Top and bottom NiO-pinning spin valves of Si/Ta/NiO/Co/Cu/Co/Ta and Si/Ta/Co/Cu/Co/NiO/Ta were prepared by magnetron sputtering, and X-ray diffraction and giant magnetoresistance （GMR） ratio were measured in the tem...Top and bottom NiO-pinning spin valves of Si/Ta/NiO/Co/Cu/Co/Ta and Si/Ta/Co/Cu/Co/NiO/Ta were prepared by magnetron sputtering, and X-ray diffraction and giant magnetoresistance （GMR） ratio were measured in the temperature range from 5 to 300 K. For the bottom spin valve, the interracial roughness at NiO/Co is much smaller than that of Co/NiO in the top one. The Co/Cu and Cu/Co interfaces have the same roughness in the bottom and the top spin valves. NiO, Co, and Cu layers have （111） preferred orientations in the top one and random orientations in the bottom one. The GMR ratio of the bottom spin valve is larger than that of the top one at all temperatures and their difference increases with decreasing temperature.展开更多
Microstructure of NiO-containing Co/Cu/Co spin valves （CCC-SV） annealed at room temperature for nearly four years has been studied by synchrotron radiation X-ray diffraction. With the annealing time expanding, the t...Microstructure of NiO-containing Co/Cu/Co spin valves （CCC-SV） annealed at room temperature for nearly four years has been studied by synchrotron radiation X-ray diffraction. With the annealing time expanding, the thickness of each sub-layer remains nearly unchanged while the interface roughness varies obviously compared with that of samples without annealing. The roughness at the interface of NiO/Co decreases with the annealing time increasing for both of the samples with NiO layer on the top （TSV） and under the bottom （BSV） of CCC-SV. On the other hand, the roughness at Co/Cu interface increases with the annealing time expanding for BSV while it decreases for TSV. These results indicate that the structure of TSV is more stable than that of BSV.展开更多
基金the National Natural Science Foundation of China （Grant No. 10174014, 60271013, 10321003, 60490290） the State Key Project of Fundamental Research （No. 001CB610602 , 2002CB613504） the Hong Kong RGC Grant （HKUST6165/01P）.
文摘Top and bottom NiO-pinning spin valves of Si/Ta/NiO/Co/Cu/Co/Ta and Si/Ta/Co/Cu/Co/NiO/Ta were prepared by magnetron sputtering, and X-ray diffraction and giant magnetoresistance （GMR） ratio were measured in the temperature range from 5 to 300 K. For the bottom spin valve, the interracial roughness at NiO/Co is much smaller than that of Co/NiO in the top one. The Co/Cu and Cu/Co interfaces have the same roughness in the bottom and the top spin valves. NiO, Co, and Cu layers have （111） preferred orientations in the top one and random orientations in the bottom one. The GMR ratio of the bottom spin valve is larger than that of the top one at all temperatures and their difference increases with decreasing temperature.
基金Supported by Open Project of Lab of Solid State Microstructures of Nanjing University (M06007)Doctoral Foundation of Hohai University (2084/40701117)Natural Science Foundation of Hohai University (2084/408307)
文摘Microstructure of NiO-containing Co/Cu/Co spin valves （CCC-SV） annealed at room temperature for nearly four years has been studied by synchrotron radiation X-ray diffraction. With the annealing time expanding, the thickness of each sub-layer remains nearly unchanged while the interface roughness varies obviously compared with that of samples without annealing. The roughness at the interface of NiO/Co decreases with the annealing time increasing for both of the samples with NiO layer on the top （TSV） and under the bottom （BSV） of CCC-SV. On the other hand, the roughness at Co/Cu interface increases with the annealing time expanding for BSV while it decreases for TSV. These results indicate that the structure of TSV is more stable than that of BSV.
