A comprehensive review on microchannel heat sinks for electronics cooling

The heat generation of electronic devices is increasing dramatically,which causes a serious bottleneck in the thermal management of electronics,and overheating will result in performance deterioration and even device damage.With the development of micro-machining technologies,the microchannel heat sink(MCHS)has become one of the best ways to remove the considerable amount of heat generated by high-power electronics.It has the advantages of large specific surface area,small size,coolant saving and high heat transfer coefficient.This paper comprehensively takes an overview of the research progress in MCHSs and generalizes the hotspots and bottlenecks of this area.The heat transfer mechanisms and performances of different channel structures,coolants,channel materials and some other influencing factors are reviewed.Additionally,this paper classifies the heat transfer enhancement technology and reviews the related studies on both the single-phase and phase-change flow and heat transfer.The comprehensive review is expected to provide a theoretical reference and technical guidance for further research and application of MCHSs in the future.

Heat dissipation enhancement method for finned heat sink for AGV motor driver's IGBT module

With the widespread use of high-power and highly integrated insulated gate bipolar transistor(IGBT),their cooling methods have become challenging.This paper proposes a liquid cooling scheme for heavy-duty automated guided vehicle(AGV)motor driver in port environment,and improves heat dissipation by analyzing and optimizing the core component of finned heat sink.Firstly,the temperature distribution of the initial scheme is studied by using Fluent software,and the heat transfer characteristics of the finned heat sink are obtained through numerical analysis.Secondly,an orthogonal test is designed and combined with the response surface methodology to optimize the structural parameters of the finned heat sink,resulting in a 14.57%increase in the heat dissipation effect.Finally,the effectiveness of heat dissipation enhancement is verified.This work provides valuable insights into improving the heat dissipation of IGBT modules and heat sinks,and provides guidance for their future applications.

Computer simulation of Cu:AlOOH/water in a microchannel heat sink using a porous media technique and solved by numerical analysis AGM and FEM

Extensive improvements in small-scale thermal systems in electronic circuits,automotive industries,and microcomputers conduct the study of microsystems as essential.Flow and thermic field characteristics of the coherent nanofluid-guided microchannel heat sink are described in this perusal.The porous media approximate was used to search the heat distribution in the expanded sheet and Cu:γ-AlOOH/water.A hybrid blend of Boehme copper and aluminum nanoparticles is evaluated to have a cooling effect on the microchannel heat sink.By using Akbari Ganji and finite element methods,linear and non-linear differential equations as well as simple dimensionless equations have been analyzed.The purpose of this study is to investigate the fluid and thermal parameters of copper hybrid solution added to water,such as Nusselt number and Darcy number so that we can reach the best cooling of the fluid.Also,by installing a piece of fin on the wall of the heat sink,the coefficient of conductive heat transfer and displacement heat transfer with the surrounding air fluid increases,and the efficiency of the system increases.The overall results show that expanding values on the NP(series heat transfer fluid system maximizes performance with temperatures)volume division of copper,as well as boehmite alumina particles,lead to a decrease within the stream velocity of the Cu:AlOOH/water.Increasing the volume fraction of nanoparticles in the hybrid mixture decreases the temperature of the solid surface and the hybrid nanofluid.The Brownian movement improves as the volume percentage of nanoparticles in the hybrid mixture grows,spreading the heat across the environment.As a result,heat transmission rates rise.As the Darcy number increases,the thermal field for solid sections and Cu:AlOOH/water improves.

Fabrication and testing of phase change heat sink for high power LED

A novel phase change heat sink was fabricated for packaging cooling of high power light emitting diode （LED）. 3D structures as enhanced boiling structure in the evaporation surface were composed of a spiral micro-groove along circumferential direction and radial micro-grooves which were processed by ploughing-extrusion （P-E） and stamping, respectively. Meanwhile, the cycle power of refrigerant was supplied by wick of sintered copper powder on internal surface of phase change heat sink. Operational characteristics were tested under different heat loads and refrigerants. The experimental results show that phase change heat sink is provided with a good heat transfer capability and the temperature of phase change heat sink reaches 86.8 ℃ under input power of 10 W LED at ambient temperature of 20 ℃.

Evaluation on Heat Transferring Performance of Fabric Heat Sink by Finite Element Modeling

Considering the limitation in current manufacturing technology of commercial pin fin heat sinks,a new fabric heat sink has been designed. However,it is lack of an understanding of the heat transferring performance of this new kind of heat sink. In this study,the finite element method (FEM) was used to predict the heat transferring performance of fabric heat sink under the condition of natural convection and forced convection, and its heat transferring performance was compared with that of pin fin heat sink. The results showed that in the condition of natural convection the heat transferring performance of pin fin heat sink was better than that of fabric heat sink, and vice versa under the forced convection condition.

Fabrication, microstructure and properties of SiCp/Cu heat sink materials

Cu-coated powder was fabricated by electroless plating process, and the composition and morphology of coated powder were studied. Moreover, Cu-30, 40, 50 vol.%SiCp heat sink materials were fabricated by hot pressing using coated and uncoated powder. And the microstructure and thermophysical properties of the heat sink materials were also studied. The results show that SiCp particles distribute uniformly in heat sink materials and the interface between SiCp particles and Cu matrix is clear and well bonded. On the condition of same volume fraction of SiCp, the thermal conductivity of the material using coated powder is larger than that of the material using uncoated powder. Under experiment conditions, the thermal conductivity and coefficient of thermal expansion of Cu-30 vol.%SiCp heat sink material is 236.2 W·m-1·K-1 and 9.9×10-6/K (30-200 ℃) respectively. It provides important reference data for future experiments.

CFD investigation of the feasibility of polymer-based microchannel heat sink as thermal solution

Microchannel heat sinks(MCHSs)are promising thermal solutions in miniaturized or compact devices.Lightweight aspect has been given huge emphasis in recent years.Metal-based materials are commonly used to fabricate MCHSs due to their high thermal conductivity.Consequently,MCHSs are heavy due to the high density of these materials albeit the small footprint of MCHSs.Polymer-based materials are interesting alternatives.Despite their poor thermal conductivity,lightweight feature attracts the interest of researchers.Heat transfer is a conjugate process of heat conduction and heat convection.Poor heat conductions aspect may be compensated through enhancement of heat convection aspects.Although polymer-based materials have been used in microscale heat transfer studies,their focus was not on their feasibility.The present study aims to evaluate the feasibility of polymer-based MCHSs as thermal solutions.The effect of thermal conductivity of fabrication materials,including polymer-based PDMS,PTFE,PDMS/MWCNT,and metal-based aluminum,on the thermal performance of MCHSs was investigated and compared at various inlet flow rate,fluid thermal conductivity,and microchannel ratio at different constant heat fluxes using three-dimensional CFD approach.Results showed that the thermal performance of MCHSs was greatly affected by the heat conduction aspect in which poor heat conduction limited the thermal performance improvement due to enhanced heat convection aspects.This suggests polymer-based materials have the potential for heat transfer applications through thermal conductivity enhancement.This was confirmed in the further analysis using a recently proposed high thermal conductivity polymer-based graphite/epoxy MCHS and a hybrid-based PDMS/aluminum MCHS.

Heat transfer performance testing of a new type of phase change heat sink for high power light emitting diode

In view of the limitations of solid metal heat sink in the heat dissipation of high power light emitting diode （LED）, a kind of miniaturized phase change heat sink is developed for high power LED packaging. First, the fabrication process of miniaturized phase change heat sink is investigated, upon which all parts of the heat sink are fabricated including main-body and end-cover of the heat sink, the formation of three-dimensional boiling structures at the evaporation end, the sintering of the wick, and the encapsulation of high power LED phase change heat sink. Subsequently, with the assistance of the developed testing system, heat transfer performance of the heat sink is tested under the condition of natural convection, upon which the influence of thermal load and working medium on the heat transfer performance is investigated. Finally, the heat transfer performance of the developed miniaturized phase change heat sink is compared with that of metal solid heat sink. Results show that the developed miniaturized phase change heat sink presents much better heat transfer performance over traditional metal solid heat sink, and is suitable for the packaging of high power LED.

Theoretic heat sink simulation and experimental investigation of the pyrolysis of substituted cyclohexanes

Reaxgen program for the pyrolysis mechanism of cycloalkanes was adopted to simulate the heat sink of substituted cyclohexanes. Thermal cracking of cyclohexanes was performed to examine the cracking performance, wherein the substituent effects were detailedly discussed under supercritical condition. It was found that Reaxgen program played a good part in the screening and optimization of cyclohexanes. A good agreement with the experimental data for the mono-substituted and bi-substituted cyclohexanes was demonstrated, however, some deviation for the tri-substituted cyclohexanes were observed. The experiment results indicated that the gaseous product yield increased sharply for mono- substituted cyclohexanes with short substituents containing no more than two carbons. Nevertheless, continuous increase in the alkyl chain depressed the gaseous product yield smoothly. The cyclic substituent dramatically inhibited the pyrolysis of cyclohexanes. All the substituents but cyclohexyl had no obvious effect on the yield of hydrogen and olefins （≤C4）. For bi-substituted cyclohexanes, the more close the distance between the two substituents, the higher the gaseous product yield was obtained. However, opposite result on the selectivity to hydrogen and olefins （≤C4） was generally obtained except 1,3-dimethylcyclohexane. The position of tri-substituents acted little significance on the gaseous product yield, as well as the selectivity to hydrogen and olefins （≤C4）.

Integrated Behavior of Carbon and Copper Alloy Heat Sink Under Different Heat Loads and Cooling Conditions

An actively water-cooled limiter has been designed for the long pulse operation of an HT-7 device, by adopting an integrated structure-doped graphite and a copper alloy heat sink with a super carbon sheet serving as a compliant layer between them. The behaviors of the integrated structure were evaluated in an electron beam facility under different heat loads and cooling conditions. The surface temperature and bulk temperature distribution were carefully measured by optical pyrometers and thermocouples under a steady state heat flux of 1 to 5 MW/m^2 and a water flow rate of 3 m^3/h, 4.5 m^3/h and 6 m^3/h, respectively. It was found that the surface temperature increased rapidly with the heat flux rising, but decreased only slightly with the water flow rate rising. The surface temperature reached approximately 1200℃ at 5 MW/m^2 of heat flux and 6 m^3/h of water flow. The primary experimental results indicate that the integrated design meets the requirements for the heat expelling capacity of the HT-7 device. A set of numerical simulations was also completed, whose outcome was in good accord with the experimental results.

Thermal Analysis of High Power LED on Heat Sink

Thermal management of LED junction temperature is one of the fundamental technologies for LED lamp to ensure basic specifications in many aspects. Analysed is the high power LED's distribution on heat sink. Using mathematical statistical methods, a formula is conlcuded to calculate the size of heat sink under LED safe working temperature, which provides a method to researchers and LED lamp manufacturers.

Forming technology of boiling structure on evaporation surface of phase-change heat sink for high-power light emitting diode

Boiling structures on evaporation surface of red copper sheet with a diameter （D） of 10 mm and a wall thickness （h） of 1 mm were processed by the ploughing-extrusion （P-E） processing method, which is one part of the phase-change heat sink for high power （HP） light emitting diode （LED）. The experimental results show that two different structures of rectangular- and triangular-shaped micro-grooves are formed in P-E process. When P-E depth （ap）, interval of helical grooves （dp） and rotation speed （n） are 0.12 ram, 0.2 mm and 100 r/min, respectively, the boiling structures of triangular-shaped grooves with the fin height of 0.15 mm that has good evaporation performance are obtained. The shapes of the boiling structures are restricted by dp and ap, and dp is determined by n and amount of feed （f）. The ploughing speed has an important influence on the formation of groove structure in P-E process.

Investigation of heat sink of endothermic hydrocarbon fuels

Endothermic hydrocarbon fuels are advanced coolants for high-temperature structures of spacecraft. No data of tested-cooling-ability of endothermic fuels have been broadly discussed in literature. In this work a high-temperature flow calorimeter was designed, and the cooling capacity of six different hydrocarbon fuels were measured. Experimental results showed that these hydrocarbon fuels have capacity for cooling high-temperature structures, and that the cooling capacity of fuel N-1 can reach 3.15 M J/kg, which can nearly satisfy the requirement of thermal management for a Mach 3 cruise aircraft, whose heat sink requirement is about 3.5 M J/kg. The endothermic velocity of hydrocarbon fuels was also measured by the calorimeter.

Experimental Verification of Model for Liquid-Cooled Staggered Pin Fin Heat Sinks with Top Bypass Flow

Pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow were experimentally evaluated. The authors considered liquid-cooling applications because there were few data available comparing to air-cooling applications. Empirical equations to predict heat transfer on the endwall were developed by obtaining experimental data on the copper base plate with acrylic pins. A new model for predicting pressure drops and heat transfer over staggered pin fin heat sinks with top bypass flow based on mass, momentum, and energy conservation within the two control volumes is proposed. The first control volume in the model is located within the finned area, and the second is located in the gap between the tip of the pins and the flow channel. This model combines two conditions according to the boundary-layer thickness. A comparison between experimental and calculated results revealed that dimensionless pressure drops and the Nusselt number could be predicted within 30% error for the former and 50% error for the latter.

Thermal modeling optimization and experimental validation for a single concentrator solar cell system with a heat sink

A single concentrator solar cell model with a heat sink is established to simulate the thermal performance of the system by varying the number, height, and thickness of fins, the base thickness and thermal resistance of the thermal conductive adhesive. Influence disciplines of those parameters on temperatures of the solar cell and heat sink are obtained. With optimized number, height and thickness of fins, and the thickness values of base of 8, 1.4 cm, 1.5 mm, and 2 mm, the lowest temperatures of the solar cell and heat sink are 41.7 ~C and 36.3 ~C respectively. A concentrator solar cell prototype with a heat sink fabricated based on the simulation optimized structure is built. Outdoor temperatures of the prototype are tested. Temperatures of the solar cell and heat sink are stabilized with time continuing at about 37 ℃-38 ℃ and 35 ℃-36 ℃respectively, slightly lower than the simulation results because of effects of the wind and cloud. Thus the simulation model enables to predict the thermal performance of the system, and the simulation results can be a reference for designing heat sinks in the field of single concentrator solar cells.

Impact of nanoparticle shape on thermohydraulic performance of a nanofluid in an enhanced microchannel heat sink for utilization in cooling of electronic components

In this article,the thermal–hydraulic efficacy of a boehmite nanofluid with various particle shapes is evaluated inside a microchannel heat sink.The study is done for particle shapes of platelet,cylinder,blade,brick,and oblate spheroid at Reynolds numbers(Re)of 300,800,1300,and 1800.The particle volume fraction is assumed invariant for all of the nanoparticle shapes.The heat transfer coefficient(h),flow irregularities,pressure loss,and pumping power heighten by the elevation of the Re for all of the nanoparticle shapes.Also,the nanofluid having the platelet-shaped nanoparticles leads to the greatest h,and the nanofluid having the oblate spheroid particles has the lowest h and smallest pressure loss.In contrast,the nanofluid having the platelet-shaped nanoparticles leads to the highest pressure loss.The mean temperature of the bottom surface,thermal resistance,and temperature distribution uniformity decrease by the rise in the Reynolds number for all of the particle shapes.Also,the best distribution of the temperature and the lowest thermal resistance are observed for the suspension containing the platelet particles.Thereby,the thermal resistance of the nanofluid with the platelet particles shows a 9.5%decrement compared to that with the oblate spheroid particles at Re=300.For all the nanoparticle shapes,the figure of merit(FoM)uplifts by elevating the Re,while the nanofluids containing the brickand oblate spheroid-shaped nanoparticles demonstrate the highest FoM values.

Heat Transfer Performance and Structural Optimization of a Novel Micro-channel Heat Sink

With the advent of the 5G era,the design of electronic equipment is developing towards thinness,intelligence and multi-function,which requires higher cooling performance of the equipment.Micro-channel heat sink is promising for the heat dissipation of super-thin electronic equipment.In this study,thermal resistance theoretical model of the micro-channel heat sink was first established.Then,fabrication process of the micro-channel heat sink was introduced.Subsequently,heat transfer performance of the fabricated micro-channel heat sink was tested through the developed testing platform.Results show that the developed micro-channel heat sink has more superior heat dissipation performance over conventional metal solid heat sink and it is well suited for high power LEDs application.Moreover,the micro-channel structures in the heat sink were optimized by orthogonal test.Based on the orthogonal optimization,heat dissipation performance of the micro-channel radiator was further improved.

Simulated Heat Sink in the Southern Ocean and Its Contribution to the Recent Hiatus Decade

A set of numerical experiments is designed and carried out to understand a heat sink in the Southern Ocean in the recent hiatus decade. By using an oceanic general circulation model, the authors focus on the contributions from two types of forcing: wind stress and thermohaline forcing. The simulated results show that the heat sink in the upper Southern Ocean comes mainly from thermohaline forcing; while in the deeper layers, wind stress forcing also plays an important role. These different contributions may be due to different physical processes for the heat budget. The combination of these two types of forcing shows a significant heat sink in the Southern Ocean in the recent hiatus decade, and this is consistent with the observations and conclusions of a similar recently published study.

Modeling and Simulation of a Hybrid Jet-Impingement/Micro-Channel Heat Sink

With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit,new strategies are needed to extract heat from these devices in an efficient way.In this regard methods based on the combination of the so-called“jet impingement”and“micro-channel”approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields.In this paper,a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model.Dedicated CFD simulation of the coupled flow/temperature fields and orthogonal tests are performed in order to optimize the overall design.The influence of different sets of structural parameters on the cooling performance is examined.It is shown that an optimal scheme exists for which favourable performance can be obtained in terms of hot spot temperature decrease and thermal uniformity improvement.

Second Law Analysis and Optimization of Elliptical Pin Fin Heat Sinks Using Firefly Algorithm

One of the most significant considerations in the design of a heat sink is thermal management due to increasing thermal flux and miniature in size.These heat sinks utilize plate or pin fins depending upon the required heat dissipation rate.They are designed to optimize overall performance.Elliptical pin fin heat sinks enhance heat transfer rates and reduce the pumping power.In this study,the Firefly Algorithm is implemented to optimize heat sinks with elliptical pin-fins.The pin-fins are arranged in an inline fashion.The nature-inspired metaheuristic algorithm performs powerfully and efficiently in solving numerical global optimization problems.Based on mass,energy,and entropy balance,three models are developed for thermal resistance,hydraulic resistance,and entropy generation rate in the heat sink.The major axis is used as the characteristic length,and the maximum velocity is used as the reference velocity.The entropy generation rate comprises the combined effect of thermal resistance and pressure drop.The total EGR is minimized by utilizing the firefly algorithm.The optimization model utilizes analytical/empirical correlations for the heat transfer coefficients and friction factors.It is shown that both thermal resistance and pressure drop can be simultaneously optimized using this algorithm.It is demonstrated that the performance of FFA is much better than PPA.