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Research on Ultrasonic Vibration Grinding of the Hard and Brittle Materials 被引量:4
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作者 YANG Xin-hong HAN Jie-cai +2 位作者 ZHANG Yu-min ZUO Hong-bo ZHANG Xue-jun 《Chinese Journal of Aeronautics》 SCIE EI CAS CSCD 2006年第B12期9-13,共5页
It is well known that grinding techniques are main methods to machine hard and brittle materials such as engineering ceramics. But the conventional grinding has many shortcomings such as poorer surface finish, quicker... It is well known that grinding techniques are main methods to machine hard and brittle materials such as engineering ceramics. But the conventional grinding has many shortcomings such as poorer surface finish, quicker wear and tear of grinding tools, lower efficiency and so on. Ultrasonic vibration grinding (UVG) which combines ultrasonic machining and grinding emerged as a developing and promising technique in recent years. In this paper, experimental studies on UVG were conducted on several kinds of hard and brittle material by altering processing parameters such as vibration frequency and its amplitude, diamond abrasive grit size, cutting depth, feeding speed and rotary speed of tools. The experimental results show that alteration in any of above mentioned parameters will bring effects on the processed surface finish of these materials. Of them, the diamond abrasive grit size has the greatest. Moreover, conventional grinding experiments were also carried out on these materials. By comparison, it was found that the UVG is superior to the conventional method in terms of the ground surface quality, the working efficiency and the wear rate of tools. 展开更多
关键词 ultrasonic vibration grinding (UVG) hard and brittle materials surface roughness wear extent
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Surface Topography of Fine-grained ZrO_2 Ceramic by Two-dimensional Ultrasonic Vibration Grinding
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作者 丁爱玲 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2011年第6期1162-1165,共4页
The surface quality of fine-grained ZrO2 engineering ceramic were researched using 270# diamond wheel both with and without work-piece two-dimension ultrasonic vibration grinding(WTDUVG). By AFM images, the surface ... The surface quality of fine-grained ZrO2 engineering ceramic were researched using 270# diamond wheel both with and without work-piece two-dimension ultrasonic vibration grinding(WTDUVG). By AFM images, the surface topography and the micro structure of the two-dimensional ultrasonic vibration grinding ceramics were especially analyzed. The experimental results indicate that the surface roughness is related to grinding vibration mode and the material removal mechanism. Surface quality of WTDUVG is superior to that of conventional grinding, and it is easy for two-dimensional ultrasonic vibration grinding that material removal mechanism is ductile mode grinding. 展开更多
关键词 two-dimension ultrasonic vibration grinding surface topography ductile grinding
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Separate critical condition for ultrasonic vibration assisted grinding
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作者 张洪丽 张建华 《Journal of Shanghai University(English Edition)》 2009年第5期391-395,共5页
Separate characteristic of the tangential ultrasonic vibration assisted grinding (TUAG) machining is analyzed based on TUAG process, and a critical speed formula is given to correctly set the machining parameters to i... Separate characteristic of the tangential ultrasonic vibration assisted grinding (TUAG) machining is analyzed based on TUAG process, and a critical speed formula is given to correctly set the machining parameters to insure the separate characteristics of TUAG process. The critical speed is not only related to the ultrasonic vibration amplitude and frequency, but also to the grinding wheel velocity and the cutting point space, and the grinding force can be decreased during the TUAG process with separability. Grinding force experiments are conducted, and the experimental results are in good agreement with the theoretical results. 展开更多
关键词 tangential ultrasonic vibration assisted grinding (TUAG) critical speed separate characteristic
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Prediction of undeformed chip thickness distribution and surface roughness in ultrasonic vibration grinding of inner hole of bearings
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作者 Yanqin LI Daohui XIANG +2 位作者 Guofu GAO Feng JIAO Bo ZHAO 《Journal of Zhejiang University-Science A(Applied Physics & Engineering)》 SCIE EI CAS CSCD 2024年第4期311-323,共13页
Ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism.The randomness of grain-workpiece interaction in ultrasonic vibration grinding can produce variable chips and ... Ultrasonic vibration grinding differs from traditional grinding in terms of its material removal mechanism.The randomness of grain-workpiece interaction in ultrasonic vibration grinding can produce variable chips and impact the surface roughness of workpiece.However,previous studies used iterative method to calculate the unformed chip thickness(UCT),which has low computational efficiency.In this study,a symbolic difference method is proposed to calculate the UCT.The UCT distributions are obtained to describe the stochastic interaction characteristics of ultrasonic grinding process.Meanwhile,the UCT distribution characteristics under different machining parameters are analyzed.Then,a surface roughness prediction model is established based on the UCT distribution.Finally,the correctness of the model is verified by experiments.This study provides a quick and accurate method for predicting surface roughness in longitudinal ultrasonic vibration grinding. 展开更多
关键词 Ultrasonic vibration grinding Undeformed chip thickness(UCT) Distribution characteristics Surface roughness
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MECHANICAL-ELECTRIC COUPLING DYNAMICAL CHARACTERISTICS OF AN ULTRA-HIGH SPEED GRINDING MOTORIZED SPINDLE SYSTEM 被引量:23
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作者 LUE Lang XIONG Wanli GAO Hang 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2008年第5期34-40,共7页
On the basis of the traditional mechanical model of a grinding wheel rotor and the mechanical-electric coupling model with ideal sinusoidal supply, taking high-frequency converting current of inverter power switches i... On the basis of the traditional mechanical model of a grinding wheel rotor and the mechanical-electric coupling model with ideal sinusoidal supply, taking high-frequency converting current of inverter power switches into further consideration, a modified mechanical-electric coupling model is created. The created model consists of an inverter, a motorized spindle, a grinding wheel and grinding loads. Some typical non-stationary processes of the grinding system with two different supplies, including the starting, the speed rising and the break in grinding loads, are compared by making use of the created model. One supply is an ideal sinusoidal voltage source, the other is an inverter. The theoretical analysis of the high-order harmonic is also compared with the experimental result. The material strategy of suppressing high-order harmonic mechanical-electric coupling vibration by optimizing inverter operating parameters is proposed. 展开更多
关键词 Ultra-high speed grinding Motorized spindle Mechanical-electric coupling vibration Suppression
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Vibration-assisted material damage mechanism:From indentation cracks to scratch cracks
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作者 Bingrui LV Bin LIN +5 位作者 Tianyi SUI Chunyan LIU Jinshuo ZHANG Longfei WANG Xuhui CHEN Jingguo ZHOU 《Chinese Journal of Aeronautics》 SCIE EI CAS 2024年第8期527-546,共20页
Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials ... Vibration-assisted grinding is one of the most promising technologies for manufacturing optical components due to its efficiency and quality advantages.However,the damage and crack propagation mechanisms of materials in vibration-assisted grinding are not well understood.In order to elucidate the mechanism of abrasive scratching during vibration-assisted grinding,a kinematic model of vibration scratching was developed.The influence of process parameters on the evolution of vibration scratches to indentation or straight scratches is revealed by displacement metrics and velocity metrics.Indentation,scratch and vibration scratch experiments were performed on quartz glass,and the results showed that the vibration scratch cracks are a combination of indentation cracks and scratch cracks.Vibration scratch cracks change from indentation cracks to scratch cracks as the indenter moves from the entrance to the exit of the workpiece or as the vibration frequency changes from high to low.A vertical vibration scratch stress field model is established for the first time,which reveals that the maximum principal stress and tensile stress distribution is the fundamental cause for inducing the transformation of the vibration scratch cracking system.This model provides a theoretical basis for understanding of the mechanism of material damage and crack propagation during vibration-assisted grinding. 展开更多
关键词 vibration assisted grinding Indentation vibration scratch Material removal mechanism Stress field model Crack propagation mechanism
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