A triaxial high-g accelerometer of microelectro mechanical systems （MEMS） has a struc- ture of multi-chips combination and will be used in aerospace field, civil and military fields. The ac- celerometer can measure ...A triaxial high-g accelerometer of microelectro mechanical systems （MEMS） has a struc- ture of multi-chips combination and will be used in aerospace field, civil and military fields. The ac- celerometer can measure the acceleration of the carrier. The chips with island-membrane structures on its back surfaces are made by MEMS dry processing. The chip is reasonable and can work well under high impact load; Titanium alloy base is also stronger in high shock environment, these are proved by finite element analysis. Finally, the MEMS combined triaxial high-g accelerometer is vali- dated by high impact calibration experiments in order to get a key performance index, including range, sensitivity and transverse sensitivity and so on. These data can satisfy the need of design but some problems remain, these will be eliminated by improvement of the processing technology and materials.展开更多
The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （ge...The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （generated in the Hopkinson bar with widths about 70 μs） no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC＇s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.展开更多
基金Supported by the National Natural Science Foundation of China(61273346)the National Defense Major Fundamental Research Program of China(20110003)+3 种基金the National Defense Key Fundamental Research Program of China(20132010)Specialized Research Fund for the Doctoral Program of Higher Education(20121101120009)Excellent Young Scholars Research Fund of Beijing Institute of Technology(2012YG0203)the Program for the Fundamental Research of Beijing Institute of Technology(2015CX02034)
文摘A triaxial high-g accelerometer of microelectro mechanical systems （MEMS） has a struc- ture of multi-chips combination and will be used in aerospace field, civil and military fields. The ac- celerometer can measure the acceleration of the carrier. The chips with island-membrane structures on its back surfaces are made by MEMS dry processing. The chip is reasonable and can work well under high impact load; Titanium alloy base is also stronger in high shock environment, these are proved by finite element analysis. Finally, the MEMS combined triaxial high-g accelerometer is vali- dated by high impact calibration experiments in order to get a key performance index, including range, sensitivity and transverse sensitivity and so on. These data can satisfy the need of design but some problems remain, these will be eliminated by improvement of the processing technology and materials.
基金Funded by the State Key Laboratory Foundation of China (No.9140C120704060C12)the Science and Technology Development Project of Universiti-esin of Shanxi Province
文摘The behavior of resistance high-g impact of EMC （epoxy molding compound） with two package models, small outline package （POS） and Globtop, was evaluated by experimental method used Hopkinson bar. At 120,000 g （generated in the Hopkinson bar with widths about 70 μs） no damage in either the POS devices or the Globtop devices was observed. In order to enhance the EMC＇s ability of resistance high-g impact, buffering effect of epoxy resin was also studied. The experimental results above all show that EMC has a better performance of impact resistance at about 120,000 g, and epoxy resin can absorb the stress wave to have the protected ability. The study of this paper could serve as a basis for selection packaging materials and enhance its reliability in high-g impact environment.
