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Improvement of the high-k/Ge interface thermal stability using an in-situ ozone treatment characterized by conductive atomic force microscopy
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作者 樊继斌 程晓姣 +2 位作者 刘红侠 王树龙 段理 《Chinese Physics B》 SCIE EI CAS CSCD 2017年第8期456-461,共6页
In this work, an in-situ ozone treatment is carried out to improve the interface thermal stability of HfO_2/Al_2O_3 gate stack on germanium(Ge) substrate. The micrometer scale level of HfO_2/Al_2O_3 gate stack on Ge... In this work, an in-situ ozone treatment is carried out to improve the interface thermal stability of HfO_2/Al_2O_3 gate stack on germanium(Ge) substrate. The micrometer scale level of HfO_2/Al_2O_3 gate stack on Ge is studied using conductive atomic force microscopy(AFM) with a conductive tip. The initial results indicate that comparing with a non insitu ozone treated sample, the interface thermal stability of the sample with an in-situ ozone treatment can be substantially improved after annealing. As a result, void-free surface, low conductive spots, low leakage current density, and relative high breakdown voltage high-κ/Ge are obtained. A detailed analysis is performed to confirm the origins of the changes.All results indicate that in-situ ozone treatment is a promising method to improve the interface properties of Ge-based three-dimensional(3D) devices in future technology nodes. 展开更多
关键词 high-k conductive atomic force microscopy in-situ ozone annealing
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