The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To inve...The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.展开更多
A new group of lead-free piezoelectric ceramics,（Bi0.5 Na0.5）1-x（BaaSrb）xTiO3（abbreviated as BNBST[100x-100a/100b],0〈x〈1,a＋b=1）,was synthesized.The ceramics were prepared by conventional ceramic sintering tec...A new group of lead-free piezoelectric ceramics,（Bi0.5 Na0.5）1-x（BaaSrb）xTiO3（abbreviated as BNBST[100x-100a/100b],0〈x〈1,a＋b=1）,was synthesized.The ceramics were prepared by conventional ceramic sintering technique,and the ceramics with density of 95% of the theoretical one can be sintered without the atmosphere control during the sintering process.The results of the X-ray diffraction（XRD） data show that the ceramics possess a single perovskite phase.The measurements of dielectric and piezoelectric properties reveal that the ceramics provide relatively high piezoelectric charge constant d33 and high planar electromechanical coupling factor kp.For the BNBST6-95/5 ceramics,d33 is equal to 170pC/N,and kp is equal to 32.0%.The fabrication technique for these ceramics is conventional and stable.展开更多
Monodispersed Bi-Tenano arrays are achieved via template-free bipotentiostatic deposition. The diameter and length of individual nanorod is ~80 nm and ~250 nm respectively. The electrodeposition process is demonstrate...Monodispersed Bi-Tenano arrays are achieved via template-free bipotentiostatic deposition. The diameter and length of individual nanorod is ~80 nm and ~250 nm respectively. The electrodeposition process is demonstrated to follow a two-step mechanism: an instantaneous reductive potential is applied to form dispersive nuclei, then a reverse oxidative potential strips partial Bi atoms to prevent further cross-growth. Repeatedly, the nano arrays film is obtained eventually. The thermoelectric properties of the obtained Bi-Tenano arrays such as electrical resistance, carrier density, Seebeck coefficient and power factor are measured to be 2.438 × 10-4?Ω·m, 4.251 × 1020 cm-3, -25.892 μV·K-1, 2.750 × 10-6 W·m-1·K2, respectively.展开更多
文摘The effects of Bi addition on the growth of intermetallic compound (IMC) formation in Sn-3.8Ag-0.7Cu solder joints were investigated. The test samples were prepared by conventional surface mounting technology. To investigate the element diffusion and the growth kinetics of intermetallics formation in solder joint, isothermal aging test was performed at temperatures of 100, 150, and 190℃, respectively. The optical microscope (OM) and scanning electron microscope (SEM) were used to observe microstructure evolution of solder joint and to estimate the thickness and the grain size of the intermetallic layers. The IMC phases were identified by energy dispersive X-ray (EDX) and X-ray diffractometer (XRD). The results clearly show that adding about 1.0% Bi in Sn-Ag-Cu solder alloy system can refine the grain size of the IMC and inhibit the excessive IMC growth in solder joints, and therefore improve the reliability of the Pb-free solder joints. Through observation of the microstructural evolution of the solder joints, the mechanism of inhibition of IMC growth due to Bi addition was proposed.
文摘A new group of lead-free piezoelectric ceramics,（Bi0.5 Na0.5）1-x（BaaSrb）xTiO3（abbreviated as BNBST[100x-100a/100b],0〈x〈1,a＋b=1）,was synthesized.The ceramics were prepared by conventional ceramic sintering technique,and the ceramics with density of 95% of the theoretical one can be sintered without the atmosphere control during the sintering process.The results of the X-ray diffraction（XRD） data show that the ceramics possess a single perovskite phase.The measurements of dielectric and piezoelectric properties reveal that the ceramics provide relatively high piezoelectric charge constant d33 and high planar electromechanical coupling factor kp.For the BNBST6-95/5 ceramics,d33 is equal to 170pC/N,and kp is equal to 32.0%.The fabrication technique for these ceramics is conventional and stable.
文摘Monodispersed Bi-Tenano arrays are achieved via template-free bipotentiostatic deposition. The diameter and length of individual nanorod is ~80 nm and ~250 nm respectively. The electrodeposition process is demonstrated to follow a two-step mechanism: an instantaneous reductive potential is applied to form dispersive nuclei, then a reverse oxidative potential strips partial Bi atoms to prevent further cross-growth. Repeatedly, the nano arrays film is obtained eventually. The thermoelectric properties of the obtained Bi-Tenano arrays such as electrical resistance, carrier density, Seebeck coefficient and power factor are measured to be 2.438 × 10-4?Ω·m, 4.251 × 1020 cm-3, -25.892 μV·K-1, 2.750 × 10-6 W·m-1·K2, respectively.
