High temperature co-fired ceramics(HTCCs) have wide applications with stable mechanical properties,but they have not yet been used to fabricate sensors.By introducing the wireless telemetric sensor system and ceramic ...High temperature co-fired ceramics(HTCCs) have wide applications with stable mechanical properties,but they have not yet been used to fabricate sensors.By introducing the wireless telemetric sensor system and ceramic structure embedding a pressure-deformable cavity,the designed sensors made from HTCC materials(zirconia and 96% alumina) are fabricated,and their capacities for the pressure measurement are tested using a wireless interrogation method.Using the fabricated sensor,a study is conducted to measure the atmospheric pressure in a sealed vessel.The experimental sensitivity of the device is 2 Hz/Pa of zirconia and 1.08 Hz/Pa of alumina below 0.5 MPa with a readout distance of 2.5 cm.The described sensor technology can be applied for monitoring of atmospheric pressure to evaluate important component parameters in harsh environments.展开更多
为了满足工作频带宽、传输速率高、功耗大、集成度高的要求,开展一种基于AlN多层高温共烧陶瓷(High Temperature Co-fired Ceramic,HTCC)基板的系统级封装(System in Package,SiP)模块封装设计研究。通过设计制作AlN多层HTCC基板、SiP...为了满足工作频带宽、传输速率高、功耗大、集成度高的要求,开展一种基于AlN多层高温共烧陶瓷(High Temperature Co-fired Ceramic,HTCC)基板的系统级封装(System in Package,SiP)模块封装设计研究。通过设计制作AlN多层HTCC基板、SiP模块封装结构电性能仿真、模块安装结构热力学仿真设计、组装工艺优化等系列研究工作研制出了小型化、轻量化、高集成的SiP模块。环境试验结果表明该模块具有良好的可靠性。该研究结果可为小型化、轻量化、高集成的SiP模块设计研发提供借鉴。展开更多
氮化铝(AlN)高温共烧陶瓷(High Temperature Co fired Ceramic,HTCC)基板具有高的热导率以及与芯片匹配的热膨胀系数,是高功率多芯片组件首选的基板材料和封装材料。为了满足封装要求的良好钎焊性能,文中采用化学镀工艺在氮化铝HTCC基...氮化铝(AlN)高温共烧陶瓷(High Temperature Co fired Ceramic,HTCC)基板具有高的热导率以及与芯片匹配的热膨胀系数,是高功率多芯片组件首选的基板材料和封装材料。为了满足封装要求的良好钎焊性能,文中采用化学镀工艺在氮化铝HTCC基板钨导体表面沉积了化学镍钯金镀层。文中对化学镀镍溶液体系和高温热处理的工艺条件进行了研究,对化学镍层的厚度进行了优化。结果表明,高温热处理促使薄镍层向基板表面钨导体扩散,进而提高化学镀层与基底之间的附着力,镀层附着力良好,满足金丝键合和锡铅焊的要求,为微波高功率组件的研制提供了技术支撑。展开更多
基金Project supported by the National Basic Research Program (973) of China (No. 2010CB334703)the National Natural Science Foundation of China (No. 51075375)
文摘High temperature co-fired ceramics(HTCCs) have wide applications with stable mechanical properties,but they have not yet been used to fabricate sensors.By introducing the wireless telemetric sensor system and ceramic structure embedding a pressure-deformable cavity,the designed sensors made from HTCC materials(zirconia and 96% alumina) are fabricated,and their capacities for the pressure measurement are tested using a wireless interrogation method.Using the fabricated sensor,a study is conducted to measure the atmospheric pressure in a sealed vessel.The experimental sensitivity of the device is 2 Hz/Pa of zirconia and 1.08 Hz/Pa of alumina below 0.5 MPa with a readout distance of 2.5 cm.The described sensor technology can be applied for monitoring of atmospheric pressure to evaluate important component parameters in harsh environments.
文摘为了满足工作频带宽、传输速率高、功耗大、集成度高的要求,开展一种基于AlN多层高温共烧陶瓷(High Temperature Co-fired Ceramic,HTCC)基板的系统级封装(System in Package,SiP)模块封装设计研究。通过设计制作AlN多层HTCC基板、SiP模块封装结构电性能仿真、模块安装结构热力学仿真设计、组装工艺优化等系列研究工作研制出了小型化、轻量化、高集成的SiP模块。环境试验结果表明该模块具有良好的可靠性。该研究结果可为小型化、轻量化、高集成的SiP模块设计研发提供借鉴。
文摘氮化铝(AlN)高温共烧陶瓷(High Temperature Co fired Ceramic,HTCC)基板具有高的热导率以及与芯片匹配的热膨胀系数,是高功率多芯片组件首选的基板材料和封装材料。为了满足封装要求的良好钎焊性能,文中采用化学镀工艺在氮化铝HTCC基板钨导体表面沉积了化学镍钯金镀层。文中对化学镀镍溶液体系和高温热处理的工艺条件进行了研究,对化学镍层的厚度进行了优化。结果表明,高温热处理促使薄镍层向基板表面钨导体扩散,进而提高化学镀层与基底之间的附着力,镀层附着力良好,满足金丝键合和锡铅焊的要求,为微波高功率组件的研制提供了技术支撑。
