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Technological parameters of stainless steel-aluminum alloy semisolid joining clad 被引量:1
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作者 刘洪伟 郭成 《Journal of Shanghai University(English Edition)》 CAS 2007年第5期510-513,共4页
By using semisolid joining technique, the bonding of stainless steel and semisolid aluminum alloy is successfully realized. The relationships between interfacial shear strength and solid fraction of aluminum alloy, bo... By using semisolid joining technique, the bonding of stainless steel and semisolid aluminum alloy is successfully realized. The relationships between interfacial shear strength and solid fraction of aluminum alloy, bonding pressure and time of keeping pressure were studied by the method of orthogonal experiment. The interfacial structure and the fracture structure of the bonding plate are studied by means of optical microscope (OM) and scanning electron microscope (SEM). The results show that there is the best solid fraction between the solid phase line and the liquid phase line of the semisolid aluminum alloy, with the increase of bonding pressure and pressure time, the interfacial shear strength increases rapidly, and then with further increase of bonding pressure and pressure time, the shear strength rises little. Along the interface, solid phase and liquid phase bond with stainless steel by turns because of the different diffusion ability. So, a new type of non-equilibrium diffusion interfacial structure is constructed at the interface of stainless steel and aluminum alloy, compound mechanism of plastic and brittle fracture interface was formed at the shear fracture interface. 展开更多
关键词 semisolid joining orthogonal experiment interfacial structure non-equilibrium diffusion compound fracturestructure.
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