Petrogenesis of the Langdu High-K Calc-Alkaline Intrusions in Yunnan Province: Constraints from Geochemistry and Sr-Nd Isotopes

The Langdu high-K calc-alkaline intrusions are located in the Zhongdian area, which is the southern part of the Yidun island arc. These intrusive rocks consist mainly of monzonite porphyry, granodiorite, and diorite porphyry. The K20 content of majority of these rocks is greater than 3%, and, in the K20-SiO2 diagram, all the samples fall into the high-K calc-alkaline to shoshonitic fields. They are enriched in light rare earth elements （LREEs） and depleted in heavy rare earth elements （HREEs; LaN/YbN = 14.3-21.2）, and show slightly negative Eu anomalies （6Eu = 0.77-1.00）. These rocks have high K, Rb, Sr, and Ba contents; moderate to high enrichment of compatible elements （Cr = 36.7-79.9 ppm, Co = 9.6-16.4 ppm, and MgO = 2.2%-3.4%）; low Nb, Ta, and Ti contents, and characteristic of low high field strength elements（HFSEs） versus incompatible elements ratios （Nb/Th = 0.75, Nb/La = 0.34） and incompatible elements ratios （Nb/U = 3.0 and Ce/Pb = 5.1, Ba/Rb = 12.0）. These rocks exhibit restricted Sr and Nd isotopic compositions, with （87Sr/S6Sr）i values ranging from 0.7044 to 0.7069 and ENd（t） values from -2.8 to -2.2. The Sr-Nd isotope systematic and specific trace element ratios suggest that Langdu high-K calc-alkaline intrusive rocks derived from a metasomatized mantle source. The unique geochemical feature of intrusive rocks can be modeled successfully using different members of a slightly enriched mantle, a slab-derived fluid, and terrigenous sediments. It can be inferred that the degree of partial melting and the presence of specific components are temporally related to the tectonic evolution of the Zhongdian island arc. Formation of these rocks can be explained by the various degrees of melting within an ascending region of the slightly enriched mantle, triggered by the subduction of the Garz^--Litang ocean, and an interaction between the slab-derived fluid and the terrigenous sediments.

Geochemical characteristics and origin of the Neoproterozoic high-K calc-alkaline granitoids in the northern part of Mandara hills,northeastern Nigeria

The high-K calc-alkaline granitoids in the northern part of the Mandara Hills are part of the wellexposed post-collisional plutons in northeastern Nigeria.The calc-alkaline rock association consists of quartz monzodiorite,hornblende biotite granite,biotite granites and aplite which intruded the older basement consisting mainly of low-lying migmatitic gneisses and amphibolites during the Neoproterozoic Pan-African Orogeny.Petrological and geochemical studies have revealed the presence of hornblende,iron oxide,and metaluminous to slightly peraluminous characteristics in the granitoids which is typical of I-type granite.The granitoids are also depleted in some high field strength elements(e.g.Nb and Ta) as well as Ti.Plots of Mg#versus SiO2 indicate that the granite was derived from partial melting of crustal sources.Lithospheric delamination at the waning stage of the PanAfrican Orogeny possibly triggered upwelling of hot mafic magma from the mantle which underplated the lower crust.This,in turn,caused partial melting and magma generation at the lower to middle-crustal level.However,the peculiar geochemical characteristics of the quartz monzodiorite especially the enrichment in compatible elements such as MgO,Cr,and Ni,as well as LILE element(e.g.K,Ce,Cs,Ba,and Sr),signify that the rock formed from an enriched upper mantle source.The emplacement of high-K granites in the Madara Hill,therefore,marked an important episode of crustal reworking during the Neoproterozoic.However,further isotopic work is needed to confirm this model.

Petrological and Structural Approach to Understanding the Mechanism of Formation and Development of Paleoproterozoic Calc-Alkaline Volcanic Rocks of West Africa’s Craton: An Example of the Mako and Foulde Groups (Kedougou Inlier in Western Senegal)

The calc-alkaline volcanic formations in the western part of the Kedougou-Kenieba inlier crop out in three complexes: the Foulde in the North and the areas of Mako and Baniomba in the South. These complexes which either combine with the tholeiites or cut across the sedimentary formations are composed of thin veins and massive lava flows. They have many petrographic similarities and show chemical characteristics that resemble those of island-arc rocks. At the tectonic level, the D1 deformation phase preceding the formation of the basins and the transpressive tectonics including an oblique convergence may account for the structural evolution of the Mako volcanic belt. Its occurrence in different basins may be evidenced by the composition of some lithophilic components like the Sr, Ba, U, Rb and the composition of clinopyroxenes enriched in TiO2, FeO, Na2O in the Foulde calc-alkaline volcanic rocks that developed in a sedimentary environment.

Petrogenesis of Late Mesozoic Calc-Alkaline Lamprophyres from Sulu UHP Terrane, Eastern China: Implications to Paleo-Pacific Plate Subduction and Destruction of the North China Craton

Destruction of the North China Craton has caused extensive concern on its multiple potential mechanisms including thermal erosion,chemical erosion and delamination.It is widely accepted that thinning of the

A novel SiC high-k superjunction power MOSFET integrated Schottky barrier diode with improved forward and reverse performance

A new SiC superjunction power MOSFET device using high-k insulator and p-type pillar with an integrated Schottky barrier diode(Hk-SJ-SBD MOSFET)is proposed,and has been compared with the SiC high-k MOSFET(Hk MOSFET),SiC superjuction MOSFET(SJ MOSFET)and the conventional SiC MOSFET in this article.In the proposed SiC Hk-SJ-SBD MOSFET,under the combined action of the p-type region and the Hk dielectric layer in the drift region,the concentration of the N-drift region and the current spreading layer can be increased to achieve an ultra-low specific on-resistance(Ron,sp).The integrated Schottky barrier diode(SBD)also greatly improves the reverse recovery performance of the device.TCAD simulation results indicate that the Ron,sp of the proposed SiC Hk-SJ-SBD MOSFET is 0.67 mΩ·cm^(2)with a 2240 V breakdown voltage(BV),which is more than 72.4%,23%,5.6%lower than that of the conventional SiC MOSFET,Hk SiC MOSFET and SJ SiC MOSFET with the 1950,2220,and 2220V BV,respectively.The reverse recovery time and reverse recovery charge of the proposed MOSFET is 16 ns and18 nC,which are greatly reduced by more than 74%and 94%in comparison with those of all the conventional SiC MOSFET,Hk SiC MOSFET and SJ SiC MOSFET,due to the integrated SBD in the proposed MOSFET.And the trade-off relationship between the Ron,sp and the BV is also significantly improved compared with that of the conventional MOSFET,Hk MOSFET and SJ MOSFET as well as the MOSFETs in other previous literature,respectively.In addition,compared with conventional SJ SiC MOSFET,the proposed SiC MOSFET has better immunity to charge imbalance,which may bring great application prospects.

Investigation of degradation and recovery characteristics of NBTI in 28-nm high-k metal gate process

Degradation induced by the negative bias temperature instability(NBTI)can be attributed to three mutually uncoupled physical mechanisms,i.e.,the generation of interface traps(ΔV_(IT)),hole trapping in pre-existing gate oxide defects(ΔV_(HT)),and the generation of gate oxide defects(ΔV_(OT)).In this work,the characteristic of NBTI for p-type MOSFET fabricated by using a 28-nm high-k metal gate(HKMG)process is thoroughly studied.The experimental results show that the degradation is enhanced at a larger stress bias and higher temperature.The effects of the three underlying subcomponents are evaluated by using the comprehensive models.It is found that the generation of interface traps dominates the NBTI degradation during long-time NBTI stress.Moreover,the NBTI parameters of the power-law time exponent and temperature activation energy as well as the gate oxide field acceleration are extracted.The dependence of operating lifetime on stress bias and temperature is also discussed.It is observed that NBTI lifetime significantly decreases as the stress increases.Furthermore,the decrease of charges related to interface traps and hole detrapping in pre-existing gate oxide defects are used to explain the recovery mechanism after stress.

WS_(2)场效应晶体管的表面电子掺杂

二硫化钨(WS_(2))属于过渡金属硫族化合物(TMDs)材料,具有较宽的可调带隙(1.3~2.1 e V),缺陷密度相对较低,且有超高的表面积比,可通过外界掺杂或相变处理来改善载流子传输性能,在低功耗场效应晶体管和超灵敏光电探测器等领域有广阔的应用前景。采用微机械剥离的方法将多层WS_(2)薄膜转移到氧化铪(HfO2)介质层上,制备出具有高栅控、低功耗的WS_(2)背栅场效应晶体管,通过注入三乙胺(TEA)实现WS_(2)薄膜的表面电子掺杂。实验结果表明,修饰后的多层WS_(2)薄膜的面内振动模式有轻微位移,拉曼特征峰强度变弱,证明三乙胺溶液能有效增加WS_(2)薄膜内的电子浓度;薄膜与金属电极之间的欧姆接触良好,器件的电子迁移率由10.87 cm^(2)·V^(-1)·s^(-1)提升到24.89 cm^(2)·V^(-1)·s^(-1),室温下的电流开关比保持在106,亚阈值摆幅为190.11 m V/dec。结合理论分析TEA对WS_(2)原子薄层的掺杂机理,TEA通过表面电荷转移的方式来增加WS_(2)半导体内的电子浓度,完成WS_(2)背栅场效应晶体管的n型掺杂。器件较高的电流开关比及电子迁移率的提升证明了TEA的表面修饰能有效调控多层WS_(2)晶体管器件的电子传输特性。

High-k材料研究进展与存在的问题

随着集成电路的飞速发展,SiO2作为传统的栅介质将不能满足MOSFET器件高集成度的要求,需要一种新型High-k材料来代替传统的SiO2,这就要综合考虑以下几个方面问题:(1)介电常数和势垒高度;(2)热稳定性;(3)薄膜形态;(4)界面质量;(5)与Si基栅兼容;(6)工艺兼容性;(7)可靠性。本文综述了几类High-k栅介质材料的研究现状及存在的问题。目前任何一种有望替代SiO2的栅介质材料都不能完全满足上述几点要求。但是,科学工作者们已经发现了几种有希望的High-k候选材料。

TiO_2/Al_2O_3堆栈结构high-k薄膜的制备及性能

采用磁控溅射法制备了TiO_2/Al_2O_3堆栈结构高k栅介质薄膜,研究了不同后处理条件对等效氧化物厚度,界面电荷和界面扩散的影响。实验结果表明:400℃退火后,TiO_2已经结晶,退火可以降低漏电流密度和介电层中的电荷密度。同时,退火使Ti进一步向Al_2O3层扩散,形成TiO_2和Al_2O_3的混合层,Al_2O_3层过薄时不能有效阻挡TiO_2的扩散。

High-k材料MOS器件的PISCES-II模拟

High-k材料是指介电常数k高于SiO2的材料。使用high-k材料做栅绝缘层,是减小MOS器件栅绝缘层直接隧道击穿(DirectTunneling,DT)电流的有效方法。文章在二维器件模拟软件PISCES-II中添加了模拟以high-k材料为栅绝缘层的MOS器件模型,并对SiO2和high-k材料的MOS晶体管器件特性进行了模拟比较,成功地验证了所加high-k材料MOS器件模型的正确性。改进后的PISCES-II程序,可以方便地对以各种high-k材料为栅绝缘层的器件性能进行模拟。

A Frequency-Independent Equivalent Circuit for High-k Stacked Monolithic Transformers

A new 2-Π lumped element equivalent circuit model for high-k stacked on-chip transformers is proposed. The model parameters are extracted with high precision, mainly based on analytical methods. The developed model enables fast and accurate time domain transient analysis and noise analysis in RFIC simulation since all elements in the model are fre- quency independent. The validity of the proposed model has been demonstrated by a fabricated monolithic stacked trans- former in TSMC＇s 0.13μm mixed-signal （MS）/RF CMOS＇ process.

Early Paleozoic basement diorite of arc-magmatism from Kutch basin, Western India

In this study,we report for thefirst time an Early Palaeozoic basement diorite from the drilled well Nirona-A in the Banni Half-Graben of the Kutch basin,western India.The 40Ar–39Ar dates provided a plateau age of 441.84±2.66 Ma and another pseudo plateau of 441.28±5.82 to 388.08±16.65 Ma for the basement diorite.These ages constrain the basement formation age to the Late Ordovician-Early Silurian period.The obtained basement ages are correlatable with the later part of Cambro-Ordovician alkaline magmatism that has been reported from the Huqf area in Central Oman,whereas their lithological and petrographic correlativity with base-ment diorites occurring in the Dinsi Body of Nagar Parkar igneous complex in Pakistan can also be envisaged.The geochemical studies characterized the diorite with enrich-ment of LILE(Rb,Ba,and K)and LREE(La,Ce,Nd),strong depletion of HFSE(Nb,Sr,P,and Ti),along with weakly negative Eu anomalies.The geochemical signatures indicate their petrogenetic affiliation with mantle-derived magmas,as well as their tectonic setting to be arc-related,having post-collisional continental-arc type affinity.The*440 Ma basement of Kutch,therefore,appears to rep-resent the later thermal event associated with the reworked Neoproterozoic subduction-related suite from Greater India’s northwest edge,which has implications for Gond-wana assembly in the northwest Indian subcontinent.

Numerical and analytical investigations for the SOI LDMOS with alternated high-k dielectric and step doped silicon pillars

This paper presents a new silicon-on-insulator(SOI) lateral-double-diffused metal-oxide-semiconductor transistor(LDMOST) device with alternated high-k dielectric and step doped silicon pillars(HKSD device). Due to the modulation of step doping technology and high-k dielectric on the electric field and doped profile of each zone, the HKSD device shows a greater performance. The analytical models of the potential, electric field, optimal breakdown voltage, and optimal doped profile are derived. The analytical results and the simulated results are basically consistent, which confirms the proposed model suitable for the HKSD device. The potential and electric field modulation mechanism are investigated based on the simulation and analytical models. Furthermore, the influence of the parameters on the breakdown voltage(BV) and specific on-resistance(R_(on,sp)) are obtained. The results indicate that the HKSD device has a higher BV and lower R_(on,sp) compared to the SD device and HK device.

Fabrication and characteristics of high-K HfO2 gate dielectrics on n-germanium

This paper reports that the high-K HfO2 gate dielectrics are fabricated on n-germanium substrates by sputtering Hf on Ge and following by a furnace annealing. The impacts of sputtering ambient, annealing ambient and annealing temperature on the electrical properties of high-K HfO2 gate dielectrics on germanium substrates are investigated. Experimental results indicate that high-K HfO2 gate dielectrics on germanium substrates with good electrical characteristics are obtained, the electrical properties of high-K HfO2 gate dielectrics is strongly correlated with sputtering ambient, annealing ambient and annealing temperature.

First Evidence of Lamprophyric Magmatism from the Konya Region, Turkey:a Genetic Link to High-K Volcanism

In the vicinity of Konya （Turkey）,mafic,micro-porphyritic sub-volcanic rocks intrude into the Mesozoic units,which represents the only example of such a rock type in the region.40Ar/39Ar dating of two whole rock samples from the sub-volcanics gave ages of 13.72±0.13 and 12.40±0.11 Ma,suggesting temporal association to the Late Miocene-Pliocene high-K calc-alkaline volcanism in the region.The mineral chemistry and geochemical data permit us to classify the rocks as ＂minette＂ lamprophyres.They include diopside and phlogopite phenocrysts in a microcrystalline groundmass composed of sanidine,phlogopite,diopside and titano-magnetite.Segregation and ocelli-like globular structures occur commonly in the samples.In terms of major elements,the lamprophyres are calcalkaline,and potassic to ultrapotassic rocks.All the lamprophyres display strong enrichments in LILE （Rb,Ba,K,Sr）,radiogenic elements （Th,U） and LREE （La,Ce） and prominent negative Nb,Ta,and Ti anomalies on primordial mantle-normalized trace element diagrams.Geochemical data suggest that the lamprophyres and high-K calc-alkaline rocks in the region derived from a subduction-modified lithospheric mantle source affected by different metasomatic events.Lamprophyric magmatism sourced phlogopite-bearing veins generated by sediment-related metasomatism via subduction,but high-K calc-alkaline magmas are possibly derived from a mantle source affected by fluid-rich metasomatism.

High performance trench MOS barrier Schottky diode with high-k gate oxide

A novel trench MOS barrier Schottky diode（TMBS） device with a high-k material introduced into the gate insulator is reported, which is named high-k TMBS. By simulation with Medici, it is found that the high-k TMBS can have 19.8% lower leakage current while maintaining the same breakdown voltage and forward turn-on voltage compared with the conventional regular trench TMBS.

Effect of interface-roughness scattering on mobility degradation in SiGe p-MOSFETs with a high-k dielectric/SiO2 gate stack＊

A physical model for mobility degradation by interface-roughness scattering and Coulomb scattering is proposed for SiGe p-MOSFET with a high-k dielectric/SiO2 gate stack. Impacts of the two kinds of scatterings on mobility degradation are investigated. Effects of interlayer （SiO2） thickness and permittivities of the high-k dielectric and interlayer on carrier mobility are also discussed. It is shown that a smooth interface between high-k dielectric and interlayer, as well as moderate permittivities of high-k dielectrics, is highly desired to improve carriers mobility while keeping alow equivalent oxide thickness. Simulated results agree reasonably with experimental data.

Challenges in Atomic-Scale Characterization of High-k Dielectrics and Metal Gate Electrodes for Advanced CMOS Gate Stacks

The decreasing feature sizes in complementary metal-oxide semiconductor （CMOS） transistor technology will require the replacement of SiO2 with gate dielectrics that have a high dielectric constant （high-k） because as the SiO2 gate thickness is reduced below 1.4 nm, electron tunnelling effects and high leakage currents occur in SiO2, which present serious obstacles to future device reliability. In recent years significant progress has been made on the screening and selection of high-k gate dielectrics, understanding their physical properties, and their integration into CMOS technology. Now the family of hafnium oxide-based materials has emerged as the leading candidate for high-k gate dielectrics due to their excellent physical properties. It is also realized that the high-k oxides must be implemented in conjunction with metal gate electrodes to get sufficient potential for CMOS continue scaling. In the advanced nanoscale Si-based CMOS devices, the composition and thickness of interfacial layers in the gate stacks determine the critical performance of devices. Therefore, detailed atomic- scale understandings of the microstructures and interfacial structures built in the advanced CMOS gate stacks, are highly required. In this paper, several high-resolution electron, ion, and photon-based techniques currently used to characterize the high-k gate dielectrics and interfaces at atomic-scale, are reviewed. Particularly, we critically review the research progress on the characterization of interface behavior and structural evolution in the high-k gate dielectrics by high-resolution transmission electron microscopy （HRTEM） and the related techniques based on scanning transmission electron microscopy （STEM）, including high-angle annular dark- field （HAADF） imaging （also known as Z-contrast imaging）, electron energy-loss spectroscopy （EELS）, and energy dispersive X-ray spectroscopy （EDS）, due to that HRTEM and STEM have become essential metrology tools for characterizing the dielectric gate stacks in the present and future generations of CMOS devices. In Section 1 of this review, the working principles of each technique are briefly introduced and their key features are outlined. In Section 2, microstructural characterizations of high-k gate dielectrics at atomic-scale by electron microscopy are critically reviewed by citing some recent results reported on high-k gate dielectrics. In Section 3, metal gate electrodes and the interfacial structures between high-k dielectrics and metal gates are discussed. The electron beam damage effects in high-k gate stacks are also evaluated, and their origins and prevention are described in Section 4. Finally, we end this review with personal perspectives towards the future challenges of atomic-scale material characterization in advanced CMOS gate stacks.

Current Progress of Hf(Zr)-Based High-k Gate Dielectric Thin Films

With the continued downscaling of complementary metal-oxide-semiconductor field effect transistor dimensions, high-dielectric constant （high-k） gate materials, as alternatives to SiO2, have been extensively investigated. Hf （Zr）-based high-k gate dielectric thin films have been regarded as the most promising candidates for high-k gate dielectric according to the International Technology Roadmap for Semiconductor due to their excellent physical properties and performance. This paper reviews the recent progress on Hf （Zr）-based high-k gate dielectrics based on PVD （physical vapor deposition） process. This article begins with a survey of various methods developed for generating Hf （Zr）-based high-k gate dielectrics, and then mainly focuses on microstructure, synthesis, characterization, formation mechanisms of interfacial layer, and optical properties of Hf （Zr）-based high-k gate dielectrics. Finally, this review concludes with personal perspectives towards future research on Hf （Zr）-based high-k gate dielectrics.

Analysis of flatband voltage shift of metal/high-k/SiO_2/Si stack based on energy band alignment of entire gate stack

A theoretical model of flatband voltage （VFB） of metal/high-k/Si02/Si stack is proposed based on band alignment of entire gate stack, i.e., the VFB is obtained by simultaneously considering band alignments of metal/high-k, high-k/SiO2 and SiO2/Si interfaces, and their interactions. Then the VFB of TiN/HfO2/SiO2/Si stack is experimentally obtained and theoretically investigated by this model. The theoretical calculations are in good agreement with the experimental results. Furthermore, both positive VFB shift of TiN/HfO2/SiO2/Si stack and Fermi level pinning are successfully interpreted and attributed to the dielectric contact induced gap states at TiN/HfO2 and HfO2/SiO2 interfaces.