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基于SAR-SS架构的图像传感器专用高速列级ADC设计
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作者 刘宇帆 刘炯晗 +3 位作者 程禹 曲杨 钟国强 常玉春 《半导体光电》 CAS 北大核心 2022年第6期1119-1123,共5页
针对图像传感器中传统列级模数转换器(ADC)难以实现高帧频的问题,提出了一种由逐次逼近寄存器型(SAR)ADC和单斜坡型(SS)ADC组成的混合型高速列级ADC,使转换周期相较于传统的SS ADC缩短约97%;利用SAR ADC的电容实现像素的相关双采样(CDS)... 针对图像传感器中传统列级模数转换器(ADC)难以实现高帧频的问题,提出了一种由逐次逼近寄存器型(SAR)ADC和单斜坡型(SS)ADC组成的混合型高速列级ADC,使转换周期相较于传统的SS ADC缩短约97%;利用SAR ADC的电容实现像素的相关双采样(CDS),在模拟域做差,使CDS的量化时间缩短至一个转换周期,进一步提高了ADC的量化速度;为了保证列级ADC的线性度,提出了一种1 bit冗余算法,可实现+0.13/-0.12 LSB的微分非线性和+0.18/-0.93 LSB的积分非线性。基于180 nm CMOS工艺的仿真结果表明,该列级ADC在50 MHz时钟下,转换周期仅为1μs,无杂散动态范围为73.50 dB,信噪失真比为66.65 dB,有效位数为10.78 bit。 展开更多
关键词 图像传感器 高速列级adc 逐次逼近寄存器adc 单斜坡adc 混合型adc 相关双采样
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Chip morphology and cutting temperature of ADC12 aluminum alloy during high-speed milling 被引量:1
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作者 Xin-Xin Meng You-Xi Lin 《Rare Metals》 CSCD 2021年第7期1915-1923,共9页
The ADC12 aluminum alloy is prone to severe tool wear and high cutting heat during high-speed milling because of its high hardness.This study analyzes the highspeed milling process from the perspective of different ch... The ADC12 aluminum alloy is prone to severe tool wear and high cutting heat during high-speed milling because of its high hardness.This study analyzes the highspeed milling process from the perspective of different chip morphologies.The influence of cutting temperature on chip morphology was expounded.A two-dimensional orthogonal cutting model was established for finite element analysis(FEA)of high-speed milling of ADC12 aluminum alloy.A theoretical analysis model of cutting force and cutting temperature was proposed based on metal cutting theory.The variations in chip shape,cutting force,and cutting temperature with cutting speed increasing were analyzed via FEA.The results show that,with the increase in cutting speed,the chip morphology changes from continuous to serrated,and then back to continuous.The serrated chip is weakened and the cutting temperature is lowered when the speed is lower than 600 m·min^(-1)or higher than 1800 m·min^(-1).This study provides a reference for reducing cutting temperature,controlling chip morphology and improving cutting tool life. 展开更多
关键词 adc12 aluminum alloy high-speed milling Chip morphology Cutting temperature Finite element analysis
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一种用于CIS列级ADC的片上抗PVT变化高精度自适应斜坡发生器
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作者 刘天予 曲杨 +1 位作者 曹伉 常玉春 《半导体光电》 CAS 2024年第4期542-548,共7页
传统的片上全局斜坡发生器电路容易受工艺、电压和温度(PVT)的影响,导致斜坡信号易失真、线性度差;由于寄生电容的影响,片外校准的难度较大。提出了一种可以抗PVT变化,实现自适应校准斜率的斜坡发生器,采用逐次逼近算法细调和定步长搜... 传统的片上全局斜坡发生器电路容易受工艺、电压和温度(PVT)的影响,导致斜坡信号易失真、线性度差;由于寄生电容的影响,片外校准的难度较大。提出了一种可以抗PVT变化,实现自适应校准斜率的斜坡发生器,采用逐次逼近算法细调和定步长搜索法微调相结合的方式,实现对斜坡的两点校正。斜坡校准电路包括电阻型DAC、电流型DAC、逻辑控制、动态比较器等模块。仿真结果表明,自适应斜坡发生器的平均校准周期约为1.143 ms,校准后斜坡微分非线性为+0.00207/-0.00115 LSB,积分非线性为+0.6755/-0.3887 LSB,在不同PVT条件下校准电压误差小于1.5 LSB,平均功耗仅为1.155 mW,与传统斜坡发生器相比具有精度高、功耗低的优点。 展开更多
关键词 图像传感器 高速列级模数转换器 斜坡发生器 逐次逼近算法 定步长搜索算法
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Design and implementation of high-speed real-time data acquisition system based on FPGA 被引量:12
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作者 WANG Xu-ying LU Ying-hua ZHANG Li-kun 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2006年第4期61-66,共6页
The electromagnetic radiation will result in informa- tion leakage being recovered when computers work. This article presents a high-speed real-time data acquisition system based on peripheral component interconnect ... The electromagnetic radiation will result in informa- tion leakage being recovered when computers work. This article presents a high-speed real-time data acquisition system based on peripheral component interconnect (PCI) bus and field programmable gate array (FPGA) for sampling electromagnetic radiation caused by video signal. The hardware design and controlling flow of each module are introduced in detail. The sampling rate can reach 64 Msps and system transfers speed can be up to 128 Mb/s by using time interleaving, which increases the overall sampling speed of a system by operating two data converters in parallel. 展开更多
关键词 high-speed data acquisition FPGA PCI bus very-high-speed integrated circuit Hardware description language (VHDL) analog-to-digital converter adc
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Development of readout electronics for bunch arrival-time monitor system at SXFEL 被引量:2
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作者 Jin-Guo Wang Bo Liu 《Nuclear Science and Techniques》 SCIE CAS CSCD 2019年第5期113-121,共9页
A bunch arrival-time monitor(BAM) system,based on electro-optical intensity modulation scheme, is under study at Shanghai Soft X-ray Free Electron Laser.The aim of the study is to achieve high-precision time measureme... A bunch arrival-time monitor(BAM) system,based on electro-optical intensity modulation scheme, is under study at Shanghai Soft X-ray Free Electron Laser.The aim of the study is to achieve high-precision time measurement for minimizing bunch fluctuations. A readout electronics is developed to fulfill the requirements of the BAM system. The readout electronics is mainly composed of a signal conditioning circuit, field-programmable gate array(FPGA), mezzanine card(FMC150), and powerful FPGA carrier board. The signal conditioning circuit converts the laser pulses into electrical pulse signals using a photodiode. Thereafter, it performs splitting and low-noise amplification to achieve the best voltage sampling performance of the dual-channel analog-to-digital converter(ADC) in FMC150. The FMC150 ADC daughter card includes a 14-bit 250 Msps dual-channel high-speed ADC,a clock configuration, and a management module. The powerful FPGA carrier board is a commercial high-performance Xilinx Kintex-7 FPGA evaluation board. To achieve clock and data alignment for ADC data capture at a high sampling rate, we used ISERDES, IDELAY, and dedicated carry-in resources in the Kintex-7 FPGA. This paper presents a detailed development of the readout electronics in the BAM system and its performance. 展开更多
关键词 BUNCH arrival-time monitor (BAM) Shanghai Soft X-ray Free Electron Laser (SXFEL) Fieldprogrammable gate array (FPGA) Signal CONDITIONING high-speed analog-to-digital converter (adc)
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Dedicated 4πβ(LS)-γ(HPGe) digital coincidence system based on synchronous high-speed multichannel data acquisition
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作者 陈吉锋 宋克柱 柳加成 《Chinese Physics C》 SCIE CAS CSCD 2016年第3期109-114,共6页
A dedicated 4πβ(LS)-γ(HPGe) digital coincidence system with five acquisition channels has been developed. Three ADC acquisition channels with an acquisition resolution of 8 bits and acquisition rate of 1 GSPS a... A dedicated 4πβ(LS)-γ(HPGe) digital coincidence system with five acquisition channels has been developed. Three ADC acquisition channels with an acquisition resolution of 8 bits and acquisition rate of 1 GSPS are utilized to collect the signals from three PMTs which are used to detect β decay, and two acquisition channels with an acquisition resolution of 16 bits and acquisition rate of 50 MSPS are utilized to collect the signals from high-purity germanium(HPGe), which is used to detect γ decay. In order to increase the accuracy of the coincidence system, all five acquisition channels are synchronous within 500 ps. The data collected by the five acquisition channels will be transmitted to the host PC through a PCI bus and saved as a file. Off-line software is utilized for the 4πβ(LS)-γ(HPGe) coincidence and data analysis as needed in practical applications. Tests of the system show that system can record pulse signals from 4πβ(LS)-γ(HPGe) synchronously for further coincidence calculation and the highest coincidence rate of the system is 20 K/s, which is sufficient for most applications. Compared with traditional coincidence modules like MAC3, the digital coincidence system has a higher flexibility of coincidence algorithm. In addition, due to the use of ADC, the structure of the coincidence system is simplified. This paper introduces the design of the hardware, the synchronization method and the test results of this system. 展开更多
关键词 liquid scintillation 4πβ(LS) –γ(HPGe) coincidence system high-speed adc
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Development of an ADC radiation tolerance characterization system for the upgrade of the ATLAS LAr calorimeter 被引量:2
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作者 刘洪斌 陈虎成 +4 位作者 陈凯 James Kierstead Francesco Lanni Helio Takai 金革 《Chinese Physics C》 SCIE CAS CSCD 2017年第2期151-158,共8页
ATLAS LAr calorimeter will undergo its Phase-I upgrade during the long shutdown(LS2) in 2018, and a new LAr Trigger Digitizer Board(LTDB) will be designed and installed. Several commercial-off-the-shelf(COTS)mul... ATLAS LAr calorimeter will undergo its Phase-I upgrade during the long shutdown(LS2) in 2018, and a new LAr Trigger Digitizer Board(LTDB) will be designed and installed. Several commercial-off-the-shelf(COTS)multi-channel high-speed ADCs have been selected as possible backups of the radiation tolerant ADC ASICs for the LTDB. To evaluate the radiation tolerance of these backup commercial ADCs, we developed an ADC radiation tolerance characterization system, which includes the ADC boards, data acquisition(DAQ) board, signal generator,external power supplies and a host computer. The ADC board is custom designed for different ADCs, with ADC drivers and clock distribution circuits integrated on board. The Xilinx ZC706 FPGA development board is used as a DAQ board. The data from the ADC are routed to the FPGA through the FMC(FPGA Mezzanine Card)connector, de-serialized and monitored by the FPGA, and then transmitted to the host computer through the Gigabit Ethernet. A software program has been developed with Python, and all the commands are sent to the DAQ board through Gigabit Ethernet by this program. Two ADC boards have been designed for the ADC, ADS52J90 from Texas Instruments and AD9249 from Analog Devices respectively. TID tests for both ADCs have been performed at BNL, and an SEE test for the ADS52J90 has been performed at Massachusetts General Hospital(MGH). Test results have been analyzed and presented. The test results demonstrate that this test system is very versatile, and works well for the radiation tolerance characterization of commercial multi-channel high-speed ADCs for the upgrade of the ATLAS LAr calorimeter. It is applicable to other collider physics experiments where radiation tolerance is required as well. 展开更多
关键词 radiation tolerance characterization high-speed multi-channel adc total ionization dose single event effect
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