The performances of fme-crystalline zirconia ceramics in workpiece ultrasonic vibration grinding （WUVG） and conventional grinding （CG） with diamond wheel were researched. The effects of WUVG and CG on material rem...The performances of fme-crystalline zirconia ceramics in workpiece ultrasonic vibration grinding （WUVG） and conventional grinding （CG） with diamond wheel were researched. The effects of WUVG and CG on material removal rate, grinding forces, surface roughness and microstructure of zirconia ceramic were investigated. Experimental results indicated that： （1） The material removal rate （MRR） in ultrasonic grinding process is two times as large as that of in conventional grinding. The material removal rate increases with increasing grinding depth in both ultrasonic grinding and conventional grinding. （2） The ultrasonic vibration grinding force is lower than that of conventional grinding force, and the increase of the worktable speed leads to a decrease of the grinding force, while the grinding force increases with larger grinding depth in both WUVG and CG. （3） The surface of ultrasonic vibration grinding has no spur and build-up edge and its surface roughness is smaller than that of CG significantly. Surface quality of WUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile grinding.展开更多
基金Supported by the Henan Extraordinary Ability of China (No.0421001200)
文摘The performances of fme-crystalline zirconia ceramics in workpiece ultrasonic vibration grinding （WUVG） and conventional grinding （CG） with diamond wheel were researched. The effects of WUVG and CG on material removal rate, grinding forces, surface roughness and microstructure of zirconia ceramic were investigated. Experimental results indicated that： （1） The material removal rate （MRR） in ultrasonic grinding process is two times as large as that of in conventional grinding. The material removal rate increases with increasing grinding depth in both ultrasonic grinding and conventional grinding. （2） The ultrasonic vibration grinding force is lower than that of conventional grinding force, and the increase of the worktable speed leads to a decrease of the grinding force, while the grinding force increases with larger grinding depth in both WUVG and CG. （3） The surface of ultrasonic vibration grinding has no spur and build-up edge and its surface roughness is smaller than that of CG significantly. Surface quality of WUVG is superior to that of conventional grinding, it is easy for ultrasonic vibration grinding that material removal mechanism is ductile grinding.
