In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point con...In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.展开更多
In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resi...In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.展开更多
40 years ago, there was a revolution in power converter efficiency, density, size and cost, with the introduction of silicon MOSFETs,PWM integrated circuits(ICs),new magnetic materials and new switch-mode power topolo...40 years ago, there was a revolution in power converter efficiency, density, size and cost, with the introduction of silicon MOSFETs,PWM integrated circuits(ICs),new magnetic materials and new switch-mode power topologies.Now,another revolution is enabled with wide band-gap gallium nitride(GaN) power ICs,new control ICs,new magnetics and the commercialization of high-frequency topologies.Monolithic integration combines GaN FET,GaN logic,GaN driver and now GaN level-shifters,to enable MHz+switching without parasitic concerns.This paper introduces the AllGaN^(TM) 650 V lateral GaN technology, essential GaN power ICs features and performance across a wide range of applications, at up to 1 MHz,from 25 W to 3.2 kW.展开更多
基金Sponsored by the Heilongjiang Provincial Project(Grant No.12511121)the Harbin City Innovation Talent Project(Grant No.2011RFXXG019)the National Science and Technology Support Project(Grant No.2012BAH28F02)
文摘In this paper,high-power LED with many integrated chips is used as thermal resistance analysis research object, and we do thermal resistance testing technology research on it. We put forward the thermocouple point contact test method. According to the principle that LED forward voltage changes with temperature,LED heat sink to surface temperature distribution is studied directly in the test,and then we analyze the thermal resistance of high-power LED with many integrated chips when its secondary packaging is introduced. This method makes the measurement of thermal resistance of LED more rapid and convenient. It provides an effective assessment method for the analysis of high power LED device design and engineering application.
基金Special Fund Project of Science and Technology Innovation of Dongli District(21090302)Research Projectof Applied Basic and Front Technologies of Tianjin(10JCZDJC15400)
文摘In order to study the role of printed circuit board(PCB)in high-power LED heat dissipation,a simple model of high-power LED lamp was designed.According to this lamp model,some thermal performances such as thermal resistances of four types of PCB and the changes of LED junction temperature were tested under three different working currents.The obtained results indicate that LED junction temperature can not be lowered significantly with the decreasing thermal resistance of PCB.However,PCB with low thermal resistance can be matched with smaller volume heat sink,so it is hopeful to reduce the size,weight and cost of LED lamp.
文摘40 years ago, there was a revolution in power converter efficiency, density, size and cost, with the introduction of silicon MOSFETs,PWM integrated circuits(ICs),new magnetic materials and new switch-mode power topologies.Now,another revolution is enabled with wide band-gap gallium nitride(GaN) power ICs,new control ICs,new magnetics and the commercialization of high-frequency topologies.Monolithic integration combines GaN FET,GaN logic,GaN driver and now GaN level-shifters,to enable MHz+switching without parasitic concerns.This paper introduces the AllGaN^(TM) 650 V lateral GaN technology, essential GaN power ICs features and performance across a wide range of applications, at up to 1 MHz,from 25 W to 3.2 kW.
