In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is...In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.展开更多
The effectiveness of carbon fiber reinforced polymer（CFRP） grids as the strengthening materials for a pre-damaged scaled tunnel model is experimentally investigated. First, the bond performances between the CFRP gri...The effectiveness of carbon fiber reinforced polymer（CFRP） grids as the strengthening materials for a pre-damaged scaled tunnel model is experimentally investigated. First, the bond performances between the CFRP grid and the concrete under different types of adhesive and surface treatment were tested. The most efficient anchoring system was adopted for the subsequent scaled tunnel strengthening. Test results show that when the epoxy structural adhesive was used as the bonding material, the failure mode was CFRP grids rupturing,and the anchorage performance was optimal. When the polymer mortar was used as the adhesive, the surface treatments with anchored bolts and grooves can improve the bond performance, and the failure mode was sliding failure with the polymer mortar peeled off. After strengthening with CFRP grids, both the stiffness and the load capacity of the pre-damaged scaled tunnel model were improved. Additionally,the results obtained by fiber bragg grating（FBG） sensors indicate that the strains across tunnel segments were reduced,and the overall performance of the tunnel was improved.展开更多
文摘In spacecraft electronic devices,the deformation of solder balls within ball grid array(BGA)packages poses a significant risk of system failure.Therefore,accurately measuring the mechanical behavior of solder balls is crucial for ensuring the safety and reliability of spacecraft.Although finite element simulations have been extensively used to study solder ball deformation,there is a significant lack of experimental validation,particularly under thermal cycling conditions.This is due to the challenges in accurately measuring the internal deformations of solder balls and eliminating the rigid body displacement introduced during ex-situ thermal cycling tests.In this work,an ex-situ three-dimensional deformation measurement method using X-ray computed tomography(CT)and digital volume correlation(DVC)is proposed to overcome these obstacles.By incorporating the layer-wise reliability-guided displacement tracking(LW-RGDT)DVC with a singular value decomposition(SVD)method,this method enables accurate assessment of solder ball mechanical behavior in BGA packages without the influence of rigid body displacement.Experimental results reveal that BGA structures exhibit progressive convex deformation with increased thermal cycling,particularly in peripheral solder balls.This method provides a reliable and effective tool for assessing internal deformations in electronic packages under ex-situ conditions,which is crucial for their design optimization and lifespan predictions.
基金The Science and Technology Project of China Southern Pow er Grid Co.,Ltd.(No.GDKJ00000030)the National Key Technology R&D Program of China(No.2016YFC0701400)the National Natural Science Foundation of China(No.51525801)
文摘The effectiveness of carbon fiber reinforced polymer（CFRP） grids as the strengthening materials for a pre-damaged scaled tunnel model is experimentally investigated. First, the bond performances between the CFRP grid and the concrete under different types of adhesive and surface treatment were tested. The most efficient anchoring system was adopted for the subsequent scaled tunnel strengthening. Test results show that when the epoxy structural adhesive was used as the bonding material, the failure mode was CFRP grids rupturing,and the anchorage performance was optimal. When the polymer mortar was used as the adhesive, the surface treatments with anchored bolts and grooves can improve the bond performance, and the failure mode was sliding failure with the polymer mortar peeled off. After strengthening with CFRP grids, both the stiffness and the load capacity of the pre-damaged scaled tunnel model were improved. Additionally,the results obtained by fiber bragg grating（FBG） sensors indicate that the strains across tunnel segments were reduced,and the overall performance of the tunnel was improved.
