Design and Simulation of High-power LED Array Packaging

Thermal management is one of the key technologies for high-power Light emitting diode(LED)entering into the general illuminating field.Successful thermal management depends on optimal packaging structure and selected packaging materials.In this paper,the aluminum is employed as a substrate of LED,3×3 array chips are placed on the substrate,heat dissipation performance is simulated using finite element analysis(FEA)software,analyzed are the influences on the temperature of the chip with different convection coefficient,and optical properties are simulated using optical analysis software.The results show that the packaging structure can not only effectually improve the thermal performance of high-power LED array but also increase the light extraction efficiency.

Study on High-power LED Heat Dissipation Based on Printed Circuit Board

In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.

Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition:Plastic Package Degradation,Speciation of Nano-TiO_(2),and Environmental Impact Assessment

Light emitting diodes(LEDs)have accounted for most of the lighting market as the technology matures and costs continue to reduce.As a new type of e-waste,LED is a double-edged sword,as it contains not only precious and rare metals but also organic packaging materials.In previous studies,LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials.Unlike crushing and other traditional methods,hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials.This work developed a closed reaction vessel,where the degradation rate of plastic polyphthalamide(PPA)was close to 100%,with nano-TiO_(2)encapsulated in plastic PPA being efficiently recovered,while metals contained in LED were also recycled efficiently.Besides,the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work.Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes.Especially the developed method could reduce more than half the impact of global warming.Furthermore,this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices,such as integrated circuits.

Fabrication of High-power White LEDs and White Light Uniformity Testing

As the blue and yellow lights are complementary colors, a blue InGaN LED chip is coated hy a yellow phosphor film to generate white light based on luminescence conversion mechanism. The emitted light of a blue LED is used as the primary source for exciting fluorescent material such as cerium doped yttrium aluminum garnet with the formula Y3Al2O12 ： Ce^3＋ （in short： YAG ： Ce^3＋ ）. The matching of the spectrum of the blue LED chips and the YAG ： Ce^3＋ yellow phosphor is studied to improve the conversion efficiency. The packaging methods and manufacturing processes for high power single chip-white LEDs are introduced. The uniformity of the output white light is investigated. Based on the characteristics of the high power white LEDs, some approaches and processes are suggested to improve the light uniformity when they are fabricated. The effectiveness of those approaches on the improvement of LEDs is discussed in detail and some interesting conclusions are also presented.

A Cooling System with a Fan for Thermal Management of High-Power LEDs

To improve the heat dissipation of high-power light-emitting diodes (LEDs), a cooling system with a fan is proposed. In the experiment, the LEDs array of 18 W composed of 6 LEDs of 3 W is used and the room temperature is 26oC. Results show that the temperature of the substrate of LEDs reaches 62oC without the fan, however, it reaches only 32oC when the best cooling condition appears. The temperature of the LEDs decreases by 30oC since the heat produced by LEDs is transferred rapidly by the fan. The experiment demonstrates that the cooling system with the fan has good performance.

Design and Implementation on the Wind and Light Complementary LED Lighting Controller based on Novel Base Board Packaging Technology

In this paper, we conduct theoretical research on design and implementation on wind and light complementary LED lighting controller based on the novel base board packaging technology. LED, as a kind of device can convert electric power into visible light directly the homomorphism of semiconductor devices, with high efficiency and small energy consumption, good light quality, use safety, long service life, green environmental protection, flexible control as this is common lamps and lanterns is incomparable advantage. Therefore, it is considered to be 21 century of a new generation of lighting source. Based on the superiority of LED, it is widely applied in many fields of lighting. To enhance the traditional solar based pure LED system, we enhance it with the combination of the wind power and the optimized controller that holds specific meaning.

基于TEC和平板热管的LED散热器结构优化设计

LED结温对其寿命和光效具有显著影响。高效的热管理对保持LED的性能稳定非常重要。为了有效降低LED结温、满足散热需求及特定场所的应用需求,结合热电冷却器(TEC)和平板热管(FPHP)重新设计了散热器结构,利用响应面法构建了针对散热器参数的双目标函数,通过非支配排序遗传算法(NSGA-II)求得Pareto最优解。基于散热器结构的最优值对TEC电流进行单因素优化分析,结果表明,优化后的LED最高结温比不采用TEC时的LED最高结温降低了23.3%,充分证明了优化散热器结构的有效性。

“光电探测与信号处理”课程实践教学设计——以LED封装为例

LED封装作为“光电探测与信号处理”课程中一个重要的实践内容,通过对其教学内容、教学环节、教学反哺和教学评价环节进行设计,优化了教学内容,更新了教学理念,丰富了教学环节,增强了教学效果,提升了课堂效率。这一实践教学设计的执行实现了理论与生产实践的深度融合,加深了学生对理论知识的认知,有效地提升了学生的学习积极性,培养了严谨的作风和科学的态度,为以后毕业设计打下一定的基础。

Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

Thermal property is one of the most important properties of light-emitting diode （LED）. Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface, accordingly having an influence on the light-emitting efficiency and the life-span of the device. In this paper, photoacoustic piezoelectric （PAPE） technique has been employed to investigate the thermal properties of polyvinyl alcohol （]？VA） and silicon dioxide, which are the new and the traditional packaging materials in white LED, respectively. Firstly, the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials; secondly, the experimental system has been set up and adjusted by measuring the reference sample; thirdly, the thermal diffusivities of PVA and silicon dioxide are measured and analysed. The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.

High recorded color rendering performance of single-structured Ce,Mn:Y_(3)(Al,Sc)_(2)Al_(3)O_(12)phosphor ceramics for high-power white LEDs/LDs

Achieving a high color rendering index(CRI)and luminous stability in single-structured Ce:Y_(3)Al_(5)O_(12)(Ce:YAG)phosphor ceramics(PCs)is crucial for high-power white light-emitting diodes or laser diodes(LEDs/LDs).However,cyan valleys and insufficient amounts of the red component in the Ce:YAG emission spectra significantly limit their real applications.In this work,a series of Ce,Mn:Y_(3)(Al,Sc)_(2)Al_(3)O_(12)(Ce,Mn:YSAG)PCs were fabricated by vacuum sintering,and efficient spectral regulation was realized for full-color lighting.The cyan valley was filled by the blueshifted emission peak of Ce^(3+)via Sc^(3+)doping.The orange‒red emission at approximately 580 nm was effectively supplemented via Mn^(2+)doping.In particular,CRI of Ce,Mn:YSAG increased from 56.4 to 85.8,a 52%increase compared with that of Ce:YAG under high-power LED excitation,and the operating temperature was stable at approximately 50℃for long working time.Moreover,CRI of 80.9 could still be obtained for PC-based white LDs.These results indicated that Ce,Mn:YSAG PC,which has excellent CRI and luminous stability,is an extremely promising color convertor for high-power white LEDs/LDs.

LED显示芯片行业现状与发展研究

显示作为发光二极管(LED)重要的应用领域,其发展对LED产业具有巨大的影响。本文从LED衬底、外延、封装、转移技术等层面探讨技术演化路径,探索未来发展方向。另外,从产业链的角度来分析LED显示市场的竞争格局,探索在微型发光二极管(Micro LED)新技术的驱动下芯片企业、面板企业、终端企业的合作关系。据相关机构预测,Micro LED显示市场未来可期,企业掌握核心技术、强强联合、资源互补,才能保证在新一轮的应用中脱颖而出,全产业链共同发力,降本增效才能快速打开市场。

NaLu(WO_(4))_(2):xEu^(3+)荧光粉中Tb^(3+)高掺杂诱导的能量转移及LED应用

采用水热法制备了掺杂浓度不同的NaLu_(1-x-y)Tb_(y)(WO_(4))_(2):xEu^(3+)系列荧光粉.利用XRD、SEM、激发光谱、发射光谱、时域光谱等手段研究了荧光粉的晶体结构、颗粒形貌和光谱学属性.结果表明,与未掺杂Tb^(3+)的最优荧光粉相比,NaLu_(0.50_Tb_(0.41)(WO_(4))_(2):0.09Eu^(3+)荧光粉实现了一个量级以上的荧光增强,该增强主要归因于先Eu^(3+)→Tb^(3+)后Tb^(3+)→Eu^(3+)的两步能量转移.利用395 nm紫外芯片和发光最强荧光粉封装的红光LED在植物补光领域具备较好的应用前景.

板上驱动封装LED的电源IC失效分析

通过基础电性测试确认了板上驱动(DOB)封装LED光源的失效现象,通过X射线无损探测内部的结构,得到了基本电路结构原理图。分别对LED光源电路上的各个分立部分做示波器测试,确认了失效部位为电源IC。通过物理开封并结合扫描电子显微镜(SEM)、聚焦离子束显微镜(FIB-SEM)和能谱仪(EDS)测试,分析出该LED光源亮度下降的根本原因是电源IC异常。而该电源IC失效的原因为Fe元素残留与污染引发蚀刻异常,含Fe元素异物镶嵌在芯片内部,导致芯片内部蚀刻线路异常,造成内部功能单元失效,最终使IC功能偏离设计,局部或全部失效。

双钙钛矿钨酸盐荧光粉的递进式荧光增强及植物LED应用

利用高温固相法制备了3类Mn^(4+)掺杂的双钙钛矿钨酸盐荧光粉SrMg_(2)La_(2)W_(2)O_(12):xMn^(4+)(SMLW:xMn^(4+))、CaMg_(2)La_(2)W_(2)O_(12):yMn^(4+)(CMLW:yMn^(4+))和CaMg_(2)La_(2)W_(2)O_(12):0.9%Mn^(4+),zNd^(3+)(CMLW:0.90%Mn^(4+),zNd^(3+)).通过XRD、SEM、频域和时域光谱等手段研究了荧光粉的晶体结构、形貌与发光性能.结果表明,当从SMLW:xMn^(4+)到CMLW:yMn^(4+),再到CMLW:0.90%Mn^(4+),zNd^(3+)激发荧光粉时观测到递进式荧光增强,增强的原因主要是由阳离子取代和共掺杂诱导的基质晶格刚性变化引起的.利用最优化荧光粉CMLW:0.90%Mn^(4+)、0.60%Nd^(3+)和365 nm紫光芯片封装的深红色LED在室内植物照明领域具备较好的应用前景.

大功率白光LED封装结构和封装基板

随着LED在照明领域的不断发展,功率和亮度不断提高,尤其是大功率白光LED的出现,热问题成为制约LED进一步发展的关键问题。介绍了大功率白光LED引脚式封装、表面贴装式(SMT)、板上芯片直装式(COB)和系统封装式(SiP)封装结构和金属、金属基复合以及陶瓷封装材料。重点阐述了金属芯印刷电路板(MCPCB)、金属基复合材料板以及陶瓷基板(如厚膜陶瓷基板、薄膜陶瓷基板、低温共烧陶瓷基板)等应用于大功率白光LED的封装基板,对各个基板的特点和散热能力进行了分析和对比。最后对大功率白光LED封装结构和封装基板的发展趋势进行了展望。

大功率白光LED封装设计与研究进展

封装设计、材料和结构的不断创新使发光二极管(LED)性能不断提高。从光学、热学、电学、机械、可靠性等方面,详细评述了大功率白光LED封装的设计和研究进展,并对封装材料和工艺进行了具体介绍。提出LED的封装设计应与芯片设计同时进行,并且需要对光、热、电、结构等性能统一考虑。在封装过程中,虽然材料(散热基板、荧光粉、灌封胶)选择很重要,但封装工艺(界面热阻、封装应力)对LED光效和可靠性影响也很大。

LED封装的研究现状及发展趋势

LED因其高效化、高功率化、高可靠性和低成本的不断发展,LED封装技术在越发重要的同时面临巨大的挑战。在封装过程中,封装材料和封装结构对LED散热与出光的影响最为关键。本文主要从封装材料(芯片、基板、热界面材料、荧光粉)和封装结构(Lamp、Surface Mounted Devices(SMD)、Chip on Board(CoB)、Remote Phosphor(RP))上,阐述LED封装的研究现状以及发展趋势。

LED封装光学结构对光强分布的影响

从发光二极管(LED)的发光原理及结构出发,建立了LED的光学模型,获得了它的光强分布曲线,并与实际测量数据进行了比较。通过改变模型中反光碗的张角、支架的插入深度、封装环氧树脂折射率以及透镜尺寸,得到了不同结构参数下的光强分布。实验结果表明:反光碗张角、支架插入深度、封装环氧树脂折射率以及透镜尺寸对LED光强分布的影响有一定的规律性,这些规律对生产特定照明需求的LED具有实际指导意义。

LED红色发光粉的制备及封装性能(英文)

实验采用碳酸锂、氧化钨、氧化铕制备了LiEuW2O8发光粉,通过扫描电镜和光谱仪分别研究了它的形貌与光谱特征。结果显示:LiEuW2O8发光粉的激发光谱较宽,非常适合于近紫外、蓝光及绿光芯片,发射光谱峰值位于615nm,色坐标为(x=0.666,y=0.331);球磨对它的形貌影响非常明显。为了比较硫化物发光粉和LiEuW2O8发光粉的性能,分别对他们进行了封装实验,结果显示:LiEuW2O8发光粉能够有效降低色温,更重要的是,它对光效影响较小,4000K时,光效可以保持在60lm/W以上。

大功率LED的封装及其散热基板研究

从解决大功率发光二极管散热和材料热膨胀系数匹配的角度,介绍了几种典型的封装结构及金属芯线路板(MCPCB)的性能,并简要分析了其散热原理。最后介绍了等离子微弧氧化(MAO)工艺制作的铝芯金属线路板,低成本、低热阻、性能稳定、便于加工和进行多样结构的封装是其突出优点。对采用MAO工艺的MCPCB基板封装的瓦级单芯片LED进行了热场的有限元模拟,结果显示其热阻约为10 K/W;当微弧氧化膜热导率由2 W.m-1.K-1升高到5 W.m-1.K-1时,热阻将降至6 K/W。