High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensi...High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensional high- density packaging method that integrates a chip scale package （CSP） in the top package and a fine-pitch ball grid array （FBGA） in the bottom package. In this paper, in-situ scanning electron microscopy （SEM） observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results.展开更多
基金Projects supported by the National Natural Science Foundation of China(Grant Nos.11072124 and 11272173)the National Basic Research Program of China(Grant No.2010CB631006)the State Key Laboratory of Advanced Metals and Materials, China(Grant No.2010ZD-04)
文摘High density packaging is developing toward miniaturization and integration, which causes many difficulties in designing, manufacturing, and reliability testing. Package-on-Package （POP） is a promising three-dimensional high- density packaging method that integrates a chip scale package （CSP） in the top package and a fine-pitch ball grid array （FBGA） in the bottom package. In this paper, in-situ scanning electron microscopy （SEM） observation is carried out to detect the deformation and damage of the PoP structure under three-point bending loading. The results indicate that the cracks occur in the die of the top package, then cause the crack deflection and bridging in the die attaching layer. Furthermore, the mechanical principles are used to analyse the cracking process of the PoP structure based on the multi-layer laminating hypothesis and the theoretical analysis results are found to be in good agreement with the experimental results.
