Entangled porous metallic wire material(EPMWM)has the potential as a thermal insulation material in defence and engineering.In order to optimize its thermophysical properties at the design stage,it is of great signifi...Entangled porous metallic wire material(EPMWM)has the potential as a thermal insulation material in defence and engineering.In order to optimize its thermophysical properties at the design stage,it is of great significance to reveal the thermal response mechanism of EPMWM based on its complex structural effects.In the present work,virtual manufacturing technology(VMT)was developed to restore the physics-based 3D model of EPMWM.On this basis,the transient thermal analysis is carried out to explore the contact-relevant thermal behavior of EPMWM,and then the spiral unit containing unique structural information are further extracted and counted.In particular,the thermal resistance network is numerically constructed based on the spiral unit through the thermoelectric analogy method to accurately predict the effective thermal conductivity(ETC)of EPMWM.Finally,the thermal diffusivity and specific heat of the samples were obtained by the laser thermal analyzer to calculate the ETC and thermal insulation factor of interest.The results show that the ETC of EPMWM increases with increasing temperature or reducing density under the experimental conditions.The numerical prediction is consistent with the experimental result and the average error is less than 4%.展开更多
Based on the obtained data of half-lives(t1/2) for 31 polychlorinated biphenyl congeners(PCBs), 3D quantitative structure-activity relationship(QSAR) pharmacophore was used to establish a 3D QSAR model to predic...Based on the obtained data of half-lives(t1/2) for 31 polychlorinated biphenyl congeners(PCBs), 3D quantitative structure-activity relationship(QSAR) pharmacophore was used to establish a 3D QSAR model to predict the t1/2 values of the remaining 178 PCBs, using the structural parameters as independent variables and lgt1/2 values as the dependent variable. Among this process, the whole data set(31 compounds) was divided into a training set(24 compounds) for model generation and a test set(7 compounds) for model validation. Then, the full factor experimental design was used to research the potential second-order interactional effect between different substituent positions, obtaining the final regulation scheme for PCB. At last, a 3D QSAR pharmacophore model was established to validate the reasonable regulation targeting typical PCB with respect to half-lives and thermostability. As a result, the cross-validation correlation coefficient(q2) obtained by the 3D QSAR model was 0.845(〉0.5) and the coefficient of determination(r2) obtained was 0.936(〉0.9), indicating that the models were robust and predictive. CoMSIA analyses upon steric, electrostatic and hydrophobic fields were 0.7%, 85.9%, and 13.4%, respectively. The electrostatic field was determined to be a primary factor governing the tt/2. From CoMSIA contour maps, tl/2 increased when substi- tuents possessed electropositive groups at the 2'-, 3-, Y-, 5- and 5'- positions and electronegative groups at the 3-, 3'-, 5-, 6- and 6'- positions, which could increase the PCB stability in transformer insulation oil. Modification of two typical PCB congeners(PCB-77 and PCB-81) showed that the lgtl/2 for three selected modified compounds increased by 13%(average ratio) compared with that of each congener and the thermostability of them were higher, validating the reasonability of the regulatory scheme obtained from the 3D QSAR model. These results are expected to be beneficial in predicting tl/2 values of PCB homologues and derivatives and in providing a theoretical foundation for further elucidation of the stability of PCBs.展开更多
基金National Natural Science Foundation of China(Grant Nos.52175162,51805086 and 51975123)Natural Science Foundation of Fujian Province,China(Grant No.2019J01210)Health Education Joint Project of Fujian Province,China(Grant No.2019-WJ-01).
文摘Entangled porous metallic wire material(EPMWM)has the potential as a thermal insulation material in defence and engineering.In order to optimize its thermophysical properties at the design stage,it is of great significance to reveal the thermal response mechanism of EPMWM based on its complex structural effects.In the present work,virtual manufacturing technology(VMT)was developed to restore the physics-based 3D model of EPMWM.On this basis,the transient thermal analysis is carried out to explore the contact-relevant thermal behavior of EPMWM,and then the spiral unit containing unique structural information are further extracted and counted.In particular,the thermal resistance network is numerically constructed based on the spiral unit through the thermoelectric analogy method to accurately predict the effective thermal conductivity(ETC)of EPMWM.Finally,the thermal diffusivity and specific heat of the samples were obtained by the laser thermal analyzer to calculate the ETC and thermal insulation factor of interest.The results show that the ETC of EPMWM increases with increasing temperature or reducing density under the experimental conditions.The numerical prediction is consistent with the experimental result and the average error is less than 4%.
文摘Based on the obtained data of half-lives(t1/2) for 31 polychlorinated biphenyl congeners(PCBs), 3D quantitative structure-activity relationship(QSAR) pharmacophore was used to establish a 3D QSAR model to predict the t1/2 values of the remaining 178 PCBs, using the structural parameters as independent variables and lgt1/2 values as the dependent variable. Among this process, the whole data set(31 compounds) was divided into a training set(24 compounds) for model generation and a test set(7 compounds) for model validation. Then, the full factor experimental design was used to research the potential second-order interactional effect between different substituent positions, obtaining the final regulation scheme for PCB. At last, a 3D QSAR pharmacophore model was established to validate the reasonable regulation targeting typical PCB with respect to half-lives and thermostability. As a result, the cross-validation correlation coefficient(q2) obtained by the 3D QSAR model was 0.845(〉0.5) and the coefficient of determination(r2) obtained was 0.936(〉0.9), indicating that the models were robust and predictive. CoMSIA analyses upon steric, electrostatic and hydrophobic fields were 0.7%, 85.9%, and 13.4%, respectively. The electrostatic field was determined to be a primary factor governing the tt/2. From CoMSIA contour maps, tl/2 increased when substi- tuents possessed electropositive groups at the 2'-, 3-, Y-, 5- and 5'- positions and electronegative groups at the 3-, 3'-, 5-, 6- and 6'- positions, which could increase the PCB stability in transformer insulation oil. Modification of two typical PCB congeners(PCB-77 and PCB-81) showed that the lgtl/2 for three selected modified compounds increased by 13%(average ratio) compared with that of each congener and the thermostability of them were higher, validating the reasonability of the regulatory scheme obtained from the 3D QSAR model. These results are expected to be beneficial in predicting tl/2 values of PCB homologues and derivatives and in providing a theoretical foundation for further elucidation of the stability of PCBs.