Prediction of the Interface Temperature Rise in Tribochemical Polishing of CVD Diamond

Tribochemcial polishing is one of the most efficient methods for polishing CVD （Chemical Vapor Deposition） diamond film due to the use of catalytic metal. However the difficulty to control the interface temperature during polishing process often results in low material removal because of the unstable contact process. So this research investigates the contact process in the tribo- chemical polishing of CVD diamond film and proposes a dynamic contact model for predicting the actual contact area, the actual contact pressure, and the interface tem- perature in the polishing process. This model has been verified by characterizing surface metrology of the CVD diamond with Talysurf CLI2000 3D Surface Topography and measuring the polishing temperature. The theoretical and experimental results shows that the height distribution of asperities on diamond film surface in the polishing process is well evaluated by combining the height distribution of original and polished asperities. The modeled surface asperity height distribution of diamond film agrees with the actual surface metrology in polishing process. The actual contact pressure is very large due to the small actual contact area. The predicted interface temperature can reach the catalytic reaction temperature between diamond and polishing plate when the lowest rotation speed and load are 10 000 r/min and 50 N, respectively, and diamond material is significantly removed. The model may provide effective process theory for tribochemcial polishing.

Ohmic Contact at Al/TiO_2/n-Ge Interface with TiO_2 Deposited at Extremely Low Temperature

TiO2deposited at extremely low temperature of 120°C by atomic layer deposition is inserted between metal and n-Ge to relieve the Fermi level pinning. X-ray photoelectron spectroscopy and cross-sectional transmission electron microscopy indicate that the lower deposition temperature tends to effectively eliminate the formation of GeOxto reduce the tunneling resistance. Compared with TiO2deposited at higher temperature of 250°C,there are more oxygen vacancies in lower-temperature-deposited TiO2, which will dope TiO2contributing to the lower tunneling resistance. Al/TiO2/n-Ge metal-insulator-semiconductor diodes with 2 nm 120°C deposited TiO2achieves 2496 times of current density at-0.1 V compared with the device without the TiO2interface layer case, and is 8.85 times larger than that with 250°C deposited TiO2. Thus inserting extremely low temperature deposited TiO2to depin the Fermi level for n-Ge may be a better choice.

Performance evaluation of minimum quantity lubrication by vege-table oil in terms of cutting force,cutting zone temperature,tool wear,job dimension and surface finish in turning AISI-1060 steel

In all machining processes, tool wear is a natural phenomenon and it leads to tool failure. The growing demands for high productivity of machining need use of high cutting velocity and feed rate. Such machining inherently produces high cutting temperature, which not only reduces tool life but also impairs the product quality. Metal cutting fluid changes the performance of machining operations because of their lubrication, cooling and chip flushing functions, but the use of cutting fluid has become more problematic in terms of both employee health and environmental pollution. The minimization of cutting fluid also leads to economical benefits by way of saving lubricant costs and workpiece/tool/machine cleaning cycle time. The concept of minimum quantity lubrication (MQL) has been suggested since a decade ago as a means of addressing the issues of environmental intru- siveness and occupational hazards associated with the airborne cutting fluid particles on factory shop floors. This paper deals with experimental investigation on the role of MQL by vegetable oil on cutting temperature, tool wear, surface roughness and dimen- sional deviation in turning AISI-1060 steel at industrial speed-feed combinations by uncoated carbide insert. The encouraging results include significant reduction in tool wear rate, dimensional inaccuracy and surface roughness by MQL mainly through reduction in the cutting zone temperature and favorable change in the chip-tool and work-tool interaction.

Effect of an external magnetic field on improved electroslag remelting cladding process

Obtaining a uniform interface temperature field plays a crucial role in the interface bonding quality of bimetal compound rolls.Therefore,this study proposes an improved electroslag remelting cladding(ESRC)process using an external magnetic field to improve the uniformity of the interface temperature of compound rolls.The improved ESRC comprises a conventional ESRC circuit and an external coil circuit.A comprehensive 3D model,including multi-physics fields,is proposed to study the effect of external magnetic fields on the multi-phys-ics fields and interface temperature uniformity.The simulated results demonstrate that the nonuniform Joule heat and flow fields cause a non-uniform interface temperature in the conventional ESRC.As for the improved ESRC,the magnetic flux density(B_(coil))along the z-axis is pro-duced by an anticlockwise current of the external coil.The rotating Lorentz force is generated from the interaction between the radial current and axial B_(coil).Therefore,the slag pool flows clockwise,which enhances circumferential effective thermal conductivity.As a result,the uniformity of the temperature field and interface temperature improve.In addition,the magnetic flux density and rotational speed of the simulated results are in good agreement with those of the experimental results,which verifies the accuracy of the improved ESRC model.Therefore,an improved ESRC is efficient for industrial production of the compound roll with a uniform interface bonding quality.