Static load test and load transfer mechanism study of squeezed branch and plate pile in collapsible loess foundation

As a special geological phenomenon, the character of collapsible loess foundation is collapsible when penetrated by water. This character leads to the soil losing load bearing capacity largely and may lead to foundation failure. Pile is a popular foundation used in collapsible loess. The squeezed branch and plate pile is a new type of pile developed in recent years and has not be used in a project before. In this paper three squeezed branch and plate piles are tested in collapsible loess after immersion processing. The results may be used for reference in similar construction project, and to provide theoretical references for de- signing of the squeezed branch and plate piles in engineering practice.

Electrochemical migration behavior and mechanism of PCB-ImAg and PCB-HASL under adsorbed thin liquid films

The electrochemical migration（ECM） behavior and mechanism of immersion silver processing circuit board（PCB-ImAg）and hot air solder leveling circuit board（PCB-HASL） under the 0.1 mol/L Na2SO4 absorbed thin liquid films with different thicknesses were investigated using stereo microscopy and scanning electron microscopy（SEM）.Meanwhile,the corrosion tendency and kinetics rule of metal plates after bias application were analyzed with the aid of electrochemical impedance spectroscopy（EIS）and scanning Kelvin probe（SKP）.Results showed that under different humidity conditions,the amount of migrating corrosion products of silver for PCB-ImAg was limited,while on PCB-HASL both copper dendrites and precipitates such as sulfate and metal oxides of copper/tin were found under a high humidity condition（exceeding 85%）.SKP results indicated that the cathode plate of two kinds of PCB materials had a higher corrosion tendency after bias application.An ECM model involving multi-metal reactions was proposed and the differences of ECM behaviors for two kinds of PCB materials were compared.