In recent years,scientists have become increasingly concerned in recycling electronic trash,particularly waste printed circuit boards(WPCBs).Previous research has indicated that the presence of Cu impacts the pyrolysi...In recent years,scientists have become increasingly concerned in recycling electronic trash,particularly waste printed circuit boards(WPCBs).Previous research has indicated that the presence of Cu impacts the pyrolysis of WPCBs.However,there may be errors in the experimental results,as printed circuit boards(PCBs)with copper and those without copper are produced differently.For this experiment,we blended copper powder with PCB nonmetallic resin powder in various ratios to create the samples.The apparent kinetics and pyrolysis properties of four resin powders with varying copper concentrations were compared using nonisothermal thermogravimetric analysis(TG)and thermal pyrolysis-gas chromatography mass spectrometry(Py-GC/MS).From the perspective of kinetics,the apparent activation energy of the resin powder in the pyrolysis reaction shows a rise(0.1<a<0.2)-stable(0.2<a<0.4)-accelerated increase(0.4<a<0.8)-decrease(0.8<a<0.9)process.After adding copper powder,the apparent activation energy changes more obviously when(0.2<a<0.4).In the early stage of the pyrolysis reaction(0.1<a<0.6),the apparent activation energy is reduced,but when a?0.8,it is much higher than that of the resin sample without copper.Additionally,it is discovered using thermogravimetric analysis and Py-GC/MS that copper shortens the temperature range of the primary pyrolysis reaction and prevents the creation of compounds containing bromine.This inhibition will raise the temperature at which compounds containing bromine first form,and it will keep rising as the copper level rises.The majority of the circuit board molecules have lower bond energies when copper is present,according to calculations performed using the Gaussian09 software,which promotes the pyrolysis reaction.展开更多
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
作为有源相控阵天线阵面的核心部件,收发组件在整个有源天线阵面中的成本占比最高,因此如何降低收发组件的成本是设计天线阵面需要着重考虑的问题。与多芯片收发组件中常用的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)多层...作为有源相控阵天线阵面的核心部件,收发组件在整个有源天线阵面中的成本占比最高,因此如何降低收发组件的成本是设计天线阵面需要着重考虑的问题。与多芯片收发组件中常用的低温共烧陶瓷(Low Temperature Co-fired Ceramic,LTCC)多层基板相比,多层印制板在成本方面具有很大优势。文中利用混压多层印制板,结合铝合金封装壳体,研制了一款Ku波段四通道低成本收发组件。该收发组件在工作频带内可以实现6位移相和6位幅度衰减,其通道接收增益≥20 dB,通道发射功率≥10 W。文中针对混压多层印制板热膨胀系数高、布线密度低、金丝键合可靠性差等问题,优化了基板叠层方案,研究了高密度互联通孔制作、基板镀层高可靠键合、低成本气密封装等关键工艺技术,有效提升了产品的可靠性,可为低成本混压多层印制板在多芯片组件中的工程化应用提供参考。展开更多
提出了一种分析多层印刷电路板电源分配网络(power distribution network,PDN)中一维(1D)介质型电磁带隙(electromagnetic band-gap,EBG)结构噪声隔离性能的1D有限元数值计算方法.将1D介质型EBG的3D结构简化为1D有限元模型,通过直接求...提出了一种分析多层印刷电路板电源分配网络(power distribution network,PDN)中一维(1D)介质型电磁带隙(electromagnetic band-gap,EBG)结构噪声隔离性能的1D有限元数值计算方法.将1D介质型EBG的3D结构简化为1D有限元模型,通过直接求解波动方程获得传输系数T、反射系数R以及散射参数S.利用R-T曲线可直观地判定频率禁带,而采用分贝表示的S21参数则更方便评价噪声隔离度.根据介质型EBG的周期数、介电常数和周期长度等参数对噪声隔离性能影响的仿真结果,针对少周期、不完全禁带EBG结构提出了先采用多周期EBG结构预测禁带,再通过调整介电常数和周期长度扩展禁带和增强噪声隔离度的两阶段设计方法.采用3D全波电磁仿真验证了1D有限元算法的合理性.展开更多
基金supported by the National Key Research and Development Program of China(2018YFC1902504).
文摘In recent years,scientists have become increasingly concerned in recycling electronic trash,particularly waste printed circuit boards(WPCBs).Previous research has indicated that the presence of Cu impacts the pyrolysis of WPCBs.However,there may be errors in the experimental results,as printed circuit boards(PCBs)with copper and those without copper are produced differently.For this experiment,we blended copper powder with PCB nonmetallic resin powder in various ratios to create the samples.The apparent kinetics and pyrolysis properties of four resin powders with varying copper concentrations were compared using nonisothermal thermogravimetric analysis(TG)and thermal pyrolysis-gas chromatography mass spectrometry(Py-GC/MS).From the perspective of kinetics,the apparent activation energy of the resin powder in the pyrolysis reaction shows a rise(0.1<a<0.2)-stable(0.2<a<0.4)-accelerated increase(0.4<a<0.8)-decrease(0.8<a<0.9)process.After adding copper powder,the apparent activation energy changes more obviously when(0.2<a<0.4).In the early stage of the pyrolysis reaction(0.1<a<0.6),the apparent activation energy is reduced,but when a?0.8,it is much higher than that of the resin sample without copper.Additionally,it is discovered using thermogravimetric analysis and Py-GC/MS that copper shortens the temperature range of the primary pyrolysis reaction and prevents the creation of compounds containing bromine.This inhibition will raise the temperature at which compounds containing bromine first form,and it will keep rising as the copper level rises.The majority of the circuit board molecules have lower bond energies when copper is present,according to calculations performed using the Gaussian09 software,which promotes the pyrolysis reaction.
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
文摘提出了一种分析多层印刷电路板电源分配网络(power distribution network,PDN)中一维(1D)介质型电磁带隙(electromagnetic band-gap,EBG)结构噪声隔离性能的1D有限元数值计算方法.将1D介质型EBG的3D结构简化为1D有限元模型,通过直接求解波动方程获得传输系数T、反射系数R以及散射参数S.利用R-T曲线可直观地判定频率禁带,而采用分贝表示的S21参数则更方便评价噪声隔离度.根据介质型EBG的周期数、介电常数和周期长度等参数对噪声隔离性能影响的仿真结果,针对少周期、不完全禁带EBG结构提出了先采用多周期EBG结构预测禁带,再通过调整介电常数和周期长度扩展禁带和增强噪声隔离度的两阶段设计方法.采用3D全波电磁仿真验证了1D有限元算法的合理性.
