A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna arra...A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.展开更多
The article is commonly about the impact of globalization on participants of pedagogical process in the condition of communication. The globalization leaves its tracks in separate spheres of the educational system as ...The article is commonly about the impact of globalization on participants of pedagogical process in the condition of communication. The globalization leaves its tracks in separate spheres of the educational system as well as it impacts all spheres of modern life. The relation between a teacher and a student differs with its peculiarity in the contemporary life. A pupil or a student differs totally in classifying the information gained in his activity. A modem student demonstrates a special attitude to everyday events and gets an independent position. Such reality demands the teacher of the day to have a very high practice; the necessity of contemporary training in the process of training-education can be marked as the appearance of globalization. It occurs as a demand for globalization as well. All these items after being analyzed bring some conclusions.展开更多
In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly d...In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly described.Owing to the high efficiency,low profile,and light weight of the active array microsystems,the application prospects and advantages in the engineering of multi-functional airborne radar,spaceborne radar,and communication systems are analyzed.Moreover,according to the characteristics of the post-Moore era of integrated circuits,scientific and technological problems in the active array microsystems are presented,including multi-scale,multi-signal,and multi-physics field coupling.The challenges are also discussed,such as new architectures and algorithms,miniaturization of passive components,novel materials and processes,ultra-wideband technology,and new interdisciplinary technological applications.This paper is expected to inspire in-depth research on active array microsystems.展开更多
倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。该文详细介绍FC-IPEM的结构和组装程序。...倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。该文详细介绍FC-IPEM的结构和组装程序。在实验室完成由两只MOSFET和驱动、保护等电路构成的半桥FC-IPEM,并采用它构成同步整流Buck变换器,对半桥FC-IPEM进行电气性能测试,最后给出测试结果。展开更多
封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module,IPEM)的电气性能、EMI特性和热性能等,被公认为未来电力电子技术发展的核心推动力。介绍了IPEM封装的结构与互连和基板技术等关键技术及研究现状,分析了已存...封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module,IPEM)的电气性能、EMI特性和热性能等,被公认为未来电力电子技术发展的核心推动力。介绍了IPEM封装的结构与互连和基板技术等关键技术及研究现状,分析了已存在的薄膜覆盖封装技术等三维IPEM封装技术,讨论了IPEM封装的发展趋势,最后指出我国IPEM封装技术研究的限制因素与对策。展开更多
文摘A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied.First of all,through the double-sided wiring technology on the glass wafer,the fabrication of 5G antenna array is realized.Then the low power devices such as through silicon via(TSV)transfer chips,filters and antenna tuners are flip-welded on the glass wafer,and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material.Finally,the thinning resin surface leaks out of the TSV transfer chip,the rewiring is carried out on the resin surface,and then the power amplifier,low-noise amplifier,power management and other devices are flip-welded on the resin wafer surface.A ball grid array(BGA)is implanted to form the final package.The loss of the RF transmission line is measured by using the RF millimeter wave probe table.The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small,and it is only 0.26 dB/mm when working in 60 GHz.A slot coupling antenna is designed on the glass wafer.The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth.This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.
文摘The article is commonly about the impact of globalization on participants of pedagogical process in the condition of communication. The globalization leaves its tracks in separate spheres of the educational system as well as it impacts all spheres of modern life. The relation between a teacher and a student differs with its peculiarity in the contemporary life. A pupil or a student differs totally in classifying the information gained in his activity. A modem student demonstrates a special attitude to everyday events and gets an independent position. Such reality demands the teacher of the day to have a very high practice; the necessity of contemporary training in the process of training-education can be marked as the appearance of globalization. It occurs as a demand for globalization as well. All these items after being analyzed bring some conclusions.
基金Project supported by the National Natural Science Foundation of China(No.92373115)the Natural Science Foundation of Anhui Province,China(No.2308085MF193)+2 种基金the Major Natural Science Project of Anhui Provincial Education Department,China(No.KJ2021ZD0003)the Key Research and Development Project of Anhui Province,China(No.2023n06020026)the Innovation and Entrepreneurship of Anhui Province,China(No.Z020118060)。
文摘In the post-Moore era,the development of active phased array antennas will inevitably trend towards active array microsystems.In this paper,the characteristics and composition of the active array antenna are briefly described.Owing to the high efficiency,low profile,and light weight of the active array microsystems,the application prospects and advantages in the engineering of multi-functional airborne radar,spaceborne radar,and communication systems are analyzed.Moreover,according to the characteristics of the post-Moore era of integrated circuits,scientific and technological problems in the active array microsystems are presented,including multi-scale,multi-signal,and multi-physics field coupling.The challenges are also discussed,such as new architectures and algorithms,miniaturization of passive components,novel materials and processes,ultra-wideband technology,and new interdisciplinary technological applications.This paper is expected to inspire in-depth research on active array microsystems.
文摘倒装芯片(Flip Chip,FC)技术广泛应用于微电子封装中,将该技术引入到三维的集成电力电子模块(Integrated Power Electronics Module,IPEM)的封装中,可以构成倒装芯片集成电力电子模块(FC-IPEM)。该文详细介绍FC-IPEM的结构和组装程序。在实验室完成由两只MOSFET和驱动、保护等电路构成的半桥FC-IPEM,并采用它构成同步整流Buck变换器,对半桥FC-IPEM进行电气性能测试,最后给出测试结果。
文摘封装技术直接影响到集成电力电子模块(Integrated Power Electronics Module,IPEM)的电气性能、EMI特性和热性能等,被公认为未来电力电子技术发展的核心推动力。介绍了IPEM封装的结构与互连和基板技术等关键技术及研究现状,分析了已存在的薄膜覆盖封装技术等三维IPEM封装技术,讨论了IPEM封装的发展趋势,最后指出我国IPEM封装技术研究的限制因素与对策。
