The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show...The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.展开更多
Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review o[ several p...Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review o[ several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.展开更多
基金supported by the German Research Foundation (DFG) under grants OS111/22 and PA792/4
文摘The reliability of microsystems is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show how interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.
基金the financial support from the National Basic Research Program of China(Project‘973’)(Nos.2010CB631005 and 2011CB606105)the National Natural Science Foundation of China(Nos.91216301,11172151,11232008,11072033 and 11372037)+1 种基金Tsinghua University Initiative Scientific Research Program,Program for New Century Excellent Talents in University(grant No.NCET-12-0036)Natural Science Foundation of Beijing,China(grant No.3122027)
文摘Residual stress measurement is of critical significance to in-service security and the reliability of engineering components, and has been an active area of scientific interest. This paper offers a review o[ several prominent mechanical release methods for residual stress measurement and recent developments, focusing on the hole-drilling method combined with advanced optical sensing. Some promising trends for mechanical release methods are also analyzed.
