Organic epoxy matrices have been widely used in the FRP reinforcing technique, but they have serious disadvantages of poor high-temperature resistance. An inorganic adhesive is invented to replace the organic adhesive...Organic epoxy matrices have been widely used in the FRP reinforcing technique, but they have serious disadvantages of poor high-temperature resistance. An inorganic adhesive is invented to replace the organic adhesive. For the inorganic adhesive at normal temperature and different high temperatures, the microstructure and phase composition are investigated by means of X-ray diffraction （XRD） and SEM respectively. Results show that inorganic adhesive can resist at least 600 ℃ high temperature. Fire-resistance performance of inorganic adhesive can meet the requirements of fiber reinforced polymer （FRP） strengthened RC structures.展开更多
To further improve the performance of binders,a SiHfBCN-based high-temperature resistant adhesive was successfully synthesized by Polymer-Derived Ceramics(PDC)route using TiB2,Polysiloxane(PSO)and short SiC nanowires ...To further improve the performance of binders,a SiHfBCN-based high-temperature resistant adhesive was successfully synthesized by Polymer-Derived Ceramics(PDC)route using TiB2,Polysiloxane(PSO)and short SiC nanowires as fillers.The effect of short SiC nanowires on the adhesive strength at room temperature and high temperature,as well as the reinforcing mechanism was studied.Compared with the adhesive without SiC nanowires,after curing(at 170℃)and pyrolysis(at 1000℃)in air,the appropriate adding of SiC nanowires upgrades the room temperature and high temperature(at 1000℃ in air)adhesive strength to(12.50±0.67)MPa(up by about 32%)and(13.11±0.79)MPa(up by about 106%),respectively.Attractively,under the synergistic impact of the nanowire bridging,nanowire breaking,nanowire drawing and crack deflection,the optimized adhesive exhibits multi-stage fracture,causing the increscent fracture displacement.展开更多
基金Funded by the National Natural Science Foundation of China(No.50678050)
文摘Organic epoxy matrices have been widely used in the FRP reinforcing technique, but they have serious disadvantages of poor high-temperature resistance. An inorganic adhesive is invented to replace the organic adhesive. For the inorganic adhesive at normal temperature and different high temperatures, the microstructure and phase composition are investigated by means of X-ray diffraction （XRD） and SEM respectively. Results show that inorganic adhesive can resist at least 600 ℃ high temperature. Fire-resistance performance of inorganic adhesive can meet the requirements of fiber reinforced polymer （FRP） strengthened RC structures.
基金co-supported by the National Natural Science Foundation of China (No. 52061135102)the Innovation Training Foundation for College Students of Northwestern Polytechnical University, China (No. 202310699180)the Creative Research Foundation of the Science and Technology on Thermostructural Composite Materials Laboratory
文摘To further improve the performance of binders,a SiHfBCN-based high-temperature resistant adhesive was successfully synthesized by Polymer-Derived Ceramics(PDC)route using TiB2,Polysiloxane(PSO)and short SiC nanowires as fillers.The effect of short SiC nanowires on the adhesive strength at room temperature and high temperature,as well as the reinforcing mechanism was studied.Compared with the adhesive without SiC nanowires,after curing(at 170℃)and pyrolysis(at 1000℃)in air,the appropriate adding of SiC nanowires upgrades the room temperature and high temperature(at 1000℃ in air)adhesive strength to(12.50±0.67)MPa(up by about 32%)and(13.11±0.79)MPa(up by about 106%),respectively.Attractively,under the synergistic impact of the nanowire bridging,nanowire breaking,nanowire drawing and crack deflection,the optimized adhesive exhibits multi-stage fracture,causing the increscent fracture displacement.
