Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with it...Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with its spatial and angular distribution. Merits and non-merits of traditional modeling methods when applied to high power LEDs based on secondary optical design are discussed. Two commercial high power LEDs are simulated using the proposed computer modeling method. Correlation coefficient is proposed to compare and analyze the simulation results and manufacturing specifications. The source model is precisely demonstrated by obtaining above 99% in correlation coefficient with different surface incident angle intervals.展开更多
In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point con...In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.展开更多
This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is ...This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is mounted on a printed circuit board (PCB) attached with a heat sink subject to the natural convection cooling. Being validated by finite element (FE) models, the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL.展开更多
An active cooling solution based on close-looped micro impinging jet is proposed for high power light emitting diodes (LEDs). In this system, a micro pump is utilized to enable the fluid circulation, impinging jet is ...An active cooling solution based on close-looped micro impinging jet is proposed for high power light emitting diodes (LEDs). In this system, a micro pump is utilized to enable the fluid circulation, impinging jet is used for heat exchange between LED chips and the present system. To check the feasibility of the present cooling system, the preliminary experiments are conducted without the intention of parameter opti-mization on micro jet device and other system components. The experiment results demonstrate that the present cooling system can achieve good cooling effect. For a 16.4 W input power, the surface temperature of 2 by 2 LED array is just 44.2℃ after 10 min operation, much lower than 112.2℃, which is measured without any active cool-ing techniques at the same input power. Experimental results also show that increase in the flow rate of micro pump will greatly enhance the heat transfer efficiency, how-ever, it will increase power consumption. Therefore, it should have a trade-off be-tween the flow rate and the power consumption. To find a suitable numerical model for next step parameter optimization, numerical simulation on the above experiment system is also conducted in this paper. The comparison between numerical and ex-periment results is presented. For two by two chip array, when the input power is 4 W, the surface average temperature achieved by a steady numerical simulation is 34℃, which is close to the value of 32.8℃ obtained by surface experiment test. The simu-lation results also demonstrate that the micro jet device in the present cooling sys-tem needs parameter optimization.展开更多
A novel loop heat pipe(LHP)cooling device for high power LED is developed.The thermal capabilities, including startup performance,temperature uniformity and thermal resistance of the loop heat pipe under different hea...A novel loop heat pipe(LHP)cooling device for high power LED is developed.The thermal capabilities, including startup performance,temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally.The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19―3.1 K/W,the temperature uniformity in the evaporator is controlled within 1.5℃,and the junction temperature of high power LED can be controlled steadily under 100℃for a heat load of 100 W.展开更多
Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected ...Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.展开更多
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market a...High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.展开更多
As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is ...As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al5O12∶Ce3+(in short: YAG∶Ce3+). The matching of the spectrum of the blue LED chips and the YAG∶Ce3+ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high-power single-chip-white-LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high-power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.展开更多
To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature...To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.展开更多
【目的】解决大功率LED灯具高效散热问题。【方法】以干冰为冷却介质,设计出干冰喷射散热器,通过COMSOL软件研究干冰喷射对功率为300 W LED灯的散热特性。【结果】仿真试验结果表明,增大干冰流量能明显改善传热效果,流量由7.85 mL/s增至...【目的】解决大功率LED灯具高效散热问题。【方法】以干冰为冷却介质,设计出干冰喷射散热器,通过COMSOL软件研究干冰喷射对功率为300 W LED灯的散热特性。【结果】仿真试验结果表明,增大干冰流量能明显改善传热效果,流量由7.85 mL/s增至23.55 mL/s,散热器相同位置处干冰固相分数由0.04增至0.34。增大干冰流速可显著降低基板表面温度,流速由0.1 m/s增至0.3 m/s,温度约降低26.4%,且随着流速增大,降温效果逐渐减弱。【结论】与自然对流和水微喷射阵列冷却方式相比,以干冰为冷却介质的基板表面温度分别降低44.71%和23.44%;与单相射流方式相比,温度降低24.1%。干冰喷射冷却效果明显提升,温度更加均匀。展开更多
A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input volta...A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input voltages ranging from 100 Vrms to 240 Vrms, the power factor correction and average current mode control methods operating in continuous current conduction mode are designed and implemented. With the LUMILEDS emitter type LEDs, a laboratory prototype is built and measured. And from the measured results, it could be concluded that the proposed driver has many better performances such as high power factor, low current harmonic, accurate average current control and switch protection.展开更多
基金The"863"Project of National Ministry of Science and Technology(2006AA03A175)
文摘Proposed and demonstrated is a novel computer modeling method for high power light emitting diodes(LEDs). It contains geometrical structure and optical property of high power LED as well as LED dies definition with its spatial and angular distribution. Merits and non-merits of traditional modeling methods when applied to high power LEDs based on secondary optical design are discussed. Two commercial high power LEDs are simulated using the proposed computer modeling method. Correlation coefficient is proposed to compare and analyze the simulation results and manufacturing specifications. The source model is precisely demonstrated by obtaining above 99% in correlation coefficient with different surface incident angle intervals.
基金Sponsored by the Heilongjiang Provincial Project(Grant No.12511121)the Harbin City Innovation Talent Project(Grant No.2011RFXXG019)the National Science and Technology Support Project(Grant No.2012BAH28F02)
文摘In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.
文摘This paper provides an analytical approach to determine the optimum pitch by utilizing a thermal resistance network, under the assumption of constant luminous efficiency. This work allows an LED array design which is mounted on a printed circuit board (PCB) attached with a heat sink subject to the natural convection cooling. Being validated by finite element (FE) models, the current approach can be shown as an effective method for the determination of optimal component spacing in an LED array assembly for SSL.
基金Supported by the Key Technology R&D Program of Hubei Province, China (Grant No. 2006AA103A04)
文摘An active cooling solution based on close-looped micro impinging jet is proposed for high power light emitting diodes (LEDs). In this system, a micro pump is utilized to enable the fluid circulation, impinging jet is used for heat exchange between LED chips and the present system. To check the feasibility of the present cooling system, the preliminary experiments are conducted without the intention of parameter opti-mization on micro jet device and other system components. The experiment results demonstrate that the present cooling system can achieve good cooling effect. For a 16.4 W input power, the surface temperature of 2 by 2 LED array is just 44.2℃ after 10 min operation, much lower than 112.2℃, which is measured without any active cool-ing techniques at the same input power. Experimental results also show that increase in the flow rate of micro pump will greatly enhance the heat transfer efficiency, how-ever, it will increase power consumption. Therefore, it should have a trade-off be-tween the flow rate and the power consumption. To find a suitable numerical model for next step parameter optimization, numerical simulation on the above experiment system is also conducted in this paper. The comparison between numerical and ex-periment results is presented. For two by two chip array, when the input power is 4 W, the surface average temperature achieved by a steady numerical simulation is 34℃, which is close to the value of 32.8℃ obtained by surface experiment test. The simu-lation results also demonstrate that the micro jet device in the present cooling sys-tem needs parameter optimization.
基金Supported by the National Natural Science Foundation of China(Grant No.50676063)the Shanghai Leading Academic Discipline Project(Grant No.S30503
文摘A novel loop heat pipe(LHP)cooling device for high power LED is developed.The thermal capabilities, including startup performance,temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally.The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19―3.1 K/W,the temperature uniformity in the evaporator is controlled within 1.5℃,and the junction temperature of high power LED can be controlled steadily under 100℃for a heat load of 100 W.
基金Key Scientific and Technological Research Projects of Henan Province(072102240027)Dr Foundation of Henan Polytechnic University(648602)Postgraduate Degree Thesis Innovation Foundation of Henan Polytechnic University(644005)
文摘Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
文摘High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.
基金"863"Project from Ministry of Science & Technology of China(2006AA03A116)
文摘As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated by a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al5O12∶Ce3+(in short: YAG∶Ce3+). The matching of the spectrum of the blue LED chips and the YAG∶Ce3+ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high-power single-chip-white-LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high-power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.
文摘To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.
文摘A new type of high power LED drivers is proposed by adopting an improved two-stages non-isolated configuration. In order to improve power factor and achieve accurate average current control under universal input voltages ranging from 100 Vrms to 240 Vrms, the power factor correction and average current mode control methods operating in continuous current conduction mode are designed and implemented. With the LUMILEDS emitter type LEDs, a laboratory prototype is built and measured. And from the measured results, it could be concluded that the proposed driver has many better performances such as high power factor, low current harmonic, accurate average current control and switch protection.