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The abnormal electrostatic discharge of a no-connect metal cover in a ceramic packaging device
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作者 李松 曾传滨 +1 位作者 罗家俊 韩郑生 《Journal of Semiconductors》 EI CAS CSCD 2013年第8期74-78,共5页
The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and d... The human body model(HBM) stress of a no-connect metal cover is tested to obtain the characteristics of abnormal electrostatic discharge,including current waveforms and peak current under varied stress voltage and device failure voltage.A new discharge model called the "sparkover-induced model" is proposed based on the results.Then,failure mechanism analysis and model simulation are performed to prove that the transient peak current caused by a sparkover of low arc impedance will result in the devices' premature damage when the potential difference between the no-connect metal cover and the chip exceeds the threshold voltage of sparkover. 展开更多
关键词 electrostatic discharge human body model no-connect metal cover sparkover
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