Sintering behavior and thermal conductivity of nickel-coated graphite flake/copper composites fabricated by spark plasma sintering

Nickel-coated graphite flakes/copper（GN/Cu） composites were fabricated by spark plasma sintering with the surface of graphite flakes（GFs） being modified by Ni–P electroless plating. The effects of the phase transition of the amorphous Ni–P plating and of Ni diffusion into the Cu matrix on the densification behavior, interfacial microstructure, and thermal conductivity（TC） of the GN/Cu composites were systematically investigated. The introduction of Ni–P electroless plating efficiently reduced the densification temperature of uncoated GF/Cu composites from 850 to 650℃ and slightly increased the TC of the X–Y basal plane of the GF/Cu composites with 20 vol%–30 vol% graphite flakes. However, when the graphite flake content was greater than 30 vol%, the TC of the GF/Cu composites decreased with the introduction of Ni–P plating as a result of the combined effect of the improved heat-transfer interface with the transition layer, P generated at the interface, and the diffusion of Ni into the matrix. Given the effect of the Ni content on the TC of the Cu matrix and on the interface thermal resistance, a modified effective medium approximation model was used to predict the TC of the prepared GF/Cu composites.

Fabrication of superaligned carbon nanotubes reinforced copper matrix laminar composite by electrodeposition

A new kind of laminar metal matrix nanocomposite（MMC） was fabricated by an electrodeposition process with copper and superaligned carbon nanotubes film（SACNT film）.The SACNT film was put on a titanium plate and then a layer of copper was electrodeposited on it.By repeating the above process,the laminar Cu/SACNT composite which contains dozens or hundreds of layers of copper and SACNT films was obtained.The thickness of a single copper layer was controlled by adjusting the process parameter easily and the thinnest layer is less than 2 μm.The microscopic observation shows that the directional alignment structure of SACNT is retained in the composite perfectly.The mechanical and electrical properties testing results show that the tensile and yield strengths of composites are improved obviously compared with those of pure copper,and the high conductivity is retained.This technology is a potential method to make applicable MMC which characterizes high volume fraction and directional alignment of carbon nanotubes.

Development of Cu-Exfoliated Graphite Nanoplatelets (xGnP) Metal Matrix Composite by Powder Metallurgy Route

In the present investigation the possibility of using exfoliated graphite nanoplatelets (xGnP) as reinforcement in order to enhance the mechanical properties of Cu-based metal matrix composites is explored. Cu-based metal matrix composites reinforced with different amounts of xGnP were fabricated by powder metallurgy route. The microstructure, sliding wear behaviour and mechanical properties of the Cu-xGnP composites were investigated. xGnP has been synthesized from the graphite intercalation compounds (GIC) through rapid evaporation of the intercalant at an elevated temperature. The thermally exfoliated graphite was later sonicated for a period of 5 h in acetone in order to achieve further exfoliation. The xGnP synthesized was characterized using SEM, HRTEM, X-ray diffraction, Raman spectroscopy and Fourier transform infrared spectroscopy. The Cu and xGnP powder mixtures were consolidated under a load of 565 MPa followed by sintering at 850°C for 2 h in inert atmosphere. Cu-1, 2, 3 and 5 wt% xGnP composites were developed. Results of the wear test show that there is a significant improvement in the wear resistance of the composites up to addition of 2 wt% of xGnP. Hardness, tensile strength and strain at failure of the various Cu-xGnP composites also show improvement upto the addition of 2 wt% xGnP beyond which there is a decrease in these properties. The density of the composites decreases with the addition of higher wt% of xGnP although addition of higher wt% of xGnP leads to higher sinterability and densification of the composites, resulting in higher relative density values. The nature of fracture in the pure Cu as well as the various Cu-xGnP composites was found to be ductile. Nanoplatelets of graphite were found firmly embedded in the Cu matrix in case of Cu-xGnP composites containing low wt% of xGnP.

Fabrication and thermal conductivity of copper matrix composites reinforced by tungsten-coated carbon nanotubes

Carbon nanotubes （CNTs） were coated by tungsten using metal organic chemical vapor deposition. Magnetic stirring was employed to disperse the W-coated CNTs （W-CNTs） in a Cu matrix, and then, the mixed powders were consolidated by spark plasma sintering. The W-CNTs obtained a uniform dispersion within the Cu matrix when the W-CNT content was less than 5.0vo1%, but high content of W-CNTs （10vol%） resulted in the presence of clusters. The W-CNT/Cu composites containing low content of W-CNTs （〈5.0vol%） exhibited a higher thermal conductivity than the sintered pure Cu, while the CNT/Cu composites exhibited no increase in thermal conductivity after the incorporation of uncoated CNTs. The W-CNT content was found to play a crucial role in determining the thermal conductivity of the W-CNT/Cu composites. The thermal conductivity of the W-CNT/Cu composites increased first and then decreased with the W-CNT content increasing. When the W-CNT content was 2.5vo1%, the W-CNT/Cu composite obtained the maximum value of thermal conductivity. The thermal resistance of the （W-CNT）-Cu interface was predicted in terms of Maxwell-Gamett effective medium approximation, and its calculated value was about 3.0× 10-9 m2.K.W-l.

Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy:preparation, performance, and mechanisms

Copper matrix composites doped with ceramic particles are known to effectively enhance the mechanical properties,thermal expansion behavior and high-temperature stability of copper while maintaining high thermal and electrical conductivity.This greatly expands the applications of copper as a functional material in thermal and conductive components,including electronic packaging materials and heat sinks,brushes,integrated circuit lead frames.So far,endeavors have been focusing on how to choose suitable ceramic components and fully exert strengthening effect of ceramic particles in the copper matrix.This article reviews and analyzes the effects of preparation techniques and the characteristics of ceramic particles,including ceramic particle content,size,morphology and interfacial bonding,on the diathermancy,electrical conductivity and mechanical behavior of copper matrix composites.The corresponding models and influencing mechanisms are also elaborated in depth.This review contributes to a deep understanding of the strengthening mechanisms and microstructural regulation of ceramic particle reinforced copper matrix composites.By more precise design and manipulation of composite microstructure,the comprehensive properties could be further improved to meet the growing demands of copper matrix composites in a wide range of application fields.

Effect of graphite powder as a forming filler on the mechanical properties of SiCp/Al composites by pressure infiltration

（38vo1% SiCp ＋ 2vo1% A1203f）/2024 A1 composites were fabricated by pressure infiltration. Graphite powder was introduced as a forming filler in preform preparation, and the effects of the powder size on the microstructures and mechanical properties of the final com- posites were investigated. The results showed that the composite with 15 μm graphite powder as a forming filler had the maximum tensile strength of 506 MPa, maximum yield strength of 489 MPa, and maximum elongation of 1.2%, which decreased to 490 MPa, 430 MPa, and 0.4%, respectively, on increasing the graphite powder size from 15 to 60 μm. The composite with 60 μm graphite powder showed the highest elastic modulus, and the value decreased from 129 to 113 GPa on decreasing the graphite powder size from 60 to 15 μm. The differences between these properties are related to the different microstructures of the corresponding composites, which determine their failure modes.

Microstructure and properties of copper matrix composites reinforced by nano-SiC and nano-Al_2O_3 particles

Copper/silicon carbide composites （Cu/SiC） and copper/alumina composites （Cu/Al2O3） were fabricated by the powder metallurgy method. The influence of reinforcement particles contents on the relevant properties of the composites and the microstructure of Cu/SiC and Cu/Al2O3 composites were studied. The reinforcement effects of nano-SiC and nano-Al2O3 particles were compared. The experimental results show that with the increase of the amount of nano-SiC and nano-Al2O3 particles, the density of the both composites decreases, the resistivity increases, whereas the hardness increases firstly and then drops. The softening temperatures of the composites are above 700℃ which is far higher than that of the pure copper, leading to the improvement of the thermal stability of the composites at high temperatures. Considering all factors, the reinforcement effects of nano-SiC are better than those of nano-Al2O3 when their contents are the same in the copper matrix.

Microstructures and wear properties of graphite and Al_2O_3 reinforced AZ91D-Cex composites

The magnesium matrix composites reinforced by graphite particles and Al2O3 short fibers were fabricated by squeeze-infiltration technique.The additions dispersed uniformly and no agglomeration and casting defect were observed.The microstructures and wear properties of the composites with different Ce contents of 0,0.4%,0.8%and 1.0%,respectively,were investigated.Especially,the effect of Ce on the properties was discussed.The results reveal that Ce enriches around the boundaries of graphite particles and forms Al3Ce phase with Al.The addition of Ce refines the microstructures of the composites.With the increase of Ce content,the grain size becomes smaller and the wear resistance of the composite is improved.At low load,the composites have similar worn surface.At high load,the composite with 1.0%Ce has the best wear resistance due to the existence of Al3Ce phase.The Al3Ce phase improves the thermal stability of the matrix so the graphite particles can keep intact,which can still work as lubricant. At low load,the wear mechanism is abrasive wear and oxidation wear.At high load,the wear mechanism changes to delamination wear for all the composites.

Synergistic regulation of current-carrying wear performance of resin matrix carbon brush composites with tungsten copper composite powder

Resin matrix carbon brush composites(RMCBCs)are critical materials for high-powered electric tools.However,effectively improving their wear resistance and heat dissipation remains a challenge.RMCBCs prepared with flake graphite powders that were evenly loaded with tungsten copper composite powder(RMCBCs-W@Cu)exhibited a low wear rate of 1.63 mm^(3)/h,exhibiting 48.6%reduction in the wear rate relative to RCMBCs without additives(RMCBCs-0).In addition,RMCBCs-W@Cu achieved a low friction coefficient of 0.243 and low electric spark grade.These findings indicate that tungsten copper composite powders provide particle reinforcement and generate a gradation effect for the epoxy resin(i.e.,connecting phase)in RMCBCs,which weakens the wear of RMCBCs caused by fatigue under a cyclic current-carrying wear.

Effect of graphite content on wear property of graphite/Al_2O_3/Mg-9Al-1Zn-0.8Ce composites

Using squeeze-infiltration technique, Mg-9Al-1Zn-0.8Ce composite reinforced by graphite particles and Al2O3 short fibers was fabricated. The reinforcing phases combined closely with the matrix and no agglomeration was observed. The microstructure, hardness and wear property of the composites with the graphite content of 5%, 10%, 15% and 20% were investigated, respectively. The results reveal that Ce tends to enrich around the boundaries of graphite particles and Al2O3 short fibers, and forms Al3Ce phase. When the graphite content increases to 20%, the grain size becomes small. Moreover, with increasing the graphite content, the microhardness of the composites decreases but the wear resistance increases. The graphite which works as lubricant during dry sliding process decreases the wear loss. At low load, the wear mechanism of the composite is mainly abrasive wear and oxidation wear; at high load, except that the composite with 20% graphite is still with abrasive wear and oxidation wear, the wear mechanism of other composites changes to delamination wear.

Effect of graphite particle size on wear property of graphite and Al_2O_3 reinforced AZ91D-0.8%Ce composites

The graphite particles and Al_2O_3 short fibers reinforced AZ91D-0.8%Ce composites were fabricated by squeeze-infiltration technique.The researches about the effects of different graphite particle sizes on the microstructure and wear property of the composites were performed under the condition of constant contents of graphite particles and Al_2O_3 short fibers.The results reveal that the grain size of the composites changes less when the graphite particle size descends.Moreover,Ce enriches around the graphite particle and Al_2O_3 short fibers and forms Al_3Ce phase with A1 element.The graphite that works as lubricant decreases the wear loss.The wear resistance of the composites increases as the graphite particle size increases.At low load the composites have similar wear loss;at high load the composite with the largest graphite particle size has the best wear resistance.The wear mechanism of all the composites at low load is abrasive wear and oxidation wear;at high load,except the composites with the particle size of 240μm whose wear mechanism is still abrasive wear and oxidation wear,the wear mechanism of others changes to delamination wear.

Thermo-physical Properties of Continuous Carbon Fiber Reinforced Copper Matrix Composites

Continuous carbon fiber reinforced copper matrix composites with 70%(volume fraction) of carbon fibers prepared by squeeze casting technique have been used for investigation of the coefficient of thermal expansion(CTE) and thermal conductivity.Thermo-physical properties have been measured in both,longitudinal and transversal directions to the fiber orientation.The results showed that Cf/Cu composites may be a suitable candidate for heat sinks because of its good thermo-physical properties e.g.the low CTE(4.18×10-6/K) in longitudinal orientation and(14.98×10-6/K) in transversal orientation at the range of 20-50℃,a good thermal conductivity(87.2 W/m·K) in longitudinal orientation and(58.2 W/m·K) in transversal orientation.Measured CTE and thermal conductivity values are compared with those predicted by several well-known models.Eshelby model gave better results for prediction of the CTE and thermal conductivity of the unidirectional composites.

Thermal conductivity of diamond/copper composites with a bimodal distribution of diamond particle sizes prepared by pressure infiltration method

The thermal conductivity of diamond/copper composites with bimodal particle sizes was studied. The composites were prepared through pressure infiltration of liquid copper into diamond preforms with a mixture of 40 and 100 pm-size diamonds. The permeability of the preforms with different coarse-to-fine volume ratios of diamonds was investigated. The thermal conductivity of the diamond/copper composites with bimodal size distribution was compared to the theoretical value derived from an analytical model developed by Chu. It is predicted that the diamond/copper composites could reach a higher thermal conductivity and their surface roughness could be improved by applying bimodal diamond particle sizes.

Effect of aluminum borate whisker coating on interface and mechanical properties of 6061Al matrix composites

Copper coating was deposited on the surface of aluminum borate whisker by an electroless plating method.This method was used to modify the interfacial property of squeeze-casting aluminum borate whisker reinforced 6061Al matrix composite.Interface observation indicates that the spinel reaction(MgAl2O4) is hindered by the copper coating,and the difference in interfacial reaction degree affects the tensile property and aging behavior of the composite.For the composite with less spinel reaction(MgAl2O4),its peak-aging process are postponed due to less depletion of magnesium.On the fracture surface of copper-coated composite dimples and fractures of whiskers are more,but on the fracture surface of uncoated composite pull-out of whiskers are more than that on the coated one.In uncoated composite the fracture generally originates from the near-interface-region.

Significant strengthening of copper-based composites using boron nitride nanotubes

Nanotubes, such as boron nitride nanotubes (BNNTs) and carbon nanotubes (CNTs), exhibit excellent mechanical properties. In this work, high-quality BNNTs were synthesized by ball milling and annealing. Subsequently, well-dispersed 3vol%BNNTs/Cu and 3vol%CNTs/Cu composites were successfully prepared using ball milling, spark plasma sintering, and followed by hot-rolling. Moreover, the mechanical properties and strengthening mechanisms of BNNTs/Cu and CNTs/Cu composites were compared and discussed in details. At 293 K,both BNNTs/Cu and CNTs/Cu composites exhibited similar ultimate tensile strength (UTS) of~404 MPa, which is approximately 170%higher than pure Cu. However, at 873 K, the UTS and yield strength of BNNTs/Cu are 27%and 29%higher than those of CNTs/Cu, respectively.This difference can be attributed to the stronger inter-walls shear resistance, higher thermomechanical stability of BNNTs, and stronger bonding at the BNNTs/Cu interface as compared to the CNTs/Cu interface. These findings provide valuable insights into the potential of BNNTs as an excellent reinforcement for metal matrix composites, particularly at high temperature.

Microstructure and damping behavior of SiC_p/Gr/2024Al metal matrix composites by squeeze casting technology

SiCp/Gr/2024Al metal matrix composites were processed by squeeze casting technology. The microstructure of composites was observed by SEM and TEM, and the effects of graphite particulates and SiC particulates on the damping behaviors of composites were also investigated. The results show that the microstructure of composites was dense and homogeneous, without any interfacial reactivity among reinforcement/matrix interfaces. Compared with the damping capacity of 2024A1, the damping capacity of composites was enhanced significantly by addition of SiC or graphite particulates. The main damping mechanisms of SiCp/Al composites were ascribed to the dislocation damping, and those of SiCp/Gr/2024Al were attributed to the intrinsic damping and interface damping.

Synthesis and Tribological Properties of Copper-alumina Nanocomposites Prepared by Coprecipitation Technique

The objective of this work is to study the synthesis of copper-alumina nanocomposites using the coprecipitation process and hot-pressing method, and investigate their mechanical properties. The effects of calcination temperature on the average size of composite particles and chemical composition after calcination were also analyzed. The sintering parameters including sintering temperature, hot pressure and packing time were optimized to fabricate the alumina nanoparticles reinforced copper matrix composites（CMCs）. The density, microhardness and tribological properties of the CMCs reinforced with 1 wt%, 2 wt%, 3 wt%, 4 wt% and 5 wt% of alumina nanoparticles were investigated correspondingly. The results showed that the optimum preparation parameters for the CMCs were 900 ℃ of hot pressing temperature, 27.5 MPa of hot pressure and 2 hrs of packing time. The CMC reinforced with 2 wt% of alumina nanoparticles had the lowest wear rate, with the relative wear resistance of 3.13.

Selective interfacial bonding and thermal conductivity of diamond/Cu-alloy composites prepared by HPHT technique

Cu-based and Cu-alloy-based diamond composites were made by high-pressure-high-temperature （HPHT） sintering with the aim of maximizing the thermal conductivity of the composites. Improvements in interfacial bonding strength and thermo-physical properties of the composites were achieved using an atomized copper alloy with minor additions of Co, Cr, 13, and Ti. The thermal conductivity （TC） oh- mined exhibited as high as 688 W.m-1.K-1, but also as low as 325 W.m-1.K-l. A large variation in TC can be rationalized by the discrepancy of diamond-matrix interfacial bonding. It was found from fractography that preferential bonding between diamond and the Cu-alloy matrix occurred only on the diamond {100} faces. EDS analysis and Raman spectra suggested that selective interfacial bonding may be attributed to amorphous carbon increasing the wettability between diamond and the Cu-alloy matrix. Amorphous carbon was found to significantly affect the TC of the composite by interface modification.