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空位和Si掺杂对In在石墨烯上吸附的影响 被引量:4
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作者 戴宪起 孙永灿 +1 位作者 赵建华 危书义 《新型炭材料》 SCIE EI CAS CSCD 北大核心 2011年第1期46-51,共6页
利用第一性原理方法计算了空位和Si(硅)替位掺杂对In(铟)原子在石墨烯上吸附的影响。结果表明:在低覆盖度下,空位比Si替位掺杂更能增强In在石墨烯上的吸附,主要原因在于空位引入更多的悬挂键,加强了In和石墨烯之间相互作用。而对于较高... 利用第一性原理方法计算了空位和Si(硅)替位掺杂对In(铟)原子在石墨烯上吸附的影响。结果表明:在低覆盖度下,空位比Si替位掺杂更能增强In在石墨烯上的吸附,主要原因在于空位引入更多的悬挂键,加强了In和石墨烯之间相互作用。而对于较高覆盖度,Si替位掺杂却比空位对In吸附在石墨烯上的影响更强。无论是较高覆盖度还是低覆盖度,空位和Si替位掺杂均增强了In在石墨烯上的吸附。 展开更多
关键词 第一性原理 吸附 空位 掺杂 石墨烯
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Te vapor annealing of indium-doped CdMnTe crystals
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作者 张继军 王林军 +3 位作者 闵嘉华 秦凯丰 施朱斌 梁小燕 《Journal of Semiconductors》 EI CAS CSCD 2013年第3期17-20,共4页
Thermal annealing in Te vapor atmosphere was adopted to improve the properties of indium-doped Cd_(1-x)Mn_xTe(x=0.2,CdMnTe) wafers grown by the vertical Bridgman method.The wafers before and after annealing were chara... Thermal annealing in Te vapor atmosphere was adopted to improve the properties of indium-doped Cd_(1-x)Mn_xTe(x=0.2,CdMnTe) wafers grown by the vertical Bridgman method.The wafers before and after annealing were characterized by measuring the Te inclusions,etch pit density(EPD),Mn composition,resistivity, and impurity.IR transmission microscopy and EPD measurements revealed that the densities of Te inclusions reduced from(5-9)×10~4 cm^(-3) to(2-4)×10~4 cm^(-3) and EPD from 10~5 cm^(-2) to 10~4 cm^(-2) after annealing. NIR transmission spectroscopy showed that the Mn composition increased by 0.002-0.005 mole fractions during the annealing.The resistivity of the wafers improved from(2.0-4.5)×10~8Ω·cm to(1.7-3.8)×10~9Ω·cm,which suggested that the deep-level donor of Te antisites was successfully introduced after annealing.Inductively coupled plasma-mass spectrometry(ICP-MS) revealed that the concentrations of impurities in the wafer decreased,which indicated the purifying effects of Te vapor annealing on the wafers.All the results demonstrate that the Te vapor annealing of the indium-doped CdMnTe crystal has positive effects on the crystallinity,resistivity and purity of CdMnTe wafers. 展开更多
关键词 Cd_(1-x)Mn_xTe indium dopant Te vapor annealing resistivity IMPURITY
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