For the purpose of solving the problem that too large pole tip recession （PTR） is produced in magnetic rigid disk heads by mechanical polishing, a chemical mechanical nano-grinding experiment is performed by using a...For the purpose of solving the problem that too large pole tip recession （PTR） is produced in magnetic rigid disk heads by mechanical polishing, a chemical mechanical nano-grinding experiment is performed by using a float-piece polisher with a tin plate to achieve a more plane and smoother surface. A basal solution, addition agents and a range of pH value are suitably selected to find a kind of slurry, with which the PTR can be controlled on sub-nanometer scale and the giant magnetic resistance （GMR） corrosion and electrostatic damage （ESD） can be avoided. Moreover, the cause that TiC protrudes from the substrate surface of the heads is studied. The appropriate shape and size of diamond abrasive are selected according to the chemical activation of A1203 and TiC in the same slurry. In this way, the chemical and mechanical interactions are optimized and the optimal surface that has small PTR and TiC asperity is achieved. Ultimatily, the chemical mechanical nano-grinding in combination with mechanical nano-grinding is adopted. Sub-nanometer PTR is achieved and the TiC asperity is eliminated by the chemical mechanical nano-grinding with large size ofmonocrystalline followed by mechanical nano-grinding with smalle polycrystalline diamonds.展开更多
A finite element analysis(FEA)model is developed for the chemical-mechanical polishing(CMP)process on the basis of a 12-in five-zone polishing head.The proposed FEA model shows that the contact stress non-uniformity i...A finite element analysis(FEA)model is developed for the chemical-mechanical polishing(CMP)process on the basis of a 12-in five-zone polishing head.The proposed FEA model shows that the contact stress non-uniformity is less dependent on the material property of the membrane and the geometry of the retaining ring.The larger the elastic modulus of the pad,the larger contact stress non-uniformity of the wafer.The applied loads on retaining ring and zone of the polishing head significantly affect the contact stress distribution.The stress adjustment ability of a zone depends on its position.In particular,the inner-side zone has a high stress adjustment ability,whereas the outer-side zone has a low stress adjustment ability.The predicted results by the model are shown to be consistent with the experimental data.Analysis results have revealed some insights regarding the performance of the multi-zone CMP.展开更多
基金National Natural Science Foundation of China(No. 50390061).
文摘For the purpose of solving the problem that too large pole tip recession （PTR） is produced in magnetic rigid disk heads by mechanical polishing, a chemical mechanical nano-grinding experiment is performed by using a float-piece polisher with a tin plate to achieve a more plane and smoother surface. A basal solution, addition agents and a range of pH value are suitably selected to find a kind of slurry, with which the PTR can be controlled on sub-nanometer scale and the giant magnetic resistance （GMR） corrosion and electrostatic damage （ESD） can be avoided. Moreover, the cause that TiC protrudes from the substrate surface of the heads is studied. The appropriate shape and size of diamond abrasive are selected according to the chemical activation of A1203 and TiC in the same slurry. In this way, the chemical and mechanical interactions are optimized and the optimal surface that has small PTR and TiC asperity is achieved. Ultimatily, the chemical mechanical nano-grinding in combination with mechanical nano-grinding is adopted. Sub-nanometer PTR is achieved and the TiC asperity is eliminated by the chemical mechanical nano-grinding with large size ofmonocrystalline followed by mechanical nano-grinding with smalle polycrystalline diamonds.
基金supported by the Science Fund for Creative Research Groups (Grant No. 51021064)the National Natural Science Foundation of China (Grant No. 51205226)the China Postdoctoral Science Foundation (Grant No. 2012M510420)
文摘A finite element analysis(FEA)model is developed for the chemical-mechanical polishing(CMP)process on the basis of a 12-in five-zone polishing head.The proposed FEA model shows that the contact stress non-uniformity is less dependent on the material property of the membrane and the geometry of the retaining ring.The larger the elastic modulus of the pad,the larger contact stress non-uniformity of the wafer.The applied loads on retaining ring and zone of the polishing head significantly affect the contact stress distribution.The stress adjustment ability of a zone depends on its position.In particular,the inner-side zone has a high stress adjustment ability,whereas the outer-side zone has a low stress adjustment ability.The predicted results by the model are shown to be consistent with the experimental data.Analysis results have revealed some insights regarding the performance of the multi-zone CMP.
