Application of response surface methodology to maximize tensile strength and minimize interface hardness of friction welded dissimilar joints of austenitic stainless steel and copper alloy

An attempt was made to optimize friction welding parameters to attain a minimum hardness at the interface and a maximum tensile strength of the dissimilar joints of AISI 304 austenitic stainless steel （ASS） and copper （Cu） alloy using response surface methodology （RSM）. Three-factor, five-level central composite design matrix was used to specify experimental conditions. Twenty joints were fabricated using ASS and Cu alloy. Tensile strength and interface hardness were measured experimentally. Analysis of variance （ANOVA） method was used to find out significant main and interaction parameters and empirical relationships were developed using regression analysis. The friction welding parameters were optimized by constructing response graphs and contour plots using design expert software. The developed empirical relationships can be effectively used to predict tensile strength and interface hardness of friction welded ASS-Cu joints at 95% confidence level. The developed contour plots can be used to attain required level of optimum conditions to join ASS-Cu alloy by friction welding process.

Electronic and geometric structure of the copper-ceria interface on Cu/CeO2 catalysts

The atomic structure of the active sites in Cu/CeO2 catalysts is intimately associated with the copper-ceria interaction. Both the shape of ceria and the loading of copper affect the chemical bonding of copper species on ceria surfaces and the electronic and geometric character of the relevant interfaces. Nanostructured ceria, including particles(polyhedra), rods, and cubes, provides anchoring sites for the copper species. The atomic arrangements and chemical properties of the(111),(110) and(100) facets, preferentially exposed depending on the shape of ceria, govern the copper-ceria interactions and in turn determine their catalytic properties. Also, the metal loading significantly influences the dispersion of copper species on ceria with a specific shape, forming copper layers, clusters, and nanoparticles. Lower copper contents result in copper monolayers and/or bilayers while higher copper loadings lead to multi-layered clusters and faceted particles. The active sites are usually generated via interactions between the copper atoms in the metal species and the oxygen vacancies on ceria, which is closely linked to the number and density of surface oxygen vacancies dominated by the shape of ceria.

Interface repairing for AA5083/T2 copper explosive composite plate by friction stir processing

Multi-pass friction stir processing(M-FSP)was performed to repair the interface defects of AA5083/T2 copper explosive composite plates.The interface morphology and its bonding mechanism were explored.The results show that higher rotation speed and lower transverse speed produce more heat generated during FSP.The defect-free and good mechanical properties of the AA5083/T2 copper composite plate can be obtained under the condition of the rotation speed of 1200 r/min,the transverse speed of 30 mm/min and the overlap of 2/24.Moreover,M-FSP changes the interface bonding mechanism from metallurgical bonding to vortex connection,improving the bonding strength of composite plate,which can guarantee the repairing quality of composite plates.

Interface Reaction of SiO_2/Ta and Its Influence on Cu Diffusion

Ta/NiFe film is deposited on Si substrate precoated with SiO_2 by magnetron sputtering.SiO_2/Ta interface and Ta_5Si_3 standard sample are investigated by using X-ray photoelectron spectroscopy (XPS) and peak decomposition technique.The results show that there is a thermodynamically favorable reaction at the SiO_2/Ta interface:37Ta+15SiO_2=5Ta_5Si_3+6Ta_2O_5.The more stable products Ta_5Si_3 and Ta_2O_5 may be beneficial to stop the diffusion of Cu into SiO_2.

CO_(2)hydrogenation to methanol promoted by Cu and metastable tetragonal Ce_(x)Zr_(y)O_(z) interface

Designing effective catalyst to improve the activity of CO_(2) hydrogenation to methanol is a potential avenue to realize the utilization of CO_(2) resources. Herein we construct three kinds of Cu/Ce_(x)Zr_(y)O_(z)(CCZ) catalysts with different crystal phases of Ce_(x)Zr_(y)O_(z)solid solutions, which demonstrate distinct activity and methanol selectivity in the order of metastable tetragonal-CCZ(CCZ-t’’, parts of oxygen in Ce_(x)Zr_(y)O_(z) were replaced by tetragonal phase from cubic fluorite phase) > tetragonal-CCZ(CCZ-t) > cubic-CCZ(CCZ-c) for CO_(2) hydrogenation to methanol. Structural analysis reveals that oxygen vacancies, surface hydroxyls and unsaturated Cu species of CCZ all follow the same sequence as that of activity and methanol selectivity,indicating that the above features are beneficial to improve the catalytic reaction performance.Temperature programmed experiments and mechanism studies show that the interface between Cu and tetragonal(t and t’’) Ce_(x)Zr_(y)O_(z) can promote CO_(2) adsorption, and the adsorbed CO_(2) is more reactive and can generate active bidentate carbonate species, which can be hydrogenated to form active monodentate and bidentate formate species under CO_(2) and H_(2) atmosphere. These intermediates should be crucial to the formation of methanol product. CCZ-t’’has stronger H_(2) activation ability than CCZ-t, which makes the former catalyst have more intermediates and higher methanol selectivity. In contrast, CO_(2) mainly adsorbs on cubic Ce_(x)Zr_(y)O_(z) support of CCZ-c, but its H_(2) spillover ability is low, which hinders the reaction process. In addition, the strong adsorption of surface intermediates on CCZ-c is also not conducive to methanol formation. Results here demonstrate that constructing active Cu-support interfaces may be an important approach to design effective catalyst for CO_(2)hydrogenation.

A study of metal/die interfacial heat transfer behavior of vacuum die cast pure copper

High pressure die casting copper is used to produce rotors for induction motors to improve efficiency.Experiments were carried out for a special"step-shape"casting with different step thicknesses.Based on the measured temperature inside the die,the interfacial heat transfer coefficient(IHTC)at the metal/die interface during vacuum die casting was evaluated by solving the inverse problem.The IHTC peak value was 4.5×10^3-11×10^3 W·m^-2·K^-1 under the basic operation condition.The influences of casting pressure,fast shot speed,pouring temperature and initial die surface temperature on the IHTC peak values were investigated.Results show that a greater casting pressure and faster shot speed could only increase the IHTC peak values at the location close to the ingate.An increase of pouring temperature and/or initial die surface temperature significantly increases the IHTC peak values.

Liquid-solid interface control of BFe10-1-1 cupronickel alloy tubes during HCCM horizontal continuous casting and its effect on the microstructure and properties

Based on horizontal continuous casting with a heating-cooling combined mold （HCCM） technology, this article investigated the effects of processing parameters on the liquid-solid interface （LSI） position and the influence of LSI position on the surface quality, microstructure, texture, and mechanical properties of a BFe10-1-1 tube （φ50 mm × 5 mm）. HCCM efficiently improves the temperature gradient in front of the LSI. Through controlling the LSI position, the radial columnar-grained microstructure that is commonly generated by cooling mold casting can be eliminated, and the axial columnar-grained microstructure can be obtained. Under the condition of 1250℃ melting and holding temperature, 1200-1250℃ mold heating temperature, 50-80 mm/min mean drawing speed, and 500-700 L/h cooling water flow rate, the LSI position is located at the middle of the transition zone or near the entrance of the cooling section, and the as-cast tube not only has a strong axial columnar-grained microstructure （{hkl}〈621〉, {hkl}〈221〉） due to strong axial heating conduction during solidification but also has smooth internal and external surfaces without cracks, scratches, and other macroscopic defects due to short solidified shell length and short contact length between the tube and the mold at high temperature. The elongation and tensile strength of the tube are 46.0%-47.2% and 210-221 MPa, respectively, which can be directly used for the subsequent cold-large-strain processing.

Production of high-purity Mg metal from dolomite through novel molten salt electrolysis and vacuum distillation

In this study,a novel Mg production process for producing high-purity Mg metal from dolomite was developed.When the electrolysis of calcined dolomite was conducted using Cu cathode and C anode in MgF_(2)–LiF molten salt at 1083–1173 K by applying an average current of 1.42–1.46 A for 9.50–21.0 h,the current efficiency of 66.4–88.6%was obtained.The produced Mg alloys consisted of MgCu_(2)and Cu(Mg)or MgCu_(2)and CuMg_(2)phases,depending on the Mg concentration in the Mg alloy.When the electrolysis of calcined dolomite was conducted in MgF_(2)–LiF–CaF_(2)molten salt at 1083 K,the current efficiency was 40.9–71.4%,owing to undesired reactions such as electroreduction of Ca^(2+)or/and CO_(3)^(2−)ions.Meanwhile,the current efficiency increased from 40.9%to 63.2%by utilizing a Pt anode,because the occurrence of CO_(3)^(2−)ions in the molten salt was prevented.After vacuum distillation of the obtained Mg alloys at 1300 K for 10 h,Mg metal with a purity of 99.9996–99.9998%was produced.Therefore,the feasibility of this novel process for the production of high-purity Mg metal from dolomite was demonstrated.

Cooperative enhancement of mechanical and tribological properties through tailoring TiN transition interface in boron nitride nanosheets reinforced copper composites

Strengthening interface bonding between boron nitride nanosheets(BNNS)and copper matrix is an essential prerequisite for exploiting a new generation of copper matrix composites(CMCs)with high strength and wear resistance.Herein,BNNS/Cu composites were fabricated by the powder metallurgy route,matrix-alloying(adding 1.0 wt%Ti)strategy was adopted to improve the interfacial wettability and strengthen interface adhesion.A typical"sandwich"-like multiply interface structure involving TiN transition layers,BNNS and Cu matrix had been well constructed through the rational heat treatment(900℃ for 120 min).Additionally,nano-sized TiB whisker was in situ formed in the vicinity of the interface,it had linked the BNNS-Cu-TiN multiply interface,which played a role of"threading the needle"and significantly strengthened the multi-interfaces bonding.This specific interface structure was finely characterized,and the formation mechanism of solid-state interfacial reaction feature was proposed.The results demonstrated that the ultimate tensile strength(UTS)of BNNS/Cu-(Ti)-900℃ increased from 248 to 530 MPa(increased by 114%),and the coefficient of friction(COF)decreased from 0.51 to 0.28 than pure Cu.This work highlights the importance of interface configuration design,which contributes to the development of CMCs with prominent comprehensive properties.

Fabricating multifunctional polymeric nanofilm capable of resisting corrosion and activating copper surface by electrochemical and hydrolysis-condensation approach

A multifunctional polymeric nanofilm of triazinedithiolsilane monosodium salt, which can resist corrosion and activatecopper surface concurrently, was prepared by galvanostatic technique and the following hydrolysis-condensation approach.Electrochemical tests were carried out to evaluate the resistant ability of nanofilm. The changes of functional groups atop thenanofilms were monitored with Fourier transform infrared spectroscopy （FT-IR） and contact angles （CA） simultaneously. Thechemical composition and the morphology of the polymeric nanofilm were investigated by X-ray photoelectron spectroscopy （XPS）and scanning electron microscope （SEM）, respectively. The results reveal that the preferentially developed disulfide units protect thecopper during the whole preparation process, and the subsequently hydrolyzed nanofilms without/with heating shape into newinterface phases bearing the multifunctionality. This multifunctional interface （the polymeric nanofilm on copper surface） opens upthe possibilities for other OH-containing reagents to be anchored onto copper surface in demanding researches or industrialapplications.

Interfacial microstructure and properties of diamond/Cu-xCr composites for electronic packaging applications

Diamond/Cu-xCr composites were fabricated by pressure infiltration process.The thermal conductivities of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were above 650 W/mK,higher than that of diamond/Cu composites.The tensile strengths ranged from 186 to 225 MPa,and the bonding strengths ranged from 400 to 525 MPa.Influences of Cr element on the thermo-physical properties and interface structures were analyzed.The intermediate layer was confirmed as Cr3C2 and the amount of Cr3C2 increased with the increase of Cr concentration in Cu-xCr alloys.When the Cr concentration was up to 0.5 wt.%,the content of the Cr3C2 layer was constant.As the thickness of the Cr3C2 layer became larger,the composites showed a lower thermal conductivity but higher mechanical properties.The coefficients of thermal expansion（CTE） of diamond/Cu-xCr（x = 0.1,0.5,0.8） composites were in good agreement with the predictions of the Kerner＇ model.

Experimental investigation of Tie6Ale4V titanium alloy and 304L stainless steel friction welded with copper interlayer

The basic principle of friction welding is intermetallic bonding at the stage of super plasticity attained with self-generating heat due to friction and finishing at upset pressure. Now the dissimilar metal joints are especially popular in defense, aerospace, automobile, bio-medical,refinery and nuclear engineerings. In friction welding, some special alloys with dual phase are not joined successfully due to poor bonding strength. The alloy surfaces after bonding also have metallurgical changes in the line of interfacing. The reported research work in this area is scanty. Although the sound weld zone of direct bonding between Tie6Ale4 V and SS304 L was obtained though many trials, the joint was not successful. In this paper, the friction welding characteristics between Tie6Ale4 V and SS304 L into which pure oxygen free copper(OFC) was introduced as interlayer were investigated. Boxe Behnken design was used to minimize the number of experiments to be performed. The weld joint was analyzed for its mechanical strength. The highest tensile strength between Tie6Ale4 V and SS304 L between which pure copper was used as insert metal was acquired. Micro-structural analysis and elemental analysis were carried out by EDS, and the formation of intermetallic compound at the interface was identified by XRD analysis.

Numerical simulation of temperature field in horizontal core-filling continuous casting for copper cladding aluminum rods

The steady-state temperature field of horizontal core-filling continuous casting （HCFC） for producing copper cladding aluminum rods was simulated by finite element method to investigate the effects of key processing parameters on the positions of solid-liquid interfaces （SLIs） of copper and aluminum. It is found that mandrel tube length and mean withdrawing speed have significant effects on the SLI positions of both copper and aluminum. Aluminum casting temperature （TAI） （1003-1123 K） and secondary cooling water flux （600-900 L.h-1） have little effect on the SLI of copper but cause the SLI of aluminum to move 2-4 mm. When TA1 is in a range of 1043-1123 K, the liquid aluminum can fill continuously into the pre-solidified copper tube. Based on the numerical simulation, reasonable processing parameters were determined.

Effects of rare earth element lanthanum on the microstructure of copper matrix diamond tool materials

Effects of rare earth element La on the microstructure of Cumatrix diamond tools were researched under the conditions of variousmaterials components and the process parameters in order to improvematerials properties. SEM, XPS and X-ray were used to investigate thefracture section, microstructure and the element valence inmaterials. The Results shown that the combination of rare earthelement La and transition element Ti is advantageous to the bondingstate Between diamond particles and matrix, so it can improve thematerials properties. Suitable sintering temperature is 790 deg. C.

Microstructural characterization of Cu/Al composites and effect of cooling rate at the Cu/Al interfacial region

Cu/Al composites are of vital importance in industrial applications because of their numerous advantages. The influence of bond-ing temperature and cooling rate on the microstructure and morphology of Cu/Al composites was investigated in this paper. The interfacial morphology and constituent phases at the Cu/Al interface were analyzed by optical microscopy and field-emission scanning electron mi-croscopy equipped with energy-dispersive X-ray spectroscopy. The results indicate that effective Cu-Al bonding requires a higher bonding temperature to facilitate interdiffusion between the two metals. The microstructural characteristics are associated with various bonding tem-peratures, which impact the driving force of interdiffusion. It is observed that cooling rate exerts a significant influence on the morphology and amount of the intermetallic compounds at the interfacial region. Meanwhile, microhardness measurements show that hardness varies with the bonding temperature and rate of cooling.

Preparation and thermal conductivity of tungsten coated diamond/copper composites

Tungsten was plated on the surface of diamond by using thermal diffusion method.Different process parameters were employed to prepare the composites with tungsten,diamond and copper.The micro morphology of different samples was observed,and the thermal conductivity of samples was measured by laser flash method.The optimal process parameters for preparing diamond/copper composites with high thermal conductivity were investigated.The results indicated that plating tungsten on diamond could modify the interface bonding.When the diamond was plated for 60 min,the coating appeared intact,uniform and flat,and the thermal conductivity of the sample could reach as high as 486 W/(m·K).The integrity and uniformity were more important than thickness for the coating.When the tungsten-plated diamond was further annealed,the metallurgical bonding between the coating and the diamond was enhanced,and the thermal conductivity rose to 559 W/(m·K).

Improving effect of carbonized quantum dots(CQDs)in pure copper matrix composites

Carbon quantum dots(CQDs),which contain a core structure composed of sp^(2)carbon,can be used as the reinforcing phase like graphene and carbon nanotubes in metal matrix.In this paper,the CQD/Cu composite material was prepared by powder metallurgy method.The composite powder was prepared by molecular blending method and ball milling method at first,and then densified into bulk material by spark plasma sintering(SPS).X-ray diffraction,Raman spectroscopy,infrared spectroscopy,and nuclear magnetic resonance were employed to characterize the CQD synthesized under different temperature conditions,and then CQDs with a higher degree of sp^(2)were utilized as the reinforcement to prepare composite materials with different contents.Mechanical properties and electrical conductivity results show that the tensile strength of the 0.2 CQD/Cu composite material is~31%higher than that of the pure copper sample,and the conductivity of 0.4 CQD/Cu is~96%IACS,which is as high as pure copper.TEM and HRTEM results show that good interface bonding of CQD and copper grain is the key to maintaining high mechanical and electrical conductivity.This research provides an important foundation and direction for new carbon materials reinforced metal matrix composites.

Interfacial enhancement of Ag and Cu particles sintering using(111)-oriented nanotwinned Cu as substrate for die-attachment

The electroplated(111)-oriented nanotwinned-Cu(nt-Cu) film was utilized as substrate for Ag and Cu sinter joining to improve the weak interface connection between the metal paste and the substrate.It was found that both Cu and Ag sinter joints using(111)-oriented nt-Cu film exhibited a higher bonding strength than that using traditional random-oriented Cu film.Especially,the joints sintered with Cu paste on(111)-oriented nt-Cu film possessed a higher bonding strength of 53.7 MPa at the sintering condition of 300 °C,0.4 MPa in N2 atmosphere,compared to that on random-oriented Cu film with a value of 31.3 MPa.The results show that as metal substrate layer,the(111)-oriented nt-Cu film can improve the connection performance of Ag and Cu sinter joints,which could further promote their application in dieattachment technology for the next-generation power semiconductors.

A review of processing of Cu/C base plate composites for interfacial control and improved properties

The increase in both power and packing densities in power electronic devices has led to an increase in the market demand for effective heat-dissipating materials with a high thermal conductivity and thermal expansion coefficient compatible with chip materials while still ensuring the reliability of the power modules.Metal matrix composites,especially copper matrix composites,containing carbon fibers,carbon nanofibers,or diamond are considered very promising as the next generation of thermalmanagement materials in power electronic packages.These composites exhibit enhanced thermal properties,as compared to pure copper,combined with lower density.This paper presents powder metallurgy and hot uniaxial pressing fabrication techniques for copper/carbon composite materials which promise to be efficient heat-dissipation materials for power electronic modules.Thermal analyses clearly indicate that interfacial treatments are required in these composites to achieve high thermal and thermomechanical properties.Control of interfaces(through a novel reinforcement surface treatment,the addition of a carbide-forming element inside the copper powders,and processing methods),when selected carefully and processed properly,will form the right chemical/mechanical bonding between copper and carbon,enhancing all of the desired thermal and thermomechanical properties while minimizing the deleterious effects.This paper outlines a variety of methods and interfacial materials that achieve these goals.

Effect of continuous induction annealing on the microstructure and mechanical properties of copper-clad aluminum flat bars

Copper-clad aluminum （CCA） flat bars produced by the continuous casting-rolling process were subjected to continuous induction heating annealing （CIHA）, and the effects of induction heating temperature and holding time on the microstructure, interface, and mechanical properties of the fiat bars were investigated. The results showed that complete recrystallization of the copper sheath occurred under CIHA at 460℃ for 5 s, 480℃ for 3 s, or 500℃ for 1 s and that the average grain size in the copper sheath was approximately 10.0 μm. In the case of specimens subjected to CIHA at 460-500℃ for longer than 1 s, complete recrystallization occurred in the aluminum core. In the case of CIHA at 460-500℃ for 1-5 s, a continuous interracial layer with a thickness of 2.5-5.5 μm formed and the thickness mainly increased with increasing annealing temperature. After CIHA, the interracial layer consisted primarily of a Cu9A14 layer and a CuA12 layer; the average interface shear strength of the CCA flat bars treated by CIHA at 460-500℃ for 1-5 s was 45-52 MPa. After full softening annealing, the hardness values of the copper sheath and the aluminum core were HV 65 and HV 24, respectively, and the hardness along the cross section of the CCA flat bar was uniform.