As a nanometer-level interconnection,the Optical Network-on-Chip(ONoC)was proposed since it was typically characterized by low latency,high bandwidth and power efficiency. Compared with a 2-Dimensional(2D)design,the 3...As a nanometer-level interconnection,the Optical Network-on-Chip(ONoC)was proposed since it was typically characterized by low latency,high bandwidth and power efficiency. Compared with a 2-Dimensional(2D)design,the 3D integration has the higher packing density and the shorter wire length. Therefore,the 3D ONoC will have the great potential in the future. In this paper,we first discuss the existing ONoC researches,and then design mesh and torus ONoCs from the perspectives of topology,router,and routing module,with the help of 3D integration. A simulation platform is established by using OPNET to compare the performance of 2D and 3D ONoCs in terms of average delay and packet loss rate. The performance comparison between 3D mesh and 3D torus ONoCs is also conducted. The simulation results demonstrate that 3D integration has the advantage of reducing average delay and packet loss rate,and 3D torus ONoC has the better performance compared with 3D mesh solution. Finally,we summarize some future challenges with possible solutions,including microcosmic routing inside optical routers and highly-efficient traffic grooming.展开更多
In this work,a hybrid integrated optical transmitter module was designed and fabricated.A proton-exchanged Mach–Zehnder lithium niobate(LiNbO_(3))modulator chip was chosen to enhance the output extinction ratio.A fib...In this work,a hybrid integrated optical transmitter module was designed and fabricated.A proton-exchanged Mach–Zehnder lithium niobate(LiNbO_(3))modulator chip was chosen to enhance the output extinction ratio.A fiber was used to adjust the rotation of the polarization direction caused by the optical isolator.The whole optical path structure,including the laser chip,lens,fiber,and modulator chip,was simulated to achieve high optical output efficiency.After a series of process improvements,a module with an output extinction ratio of 34 dB and a bandwidth of 20.5 GHz(from 2 GHz)was obtained.The optical output efficiency of the whole module reached approximately 21%.The link performance of the module was also measured.展开更多
To researching the damage characteristics of typical logical chip modules in spacecraft due to plasma generated by hypervelocity impacts,we have established a triple Langmuir probe diagnostic system and a logical chip...To researching the damage characteristics of typical logical chip modules in spacecraft due to plasma generated by hypervelocity impacts,we have established a triple Langmuir probe diagnostic system and a logical chips measurement system,which were used to diagnose plasma characteristic parameters and the logical chip module＇s logical state changes due to the plasma created by a 7075 aluminum projectile hypervelocity impact on the 2A12 aluminum target.Three sets of experiments were performed with the collision speeds of 2.85 km/s,3.1 km/s and2.20 km/s,at the same incident angles of 30 degrees and logical chip module＇s positions by using a two-stage light gas gun loading system,a plasma characteristic parameters diagnostic system and a logical chip module＇s logical state measurement system,respectively.Electron temperature and density were measured at given position and azimuth,and damage estimation was performed for the logical chip module by using the data acquisition system.Experimental results showed that temporary damage could be induced on logical chip modules in spacecraft by plasma generated by hypervelocity impacts under the given experimental conditions and the sensors＇ position and azimuth.展开更多
In the Paper,the author introduces an embedded design verification test based on specific chips to solve the technical problems of microwave circuit test and fault diagnosis.The author explains embedded design of micr...In the Paper,the author introduces an embedded design verification test based on specific chips to solve the technical problems of microwave circuit test and fault diagnosis.The author explains embedded design of microwave circuit modules and approach of hardware design and software design,and finally verifies the embedded design of microwave circuit modules based on specific chips.展开更多
基金supported in part by the National Nat-ural Science Foundation of China(Grant Nos.61401082,61471109,61502075,61672123,91438110,U1301253)the Fundamental Research Funds for Central Universities(Grant Nos.N161604004,N161608001,N150401002,DUT15RC(3)009)Liaoning Bai Qian Wan Talents Program,and National High-Level Personnel Special Support Program for Youth Top-Notch Talent
文摘As a nanometer-level interconnection,the Optical Network-on-Chip(ONoC)was proposed since it was typically characterized by low latency,high bandwidth and power efficiency. Compared with a 2-Dimensional(2D)design,the 3D integration has the higher packing density and the shorter wire length. Therefore,the 3D ONoC will have the great potential in the future. In this paper,we first discuss the existing ONoC researches,and then design mesh and torus ONoCs from the perspectives of topology,router,and routing module,with the help of 3D integration. A simulation platform is established by using OPNET to compare the performance of 2D and 3D ONoCs in terms of average delay and packet loss rate. The performance comparison between 3D mesh and 3D torus ONoCs is also conducted. The simulation results demonstrate that 3D integration has the advantage of reducing average delay and packet loss rate,and 3D torus ONoC has the better performance compared with 3D mesh solution. Finally,we summarize some future challenges with possible solutions,including microcosmic routing inside optical routers and highly-efficient traffic grooming.
基金This work was supported by National Key Research and Development Program of China(2018YFB2201101)the Strategic Priority Research Program of Chinese Academy of Sciences,Grant No.XDB43000000Beijing Municipal Science&Technology Commission,Administrative Commission of Zhongguancun Science Park No.Z201100004020004。
文摘In this work,a hybrid integrated optical transmitter module was designed and fabricated.A proton-exchanged Mach–Zehnder lithium niobate(LiNbO_(3))modulator chip was chosen to enhance the output extinction ratio.A fiber was used to adjust the rotation of the polarization direction caused by the optical isolator.The whole optical path structure,including the laser chip,lens,fiber,and modulator chip,was simulated to achieve high optical output efficiency.After a series of process improvements,a module with an output extinction ratio of 34 dB and a bandwidth of 20.5 GHz(from 2 GHz)was obtained.The optical output efficiency of the whole module reached approximately 21%.The link performance of the module was also measured.
基金supported by National Natural Science Foundation of China(Nos.10972145,11272218,11472178)Program for Liaoning Excellent Talents in University of China(No.LR2013008)Open Foundation of Key Laboratory of Liaoning Weapon Science and Technology,Liaoning Province Talents Engineering Projects of China(No.2012921044)
文摘To researching the damage characteristics of typical logical chip modules in spacecraft due to plasma generated by hypervelocity impacts,we have established a triple Langmuir probe diagnostic system and a logical chips measurement system,which were used to diagnose plasma characteristic parameters and the logical chip module＇s logical state changes due to the plasma created by a 7075 aluminum projectile hypervelocity impact on the 2A12 aluminum target.Three sets of experiments were performed with the collision speeds of 2.85 km/s,3.1 km/s and2.20 km/s,at the same incident angles of 30 degrees and logical chip module＇s positions by using a two-stage light gas gun loading system,a plasma characteristic parameters diagnostic system and a logical chip module＇s logical state measurement system,respectively.Electron temperature and density were measured at given position and azimuth,and damage estimation was performed for the logical chip module by using the data acquisition system.Experimental results showed that temporary damage could be induced on logical chip modules in spacecraft by plasma generated by hypervelocity impacts under the given experimental conditions and the sensors＇ position and azimuth.
文摘In the Paper,the author introduces an embedded design verification test based on specific chips to solve the technical problems of microwave circuit test and fault diagnosis.The author explains embedded design of microwave circuit modules and approach of hardware design and software design,and finally verifies the embedded design of microwave circuit modules based on specific chips.
