Anisotropic Thermal Diffusivity Measurements in High-Thermal-Conductive Carbon-Fiber-Reinforced Plastic Composites

This paper presents the temperature dependence of in-plane thermal diffusivity and anisotropy distribution for pitch-based carbon-fiber-reinforced polymers (CFRPs). The measurement was performed using the laser-spot periodic heating method. The samples were unidirectional (UD) and crossply (CP) CFRPs. All carbon fibers of the UD samples ran in one direction, while those of the CP samples ran in two directions. In both UD and CP CFRPs, from -80°C to +80°C, temperature dependence of thermal diffusivity values increased as temperature decreased. In this temperature range, the anisotropic ratio between the fiber direction and its perpendicular direction of the UD CFRP was 106 - 124. During the anisotropy distribution measurement, it was found that thermal anisotropy can be visualized by scanning the laser in a circle on the sample. The thermal diffusivity of the UD CFRP in the fiber direction was 17 times larger than that in the 15°direction, and the thermal diffusivity in the other directions was lower than that in the 15°direction. The anisotropy distribution for the CP CFRP reflected its inhomogeneous structure.

Analysis on the Bonding Failure Mechanism of High Modulus Carbon Fiber Composites

In order to explore the bonding failure mechanism of high modulus carbon fiber composite materials,the tensile experiment and finite element numerical simulation for single-lap and bevel-lap joints of unidirectional laminates are carried out,and the stress distributions,the failure modes,and the damage contours are analyzed. The analysis shows that the main reason for the failure of the single-lap joint is that the stress concentration of the ply adjacent to the adhesive layer is serious owing to the modulus difference,and the stress cannot be effectively transmitted along the thickness direction of the laminate. When the tensile stress of the ply exceeds its ultimate strength in the loading process,the surface fiber will fail. Compared with the single-lap joint,the bevel-lap joint optimizes the stress transfer path along the thickness direction,allows each layer of the laminate to share the load,avoids the stress concentration of the surface layer,and improves the bearing capacity of the bevel-lap joint. The improved bearing capacity of the bevellap joint is twice as much as that of the single-lap joint. The research in this paper provides a new idea for the subsequent study of mechanical properties of adhesively bonded composite materials.

Preparation and 3D printing of high-thermal-conductivity continuous mesophase-pitch-based carbon fiber/epoxy composites

To meet the requirements of spacecraft for the thermal conductivity of resins and solve the problem of low thermal conduction efficiency when 3D printing complex parts,we propose a new type of continuous mesophase-pitch-based carbon fiber/thermoplastic polyurethane/epoxy(CMPCF/TPU/epoxy)composite filament and its preparation process in this study.The composite filament is based on the high thermal conductivity of CMPCF,the high elasticity of TPU,and the high-temperature resistance of epoxy.The tensile strength and thermal conductivity of the CMPCF/TPU/epoxy composite filament were tested.The CMPCF/TPU/epoxy composites are formed by 3D printing technology,and the composite filament is laid according to the direction of heat conduction so that the printed part can meet the needs of directional heat conduction.The experimental results show that the thermal conductivity of the printed sample is 40.549 W/(m·K),which is 160 times that of pure epoxy resin(0.254 W/(m·K)).It is also approximately 13 times better than that of polyacrylonitrile carbon fiber/epoxy(PAN-CF/epoxy)composites.This study breaks through the technical bottleneck of poor printability of CMPCF.It provides a new method for achieving directional thermal conductivity printing,which is important for the development of complex high-performance thermal conductivity products.

Tetris-Style Stacking Process to Tailor the Orientation of Carbon Fiber Scaffolds for Efficient Heat Dissipation

As the miniaturization of electronic devices and complication of electronic packaging,there are growing demands for thermal interfacial materials with enhanced thermal conductivity and the capability to direct the heat toward heat sink for highly efficient heat dissipation.Pitch-based carbon fiber(CF)with ultrahigh axial thermal conductivity and aspect ratios exhibits great potential for developing thermally conductive composites as TIMs.However,it is still hard to fabricate composites with aligned carbon fiber in a general approach to fully utilize its excellent axial thermal conductivity in specific direction.Here,three types of CF scaffolds with different oriented structure were developed via magnetic field-assisted Tetris-style stacking and carbonization process.By regulating the magnetic field direction and initial stacking density,the self-supporting CF scaffolds with horizontally aligned(HCS),diagonally aligned and vertically aligned(VCS)fibers were constructed.After embedding the polydimethylsiloxane(PDMS),the three composites exhibited unique heat transfer properties,and the HCS/PDMS and VCS/PDMS composites presented a high thermal conductivity of 42.18 and 45.01 W m^(−1)K^(−1)in fiber alignment direction,respectively,which were about 209 and 224 times higher than that of PDMS.The excellent thermal conductivity is mainly ascribed that the oriented CF scaffolds construct effective phonon transport pathway in the matrix.In addition,fishbone-shaped CF scaffold was also produced by multiple stacking and carbonization process,and the prepared composites exhibited a controlled heat transfer path,which can allow more versatility in the design of thermal management system.

Highly Thermally Conductive Polymer/Graphene Composites with Rapid Room‑Temperature Self‑Healing Capacity

Composites that can rapidly self-healing their structure and function at room temperature have broad application prospects.However,in view of the complexity of composite structure and composition,its self-heal is facing challenges.In this article,supramolecular effect is proposed to repair the multistage structure,mechanical and thermal properties of composite materials.A stiff and tough supramolecular frameworks of 2-[[(butylamino)carbonyl]oxy]ethyl ester(PBA)–polydimethylsiloxane(PDMS)were established using a chain extender with double amide bonds in a side chain to extend prepolymers through copolymerization.Then,by introducing the copolymer into a folded graphene film(FGf),a highly thermally conductive composite of PBA–PDMS/FGf with self-healing capacity was fabricated.The ratio of crosslinking and hydrogen bonding was optimized to ensure that PBA–PDMS could completely self-heal at room temperature in 10 min.Additionally,PBA–PDMS/FGf exhibits a high tensile strength of 2.23±0.15 MPa at break and high thermal conductivity of 13±0.2 W m^(−1)K^(−1);of which the self-healing efficiencies were 100%and 98.65%at room temperature for tensile strength and thermal conductivity,respectively.The excellent self-healing performance comes from the efficient supramolecular interaction between polymer molecules,as well as polymer molecule and graphene.This kind of thermal conductive self-healing composite has important application prospects in the heat dissipation field of next generation electronic devices in the future.

Thermo-physical Properties of Continuous Carbon Fiber Reinforced Copper Matrix Composites

Continuous carbon fiber reinforced copper matrix composites with 70%(volume fraction) of carbon fibers prepared by squeeze casting technique have been used for investigation of the coefficient of thermal expansion(CTE) and thermal conductivity.Thermo-physical properties have been measured in both,longitudinal and transversal directions to the fiber orientation.The results showed that Cf/Cu composites may be a suitable candidate for heat sinks because of its good thermo-physical properties e.g.the low CTE(4.18×10-6/K) in longitudinal orientation and(14.98×10-6/K) in transversal orientation at the range of 20-50℃,a good thermal conductivity(87.2 W/m·K) in longitudinal orientation and(58.2 W/m·K) in transversal orientation.Measured CTE and thermal conductivity values are compared with those predicted by several well-known models.Eshelby model gave better results for prediction of the CTE and thermal conductivity of the unidirectional composites.

High Alumina Fiber Composite SiO_2 Based Nanoporous Insulation Boards

The specimens were prepared with high alumina fiber accounting for 0. 5% , 10% or 15% by mass of the total amount of amorphous silica and high alumina fiber, using phenolic resin as binder, and extra-adding 0 or 0. 5% ZnO as sunscreen to cut the cost of SiO2 nanoporous insulation board. The hot volume stability and thermal conductivity （flat plate method ） of the specimens were tested and multi-Jimetion simulation equipment was used to study the thermal insulation performante. The results show that： （1） with high alumina fiber addition increasing, the linear shrinkage rate decreases, but thermal eonductivity changes a little; （2） adding ZnO can decrease thermal conductivity obviously; （3）for the specimen with ZnO and 15% of high alumina fiber, its cold face temperature hardly rises during the simulation experiment at 1 000 ℃ for 2 h, and the cold face temperature of the specimen with the smallest thickness of 2 cm doesn＇t exceed 180 ℃.

莫来石纤维增强氧化物多孔陶瓷及其性能研究

以不同规格的粉煤灰漂珠、长石粉和铝矾土粉为主要原料,引入莫来石纤维为增强相,研究莫来石纤维含量对多孔陶瓷材料性能的影响规律及作用机理。结果表明:高温下长石粉中的低熔相能够降低材料的共晶熔点,将基质间的物理界面结合转变为化学结合。样品经1100℃烧成后,随着莫来石纤维含量的增加,多孔陶瓷的闭口气孔率增加,而常温耐压强度和体积密度呈现先增大后减小的趋势。当莫来石纤维含量为10 wt.%时,材料具有最佳综合性能,其体积密度为(0.74±0.01)g·cm^(−3)、真气孔率为(72.70±0.58)%,常温下耐压强度为(7.30±0.64)MPa。此外,试样在300℃、600℃及900℃下的平均热导率分别为0.202 W·m^(−1)·K^(−1)、0.214 W·m^(−1)·K^(−1)及0.244 W·m^(−1)·K^(−1)。

Microstructure, thermophysical property and ablation behavior of high thermal conductivity carbon/carbon composites after heat-treatment

Uni-directional carbon/carbon composites with high thermal conductivity are suitable to supply continuous thermal protection for future reentry vehicles since they could reduce surface temperature and ablation rates simultaneously in harsh environments.In this work,the high thermal conductivity carbon/carbon composites were prepared by chemical vapor infiltration.After heat-treatment,both their open porosity and internal friction increase due to the fiber/matrix thermal expansion mismatch;while their thermal conductive performance become better due to more complete carbon structure.With raising heat-treatment temperature from 1800℃to 2450℃,the mass and linear ablation rates of C/C composites with fibers vertical to the oxyacetylene torch for 60 s decrease from 0.66 mg/s and 2.95μm/s to 0.51 mg/s and 2.05μm/s respectively.The improved ablation resistance is resulted from the increased thermal conductivity from 282 to 508 W/(m·K)and more carbon fibers exposed to the flame during ablation,which have better oxidation resistance than those of carbon matrix.While such ablation rates become larger for composites with fibers parallel to the flame,from 1.02 mg/s and 3.73μm/s to 1.28 mg/s and 5.0μm/s respectively since the ablation occurred more easily through gaps at the fiber/matrix interfaces,which become larger and are always exposed to the flame for this case.

Thermal conductivity and bending strength of SiC composites reinforced by pitch-based carbon fibers

In this work,pitch-based carbon fibers were utilized to reinforce silicon carbide(SiC)composites via reaction melting infiltration(RMI)method by controlling the reaction temperature and resin carbon content.Thermal conductivities and bending strengths of composites obtained under different preparation conditions were characterized by various analytical methods.Results showed the formation of SiC whiskers(SiC_(w))during RMI process according to vapor–solid(VS)mechanism.SiC_(w) played an important role in toughening the C_(pf)/SiC composites due to crack bridging,crack deflection,and SiC_(w) pull-out.Increase in reaction temperature during RMI process led to an initial increase in thermal conductivity along in-plane and thickness directions of composites,followed by a decline.At reaction temperature of 1600℃,thermal conductivities along the in-plane and thickness directions were estimated to be 203.00 and 39.59 W/(m×K),respectively.Under these conditions,bending strength was recorded as 186.15±3.95 MPa.Increase in resin carbon content before RMI process led to the generation of more SiC matrix.Thermal conductivities along in-plane and thickness directions remained stable with desirable values of 175.79 and 38.86 W/(m×K),respectively.By comparison,optimal bending strength improved to 244.62±3.07 MPa.In sum,these findings look promising for future application of pitch-based carbon fibers for reinforcement of SiC ceramic composites.

基于工程化设备通过调控纺丝温度提高中间相沥青炭纤维力学和导热性能

基于工程化设备,在恒定挤出量条件下,通过调控纺丝温度制备了中间相沥青炭纤维(MPCFs),探究纺丝温度对MPCFs微观结构、力学和导热性能的影响。结果表明:随着纺丝温度由309升高至320℃,MPCFs的微观结构由石墨片层细小的褶皱劈裂辐射状结构逐步向石墨片层粗大的劈裂辐射状结构转变,拉伸强度由2.16增大到3.23 GPa,热导率由704升高到1078 W·m^(−1)·K^(−1)。这主要是因为纺丝温度越高,沥青熔体黏度越小,喷丝口处挤出胀大效应越弱,沥青熔体在喷丝孔流道内形成的微晶取向得以保持,以此制备的炭纤维具有更大的晶体尺寸和更高的微晶取向。

预氧化碳纤维增强受电弓碳滑板材料的研究

利用预氧化碳纤维(OPF)和沥青、焦炭等为原料,采用热压、焙烧等工艺制备预氧化碳纤维增强受电弓碳滑板;研究不同OPF含量受电弓碳滑板导电导热以及力学性能;利用扫描电镜(SEM)、偏光显微镜(POM)、X射线衍射仪(XRD)等仪器对复合材料内部结构进行观察。结果表明:滑板材料性能的提升与OPF/沥青间的共碳化界面以及界面处与基体中的微晶网络形成有关。OPF质量分数为1.5%的复合材料具有较好的导电导热以及力学性能,电导率和导热系数分别为279.33 S/cm和3.37 W/(m·K),抗压强度和抗折分别为155.00、48.85 MPa,且符合受电弓碳滑板性能要求。

生物质多孔碳复合相变材料制备和热性能研究

将木材通过高温碳化的方法制备三维生物质碳基材料用于相变材料载体,制备复合相变材料,并对复合相变材料进行结构表征、性能测试及防泄漏实验。结果表明:多孔碳载体材料导热孔道网络完整,保证了有机相变材料的高效稳定负载量;相比于纯相变材料,70%PA@GNS热导系数达到了0.763W/(m·K),提高了3.18倍;含有20%多孔碳复合材料的潜热值达到了182J/g,比理论值潜热值高了约7%;并能有效防止相变材料泄漏。

大展弦比混杂纤维复合材料机翼的强度及失效分析

以大展弦比机翼为研究对象,基于经典层合板理论和Tsai-Wu失效准则,考虑几何非线性效应,用流固耦合数值模拟方法,重点研究碳/玻纤维混杂比、铺层相对位置、铺层角度对机翼强度及失效特性的影响。研究表明:碳/玻纤维混杂比=8∶2为最佳纤维混杂比,机翼可兼顾高强度、低成本;玻璃纤维铺设在蒙皮对称中面位置时,机翼的强度及安全性更高,玻璃纤维铺设位置的变化不会对机翼的弹性变形产生显著影响;在不同混杂比下,以±45°铺层角度铺设的机翼整体力学性能更稳定,失效概率更低。

高导热沥青基碳纤维复合材料在航天器中的应用现状及展望

随着新一代航天器不断朝着超大型化、微小型化、高效能化方向发展,航天器对轻质高强高模高导热材料的需求日益迫切。相比传统的聚丙烯腈(PAN)基碳纤维,高导热沥青基碳纤维具有超高的热导率、更高的拉伸模量以及更低的热膨胀系数,是实现承载/传热/热尺寸稳定性功能一体化的理想材料,在航天领域得到了重要应用并展现出巨大应用前景。本文介绍了高导热沥青基碳纤维及其复合材料的性能特点、发展现状以及在航天器中的应用现状,重点从航天器热管理结构、热防护结构、高尺寸稳定性结构、多功能结构、电子设备外壳等方面综述了其应用现状,最后对高导热沥青基碳纤维复合材料的发展及应用前景进行了展望。

不同形态回收碳纤维水泥基材料的力学与导电性能

将碳纤维生命周期内产生的预浸料、织物及复合材料废弃物通过切割与粉碎制备短切回收碳纤维(CRCF)、回收碳纤维球(RCFS)及回收碳纤维粉(RCFP),研究不同形态回收碳纤维对水泥基材料力学与导电性能的影响机理和规律。结果表明,CRCF阻裂作用与RCFP填充孔隙作用使水泥基材料抗压强度和抗折强度显著提升,但RCFS的团聚导致其提升效果不显著。CRCF在水泥基材料内部搭接形成导电通路,电阻率随CRCF掺量的增加而降低,下降幅度超过90%,且渗滤阈值的掺量随CRCF长度的增大而显著降低。RCFS掺入基体后以孤立的球状形态分散在基体中,RCFP表面残留的树脂会阻碍导电通路的形成,这两种形态的回收碳纤维水泥基材料的电阻率降低幅度均小于10.7%。将CRCF水泥基材料中的电阻分为纤维通路电阻、纤维接触电阻和隧道传输电阻,建立了导电模型,模型误差为9.24%~40.1%。

树脂基防隔热一体化热防护复合材料高温性能演变分析

采用溶胶-凝胶-常压干燥的方法,以耐热杂化酚醛树脂(PF)为基体,复合碳纤维编织物(CF)制备树脂基防隔热一体化热防护复合材料(PF/CF-HT01)。利用热分析(TG)、电子万能试验机研究材料热稳定性和高温力学性能,利用氧乙炔装置研究材料耐烧蚀性能,利用扫描电子显微镜(SEM)、X线衍射仪(XRD)研究材料微观结构演变过程。结果表明:空气中树脂基体的初始分解温度为387.3℃,最大分解温度为644.7℃,800℃时残炭率为13.8%;复合材料初始分解温度为405.3℃,800℃时残炭率为42.8%;复合材料常温压缩强度最大为542.6 MPa,经1 000℃原位热处理30和60 s后的最大压缩强度分别为166.2和149.9 MPa。复合材料具有良好的防隔热一体化性能,其线烧蚀率可达0.039 mm/s,单次热考核结束时背温低于100℃、继续热传导后最高背温低于200℃。高温作用下材料快速陶瓷化形成致密的SiO2和BN瓷化层,赋予材料突出的耐烧蚀抗冲刷性能,而底层仍然保留着多孔结构使得材料保持较好的隔热性能。

碳纤维复合材料高温界面性能研究进展

碳纤维复合材料以其强度高、耐腐蚀、质量轻、抗疲劳等优良特性被广泛应用于航空航天及国防军工领域。然而,航空航天用复合材料结构部件在高温、湿热环境中会发生界面损伤和失效。上浆剂是碳纤维复合材料界面相的重要组成部分,研制可以增强界面强度和耐高温的上浆剂对提高复合材料的热力学性能具有重要意义。文中从碳纤维表面上浆剂的角度出发,重点介绍了碳纤维复合材料界面特性、上浆剂的作用机理以及高温下复合材料界面的破坏机制。最后,针对环氧上浆剂耐热性差的缺点,阐述了碳纤维耐高温涂层改性和纳米粒子改性,重点介绍了聚酰亚胺、聚醚醚酮、生物活性多巴胺及氧化石墨烯、多面体低聚倍半硅氧烷(POSS)纳米粒子等类型改性上浆剂的研究进展。指出发展环境友好型上浆剂和POSS纳米粒子改性将是下一步工作的重点。

碳纤维复合材料在高速列车车辆制动系统中的应用

深入剖析碳纤维复合材料在高速列车制动系统领域的实际应用,探讨其性能优化与成本效益分析,探讨碳纤维复合材料在高速列车车辆制动系统中的应用创新,全面阐述了其在高速列车车辆制动系统上的应用价值,并且探索了全生命周期管理的重要性,并强调了合作与协同的必要性,同时,揭示碳纤维材料在发展高速列车车辆制动系统技术方面所具有的巨大潜力和光明前景,以促进行业全面发展和进步。

纤维增强碳化硅陶瓷基复合材料高导热性能研究进展

作为一种先进的高温结构及功能材料,高效传热和高温耐热相结合对纤维增强碳化硅陶瓷基复合材料(silicon carbide matrix composites,SiC CMC)在热管理领域(thermal management,TM)中的应用至关重要。常见的纤维增强碳化硅陶瓷基复合材料,如碳纤维增强碳化硅陶瓷基复合材料(C_(f)/SiC或C_(f)/C-SiC)、碳化硅纤维增强碳化硅陶瓷基复合材料(SiC_(f)/SiC)等,增强纤维的石墨化程度较低,难以形成有效的热输运网络。本文综述了纤维增强碳化硅陶瓷基复合材料制备及高导热性能等方面的最新研究进展。可通过引入高导热相、优化界面结构、粗粒化碳化硅晶体、设计预制体结构等方式提高纤维增强碳化硅陶瓷基复合材料的热输运能力。此外,展望了纤维增强碳化硅陶瓷基复合材料发展趋势,即综合考虑影响高导热碳化硅陶瓷基复合材料性能要素,灵活运用复合材料结构与性能的构效关系,以期制备尺寸稳定、性能优异的纤维增强碳化硅陶瓷基复合材料。