Cu/Ti3AlC2 composite and functional-gradient materials with excellent electrical conductivity and thermal conductivity as well as good flexural properties were prepared by low-temperature spark plasma sintering of Cu ...Cu/Ti3AlC2 composite and functional-gradient materials with excellent electrical conductivity and thermal conductivity as well as good flexural properties were prepared by low-temperature spark plasma sintering of Cu and Ti3AlC2 powder mixtures. The phase compositions of the materials were analyzed by X-ray diffraction, and their microstructure was characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. Further, the electrical conductivity, thermal conductivity, and flexural properties of the materials were tested. Results show that, for the composite materials, the resistivity rises from 0.75 × 10^-7 Ω·m only to 1.32 × 10^-7 Ω·m and the thermal diffusivity reduces from 82.5 mm^2/s simply to 39.8 mm^2/s, while the flexural strength improves from 412.9 MPa to 471.3 MPa, as the content of Ti3AlC2 is increased from 5 wt%to 25 wt%. Additionally, the functional-gradient materials sintered without interface between the layers exhibit good designability, and their overall electrical conductivity, thermal conductivity, and flexural strength are all higher than those of the corresponding uniform composite material.展开更多
The microstructure and the electrical, thermal, friction, and mechanical properties of Cu/Ti_2AlC fabricated by hot-pressing at 900 ℃ for 1 h were investigated in the present work. Microstructural observations have s...The microstructure and the electrical, thermal, friction, and mechanical properties of Cu/Ti_2AlC fabricated by hot-pressing at 900 ℃ for 1 h were investigated in the present work. Microstructural observations have shown that the plate-like Ti_2AlC grains distribute irregularly in the network of Cu grains, and well-structured, crack-free bonds between the layers. With the increase in the content of Ti_2AlC from layer A to layer D, the electrical resistivity increases from 1.381×10^（-7）Ω·m to 1.918 ×10^（-7）Ω·m, the hardness increases from about 980.27 MPa to about 2196.01 MPa, and the friction coefficient from above 0.20 reduces to about 0.15. Oxidation rate increases with the increases of temperature. Exfoliation was obviously observed on the surface of oxidation layer A. The surface of layer D was still intact and the spalling and other defects were not found. The mass decreases in the acid solution, and increases in the alkaline solution. The largest corrosion rate is found in 6.5% HNO_3 or 4% Na OH solution.展开更多
基金Funded by he National Natural Science Foundation of China(51402097)the Open Foundation of Hubei Provincial Key Laboratory of Green Materials for Light Industry(201806A04)the College Students Innovation and Entrepreneurship Training Program of Hubei University of Technology(201810500151)
文摘Cu/Ti3AlC2 composite and functional-gradient materials with excellent electrical conductivity and thermal conductivity as well as good flexural properties were prepared by low-temperature spark plasma sintering of Cu and Ti3AlC2 powder mixtures. The phase compositions of the materials were analyzed by X-ray diffraction, and their microstructure was characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy. Further, the electrical conductivity, thermal conductivity, and flexural properties of the materials were tested. Results show that, for the composite materials, the resistivity rises from 0.75 × 10^-7 Ω·m only to 1.32 × 10^-7 Ω·m and the thermal diffusivity reduces from 82.5 mm^2/s simply to 39.8 mm^2/s, while the flexural strength improves from 412.9 MPa to 471.3 MPa, as the content of Ti3AlC2 is increased from 5 wt%to 25 wt%. Additionally, the functional-gradient materials sintered without interface between the layers exhibit good designability, and their overall electrical conductivity, thermal conductivity, and flexural strength are all higher than those of the corresponding uniform composite material.
基金The Open Foundation of Hubei Provincial Key Laboratory of Green Material for Light Industry(No.(2013)2-general project-9)the Key Project of Education Department of Hubei(No.D20131406)the National Natural Science Foundation of China(No.51302073)
文摘The microstructure and the electrical, thermal, friction, and mechanical properties of Cu/Ti_2AlC fabricated by hot-pressing at 900 ℃ for 1 h were investigated in the present work. Microstructural observations have shown that the plate-like Ti_2AlC grains distribute irregularly in the network of Cu grains, and well-structured, crack-free bonds between the layers. With the increase in the content of Ti_2AlC from layer A to layer D, the electrical resistivity increases from 1.381×10^（-7）Ω·m to 1.918 ×10^（-7）Ω·m, the hardness increases from about 980.27 MPa to about 2196.01 MPa, and the friction coefficient from above 0.20 reduces to about 0.15. Oxidation rate increases with the increases of temperature. Exfoliation was obviously observed on the surface of oxidation layer A. The surface of layer D was still intact and the spalling and other defects were not found. The mass decreases in the acid solution, and increases in the alkaline solution. The largest corrosion rate is found in 6.5% HNO_3 or 4% Na OH solution.
