺寸的微/小圆柱形针肋热沉的单相强制对流传热实验,实验Re为100～1000,加热功率为50～300 W。实验表明:微/小圆柱形针肋热沉的Nu随Re和加热功率的增大而增大,当Re=600时对应的Nu约为Re=200时Nu的2倍;热沉总热阻值随流体流量增大以指数形式降低并趋于恒定;微/小针肋高度对热沉的对流传热及总热阻值没有明显影响;Zukauskas关联式能预测实验结果。

大功率LED分段翅片散热器热设计

针对平板翅片式散热器存在的不足,提出一种分段翅片散热器。基于COMSOL Multiphysics平台,对不同分段数的分段翅片散热器的流动传热过程进行模拟。在此基础上,将Matlab模糊推理工具箱与Simulink相结合,对不同结构的散热器进行可靠性评估。最终得到分段数为4的散热器换热系数最大、可靠性最高、结构最佳,每段翅片长度、厚度、高度、翅片间距及分段间隔分别为29 mm,4 mm,40 mm,10 mm和3 mm。当入口风速由1 m/s增大到9 m/s,分段数为4翅片散热器的换热系数相对于平直翅片散热器提高了3.42%~5.47%,压降增大了31.60%~40.85%,可靠性提高了0.2。此研究为散热器结构的优化设计提供了理论依据和参考。

电子器件空气强制对流冷却研究

运用翅片开缝等设计思想,对电子器件空气冷却平片散热器中的翅片进行改进,并对连续平片、分段平片、分段开缝翅片等散热器进行了层流流动与换热的数值模拟.研究发现,在相同风扇泵功条件下,分段平片性能优于连续平片,开缝翅片优于分段平片.提出了一种适用于冷却要求更高的新型散热器,相比原散热器,新型散热器翅片间距和翅片厚度更小,翅片开缝且分段.初步研究表明,这种新型散热器在风扇功率足够的情况下,可以用于下一代热负荷更高的CPU,并讨论了常规的空气强制对流冷却的极限问题.