UV-curable hyperbranched polyurethane acrylate-polyurethane diacrylate/SiO2 dispersion （HBPUA-PUDA/SiO2） was prepared with isophorone diisocyanate （IPDI）, hyperbranched polyester Boltorn H20 （H20）, hydroxy-ethyl...UV-curable hyperbranched polyurethane acrylate-polyurethane diacrylate/SiO2 dispersion （HBPUA-PUDA/SiO2） was prepared with isophorone diisocyanate （IPDI）, hyperbranched polyester Boltorn H20 （H20）, hydroxy-ethyl acrylate （HEA）, polyethyleneglycol （PEG-200）and nano-SiO2. The UV curing kinetics of the films was investigated by FTIR. The results show that the curing speed of the films increases with the adding of nano-SiO2 and decreases with the adding of PUDA due to the slower chain movement. The thermal stability of the HBPUA-PUDA/SiO2 films was studied by using thermogravimetric analysis coupled with Fourier transform infrared spectroscopy （TGA/FTIR）. The results show that all films exhibit two degradation stages located at about 320 and 440℃ corresponding to the degradation for hard segments of urethane-acrylate and the degradation for soft segment and polyester core. In addition, the results from the analysis of TGA/FTIR also indicate that the decomposition temperature of HBPUA-PUDA/SiO2 film is 15℃ higher than that obtained for pure polymer. The degradation mechanism was proposed according to TGA/FTIR results.展开更多
UV-curable hyperbranched polyurethane （UV-HBPU） containing carboxyl groups was synthesized from isophorone diisocyanate （IPDI）, diethanolamine （DEOA）, polyethylene glycol （PEG-400）, hydroxyethyl acrylate （HEA...UV-curable hyperbranched polyurethane （UV-HBPU） containing carboxyl groups was synthesized from isophorone diisocyanate （IPDI）, diethanolamine （DEOA）, polyethylene glycol （PEG-400）, hydroxyethyl acrylate （HEA）, and 2,2-his （hydroxymethyl） propionic acid （DMPA）. The UV-HBPU was used as a negative-type photoresist for a printed circuit board （PCB）. Fourier-transform infrared spectroscopy （FTIR） and proton nuclear magnetic resonance （1HNMR） spectroscopy of UV-HBPUs indicated that the synthesis was successful. Differential scanning calorimetry （DSC） and thermogravimetric analysis （TGA） showed that the thermal stability of the UV-HBPUs decreased as the HEA content increased. The polymer exhibited excellent photoresist properties, and the resolution of circuits based on this negative-type photoresist reached 10 μm.展开更多
文摘UV-curable hyperbranched polyurethane acrylate-polyurethane diacrylate/SiO2 dispersion （HBPUA-PUDA/SiO2） was prepared with isophorone diisocyanate （IPDI）, hyperbranched polyester Boltorn H20 （H20）, hydroxy-ethyl acrylate （HEA）, polyethyleneglycol （PEG-200）and nano-SiO2. The UV curing kinetics of the films was investigated by FTIR. The results show that the curing speed of the films increases with the adding of nano-SiO2 and decreases with the adding of PUDA due to the slower chain movement. The thermal stability of the HBPUA-PUDA/SiO2 films was studied by using thermogravimetric analysis coupled with Fourier transform infrared spectroscopy （TGA/FTIR）. The results show that all films exhibit two degradation stages located at about 320 and 440℃ corresponding to the degradation for hard segments of urethane-acrylate and the degradation for soft segment and polyester core. In addition, the results from the analysis of TGA/FTIR also indicate that the decomposition temperature of HBPUA-PUDA/SiO2 film is 15℃ higher than that obtained for pure polymer. The degradation mechanism was proposed according to TGA/FTIR results.
基金Funded by the National Natural Science Foundation of China(Nos.51203063,51103064)
文摘UV-curable hyperbranched polyurethane （UV-HBPU） containing carboxyl groups was synthesized from isophorone diisocyanate （IPDI）, diethanolamine （DEOA）, polyethylene glycol （PEG-400）, hydroxyethyl acrylate （HEA）, and 2,2-his （hydroxymethyl） propionic acid （DMPA）. The UV-HBPU was used as a negative-type photoresist for a printed circuit board （PCB）. Fourier-transform infrared spectroscopy （FTIR） and proton nuclear magnetic resonance （1HNMR） spectroscopy of UV-HBPUs indicated that the synthesis was successful. Differential scanning calorimetry （DSC） and thermogravimetric analysis （TGA） showed that the thermal stability of the UV-HBPUs decreased as the HEA content increased. The polymer exhibited excellent photoresist properties, and the resolution of circuits based on this negative-type photoresist reached 10 μm.
