Orientation dependence of mechanically induced grain boundary migration in nano-grained copper

Tensile tests were carried out on gradient nanograined copper samples to investigate the grain orientation dependence of mechanically induced grain boundary migration(GBM) process. The relationship between GBM and the orientations of nanograins relative to loading direction was established by using electron backscatter diffraction. GBM is found to be more pronounced in the grains with higher Schmid factors where dislocations are easier to slip. As a result, the fraction of high angle grain boundaries decreases and that of low angle grain boundaries increases after GBM.

Suppression of grain boundary migration at cryogenic temperature in an extremely fine nanograined Ni-Mo alloy

Microindentation creep tests on an electrodeposited extremely fine(4.9 nm) nanograined(ng) Ni-14.2 at.% Mo(Ni-14.2 Mo) at both room temperature(RT) and liquid nitrogen temperature(LNT) demonstrated that lowering temperature retarded softening in the ng Ni-Mo alloy. The obtained strain rate sensitivity at LNT was one order of magnitude lower than that at RT. Microstructural characterization revealed that mechanically-driven grain boundary(GB) migration was greatly suppressed by lowering temperature,which might be ascribed to the presence of solute Mo atoms that significantly retarded coupled GB motion at LNT. Deformation was instead carried by shear bands.

Shock-induced migration of asymmetry tilt grain boundary in iron bicrystal: A case study of Σ3 [110]

Many of our previous studies have discussed the shock response of symmetrical grain boundaries in iron bicrystals.In this paper, the molecular dynamics simulation of an iron bicrystal containing Σ3 [110] asymmetry tilt grain boundary(ATGB) under shock-loading is performed. We find that the shock response of asymmetric grain boundaries is quite different from that of symmetric grain boundaries. Especially, our simulation proves that shock can induce migration of asymmetric grain boundary in iron. We also find that the shape and local structure of grain boundary(GB) would not be changed during shock-induced migration of Σ3 [110] ATGB, while the phase transformation near the GB could affect migration of GB. The most important discovery is that the shock-induced shear stress difference between two sides of GB is the key factor leading to GB migration. Our simulation involves a variety of piston velocities, and the migration of GB seems to be less sensitive to the piston velocity. Finally, the kinetics of GB migration at lattice level is discussed. Our work firstly reports the simulation of shock-induced grain boundary migration in iron. It is of great significance to the theory of GB migration and material engineering.

Coordinated grain boundary deformation governed nanograin annihilation in shear cycling

Grain growth and shrinkage are essential to the thermal and mechanical stability of nanocrystalline metals,which are assumed to be governed by the coordinated deformation between neighboring grain boundaries(GBs)in the nanosized grains.However,the dynamics of such coordination has rarely been reported,especially in experiments.In this work,we systematically investigate the atomistic mechanism of coordinated GB deformation during grain shrinkage in an Au nanocrystal film through combined stateof-the-art in situ shear testing and atomistic simulations.We demonstrate that an embedded nanograin experiences shrinkage and eventually annihilation during a typical shear loading cycle.The continuous grain shrinkage is accommodated by the coordinated evolution of the surrounding GB network via dislocation-mediated migration,while the final grain annihilation proceeds through the sequential dislocation-annihilation-induced grain rotation and merging of opposite GBs.Both experiments and simulations show that stress distribution and GB structure play important roles in the coordinated deformation of different GBs and control the grain shrinkage/annihilation under shear loading.Our findings establish a mechanistic relation between coordinated GB deformation and grain shrinkage,which reveals a general deformation phenomenon in nanocrystalline metals and enriches our understanding on the atomistic origin of structural stability in nanocrystalline metals under mechanical loading.

Significant annealing-induced hardening effect in nanolaminate d-nanotwinne d(CrCoNi)_(97.4)Al_(0.8)Ti_(1.8)me dium-entropy alloy by severe cold rolling

Due to the easy coarsening caused by poor thermal stability,the verified annealing-induced hardening in nanograined metals can only maintain at a relatively low-temperature range.In this study,a nanolam-inated(CrCoNi)_(97.4)Al_(0.8)Ti_(1.8)medium-entropy alloy with an average lamellae thickness of∼20 nm embedded by thinner nanotwins was fabricated by severe cold rolling to achieve superior thermal stability.Compared with the conventional nanotwinned CrCoNi with nanotwins inside ultra-fined grains,the hier-archical nanolaminated-nanotwinned(CrCoNi)97.4 Al 0.8 Ti 1.8 exhibits a significant annealing-induced hard-ening effect,i.e.,hardness increasing from∼250 HV in the original specimen to∼500 HV in the cold-rolled status and finally∼630 HV after annealing at 600℃for 1 h.Detailed microstructure characterizations reveal that the reduced dislocation density and formation of L1_(2)ordered domain are mainly responsible for such hardening effect,which is facilitated by the effectively suppressed coarsening with annealing temperature,i.e.,slow detwinning process and well-retained low-angle nanolamellar structure.The coarsening mechanisms from the cold-rolled nanolamellae to the fully recrystallized micro-equiaxed structures under the annealing temperatures ranging from 400 to 800℃were also elucidated by atomic observations.

Morphology and orientation evolution of Cu_(6)Sn_(5)grains on(001)Cu and(011)Cu single crystal substrates under temperature gradient

The morphology and orientation evolution of Cu_(6)Sn_(5)grains formed on(001)Cu and(011)Cu single crystal substrates under temperature gradient(TG)were investigated.The initial orientated prism-type Cu_(6)Sn_(5)grains transformed to non-orientated scallop-type after isothermal reflow.However,the Cu_(6)Sn_(5)grains with strong texture were revealed on cold end single crystal Cu substrates by imposing TG.The Cu_(6)Sn_(5)grains on(001)Cu grew along their c-axis parallel to the substrate and finally merged into one grain to form a fully IMC joint,while those on(011)Cu presented a strong texture and merged into a few dominant Cu_(6)Sn_(5)grains showing about 30°angle with the substrate.The merging between neighboring Cu_(6)Sn_(5)grain pair was attributed to the rapid grain growth and grain boundary migration.Accordingly,a model was put forward to describe the merging process.The different morphology and orientation evolutions of the Cu_(6)Sn_(5)grains on single crystal and polycrystal Cu substrates were revealed based on crystallographic relationship and Cu flux.The method for controlling the morphology and orientation of Cu_(6)Sn_(5)grains is really benefitial to solve the reliability problems caused by anisotropy in 3 D packaging.

A general mechanism of grain growth-Ⅰ.Theory

The behaviors of grain growth dominate the formation of the microstructure inside polycrystalline materials and thus strongly influence their practical performances.However,grain growth behaviors still remain ambiguous and thus lack a mathematical formula to describe the general evolution despite decades of efforts.Here,we propose a new migration model of grain boundary(GB)and further derive a mathematical expression to depict the general evolution of grain growth in the cellular structures.The expression incorporates the variables influencing growth rate(e.g.GB features,grain size and local grain size distribution)and thus reveals how the normal,abnormal and stagnant behaviors of grain growth occur in polycrystalline systems.In addition,our model correlates quantitatively GB roughening transition with grain growth behavior.The general growth theory may provide new insights into the GB thermodynamics and kinetics during the cellular structure evolution.