The volatilization behavior of Cu, Pb, Sn, Sb, Ni, Zn, Mn, Co, Cr, Cd during pyrolysis of waste printed circuit boards was investigated in a bench-scale fixed-bed pyrolysis system. It was found that volatility of heav...The volatilization behavior of Cu, Pb, Sn, Sb, Ni, Zn, Mn, Co, Cr, Cd during pyrolysis of waste printed circuit boards was investigated in a bench-scale fixed-bed pyrolysis system. It was found that volatility of heavy metals increases with operating temperature elevating, and bromine and vacuum have an obvious promoting effect on volatility of most of heavy metals. Over 99% weight of Cu and Ni are still remained in solid residue after pyrolysis, about 20% weight of Sb, Zn and Cd are transfered into liquid and gas during a pyrolysis process at 600 ℃, volatilization fractions of Pb, Sn, Mn, Co, Cr are less than 10% at the same conditions. The contents of heavy metals in liquid and gas products depend on not only volatility of metals, but also their initial contents in printed circuit boards, pyrolysis liquid and gas are primarily contaminated by Cu, Pb, Sn, Sb and Zn, their contents in liquid vary from 10^2 to 10^3 pg/mL, Mn, Co, Cr, Cd were detected only at very low level, less than 10 μg/mL.展开更多
Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using pote...Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.展开更多
Copper recovery is the core of waste printed circuit boards （WPCBs） treatment. In this study, we proposed a feasible and efficient way to recover copper from WPCBs concentrated metal scraps by direct electrolysis an...Copper recovery is the core of waste printed circuit boards （WPCBs） treatment. In this study, we proposed a feasible and efficient way to recover copper from WPCBs concentrated metal scraps by direct electrolysis and thctors that affect copper recovery rate and purity, mainly CuSO4.5H2O concentration, NaCI concentration, H2SO4 concentration and current density, were discussed in detail. The results indicated that copper recovery rate increased first with the increase ofCuSO4- 5H2O, NaCI, H2SO4 and current density and then decreased with further increasing these conditions. NaCI, H2SO4 and current density also showed a similar impact on copper purity, which also increased first and then decreased. Copper purity increased with the increase of CuSO4.5H2O. When the concentration of CuSO4-5H2O NaCI and H2oSO4 was respectively 90, 40 and 118 g/L and current density was 80 mA/cm-, copper recovery rate and purity was up to 97.32% and 99.86%, respectively. Thus, electrolysis proposes a feasible and prospective approach for waste printed circuit boards recycle, even for e-waste, though more researches are needed for industrial application.展开更多
The method for the recycling of copper from copper chloride solution was developed. This process consists of extraction of copper, purification and particle size reduction. In the first step, reductive metal scraps we...The method for the recycling of copper from copper chloride solution was developed. This process consists of extraction of copper, purification and particle size reduction. In the first step, reductive metal scraps were added to acidic copper chloride waste enchants produced in the PCB industry to obtain copper powder. Composition analysis showed that this powder contained impurities such as Fe, Ni, and water. So, drying and purification were carried out by using microwave and a centrifugal separator. Thereby the copper powder had a purity of higher than 99% and spherical form in morphology. The copper powder size was decreased by ball milling.展开更多
基金Supported by Science Technology Research Project of Guangdong Province(2003e32104)
文摘The volatilization behavior of Cu, Pb, Sn, Sb, Ni, Zn, Mn, Co, Cr, Cd during pyrolysis of waste printed circuit boards was investigated in a bench-scale fixed-bed pyrolysis system. It was found that volatility of heavy metals increases with operating temperature elevating, and bromine and vacuum have an obvious promoting effect on volatility of most of heavy metals. Over 99% weight of Cu and Ni are still remained in solid residue after pyrolysis, about 20% weight of Sb, Zn and Cd are transfered into liquid and gas during a pyrolysis process at 600 ℃, volatilization fractions of Pb, Sn, Mn, Co, Cr are less than 10% at the same conditions. The contents of heavy metals in liquid and gas products depend on not only volatility of metals, but also their initial contents in printed circuit boards, pyrolysis liquid and gas are primarily contaminated by Cu, Pb, Sn, Sb and Zn, their contents in liquid vary from 10^2 to 10^3 pg/mL, Mn, Co, Cr, Cd were detected only at very low level, less than 10 μg/mL.
基金Project(50871044)supported by the National Natural Science Foundation of ChinaProject(2012M511207)supported by the Postdoctoral Science Foundation of ChinaProject(10122011)supported by the Science Research Foundation of Wuhan Institute Technology,China
文摘Effect of direct current electric field （DCEF） on corrosion behaviour of copper printed circuit board （PCB-Cu）, Cl-ion migration behaviour, dendrites growth under thin electrolyte layer was investigated using potentiodynamic polarization and scanning electron microscopy （SEM） with energy dispersive spectrometer （EDS）. Results indicate that DCEF decreases the corrosion of PCB-Cu;Cl-ions directionally migrate from the negative pole to the positive pole, and enrich on the surface of the positive pole, which causes serious localized corrosion; dendrites grow on the surface of the negative pole, and the rate and scale of dendrite growth become faster and greater with the increase of external voltage and exposure time, respectively.
文摘Copper recovery is the core of waste printed circuit boards （WPCBs） treatment. In this study, we proposed a feasible and efficient way to recover copper from WPCBs concentrated metal scraps by direct electrolysis and thctors that affect copper recovery rate and purity, mainly CuSO4.5H2O concentration, NaCI concentration, H2SO4 concentration and current density, were discussed in detail. The results indicated that copper recovery rate increased first with the increase ofCuSO4- 5H2O, NaCI, H2SO4 and current density and then decreased with further increasing these conditions. NaCI, H2SO4 and current density also showed a similar impact on copper purity, which also increased first and then decreased. Copper purity increased with the increase of CuSO4.5H2O. When the concentration of CuSO4-5H2O NaCI and H2oSO4 was respectively 90, 40 and 118 g/L and current density was 80 mA/cm-, copper recovery rate and purity was up to 97.32% and 99.86%, respectively. Thus, electrolysis proposes a feasible and prospective approach for waste printed circuit boards recycle, even for e-waste, though more researches are needed for industrial application.
文摘The method for the recycling of copper from copper chloride solution was developed. This process consists of extraction of copper, purification and particle size reduction. In the first step, reductive metal scraps were added to acidic copper chloride waste enchants produced in the PCB industry to obtain copper powder. Composition analysis showed that this powder contained impurities such as Fe, Ni, and water. So, drying and purification were carried out by using microwave and a centrifugal separator. Thereby the copper powder had a purity of higher than 99% and spherical form in morphology. The copper powder size was decreased by ball milling.
