In this paper,the finite element calculation is applied to the analysis of stress inside the SMT solder joints.The effects of the solder joints'shape,the voids inside them and the quantity of solder on the mechani...In this paper,the finite element calculation is applied to the analysis of stress inside the SMT solder joints.The effects of the solder joints'shape,the voids inside them and the quantity of solder on the mechanical strength of the SMT solder joints are analyzed and compared This is essential to the design of the SMT solder joints and soldering techniques.展开更多
An average failure index method based on accurate FEA was proposed for the tensile strength prediction of composite out-of-plane adhesive-bonded π joints. Based on the simple and independent maximum stress failure cr...An average failure index method based on accurate FEA was proposed for the tensile strength prediction of composite out-of-plane adhesive-bonded π joints. Based on the simple and independent maximum stress failure criterion, the failure index was introduced to characterize the degree of stress components close to their corresponding material strength. With a brief load transfer analysis, the weak fillers were prominent and further detailed discussion was performed. The maximum value among the average failure indices which were related with different stress components was filtrated to represent the failure strength of the critical surface, which is either the two curved upside surfaces or the bottom plane of the fillers for composite π joints. The tensile strength of three kinds of π joints with different material systems, configurations and lay-ups was predicted by the proposed method and corresponding experiments were conducted. Good agreements between the numerical and experimental results give evidence of the effectiveness of the proposed method. In contrast to the existed time-consuming strength prediction methods, the proposed method provides a capability of quickly assessing the failure of complex out-of-plane joints and is easy and convenient to be widely utilized in engineering.展开更多
文摘In this paper,the finite element calculation is applied to the analysis of stress inside the SMT solder joints.The effects of the solder joints'shape,the voids inside them and the quantity of solder on the mechanical strength of the SMT solder joints are analyzed and compared This is essential to the design of the SMT solder joints and soldering techniques.
基金Funded by the National Natural Science Foundation of China(Nos.11372020 and 10902004)
文摘An average failure index method based on accurate FEA was proposed for the tensile strength prediction of composite out-of-plane adhesive-bonded π joints. Based on the simple and independent maximum stress failure criterion, the failure index was introduced to characterize the degree of stress components close to their corresponding material strength. With a brief load transfer analysis, the weak fillers were prominent and further detailed discussion was performed. The maximum value among the average failure indices which were related with different stress components was filtrated to represent the failure strength of the critical surface, which is either the two curved upside surfaces or the bottom plane of the fillers for composite π joints. The tensile strength of three kinds of π joints with different material systems, configurations and lay-ups was predicted by the proposed method and corresponding experiments were conducted. Good agreements between the numerical and experimental results give evidence of the effectiveness of the proposed method. In contrast to the existed time-consuming strength prediction methods, the proposed method provides a capability of quickly assessing the failure of complex out-of-plane joints and is easy and convenient to be widely utilized in engineering.
