Unexpected high-temperature brittleness of a Mg-Gd-Y-Ag alloy

Rare earth(RE)can produce excellent precipitation hardening in Mg alloys.However,when forming a solid solution,it also deteriorates formability,a problem that can usually be overcome by raising deformation temperature.Here we report an unexpected observation of high temperature brittleness in a Mg-Gd-Y-Ag alloy.As the temperature reached 500℃,the formability decreased drastically,leading to severe intergranular fracture under only 0.5% strain.This was caused by failure of grain boundaries,which are weakened by segregated interfacial compounds.

Microstructure and Shear Properties Evolution of Minor Fe-Doped SAC/Cu Substrate Solder Joint under Isothermal Aging

Different amounts of Fe(0.005,0.01,0.03,0.05,and 0.07 wt%)were added to SAC305 to study the shear behavior damage of Fe-doped SAC solder joints under thermal loading(170℃,holding time of 0,250,500,and 750 h).The results show that during isothermal aging at 170℃,the average shear force of all solder joints decreases with increasing aging time,while the average fracture energy first increases and then decreases,reaching a maximum at 500 h.Minor Fe doping could both increase shear forces and related fracture energy,with the optimum Fe doping amount being 0.03 wt%within the entire aging range.This is because the doping Fe reduces the undercooling of the SAC305 alloy,resulting in the microstructure refining of solder joints.This in turn causes the microstructure changing from network structure(SAC305 joint:eutectic network+β-Sn)to a single matrix structure(0.03Fe-doped SAC305 joint:β-Sn matrix+small compound particles).Specifically,Fe atoms can replace some Cu in Cu_(6)Sn_(5)(both inside the solder joint and at the interface),and then form(Cu,Fe)_(6)Sn_(5) compounds,resulting in an increase in the elastic modulus and nanohardness of the compounds.Moreover,the growth of Cu_(6)Sn_(5) and Cu_(3)Sn intermetallic compounds(IMC)layer are inhibited by Fe doping even after the aging time prolonging,and Fe aggregates near the interface compound to form FeSn_(2).This study is of great significance for controlling the growth of interfacial compounds,stabilizing the microstructures,and providing strengthening strategy for solder joint alloy design.

Microstructure and shear properties evolution of Mn-doped SAC solder joint under isothermal aging

The effects of Mn addition(0.005,0.01,0.03,0.05,and 0.07 wt.%)on microstructure,shear mechanical behavior,and interfacial thermal stabilities of SAC305 joints were investigated under isothermal aging temperatures of 170 C with different aging time(0,250,500,and 750 h).It is found that Mn addition can increase fracture energy of joints without decreasing the shear strength.And the microstructures have transformed from the eutectic net-like structure in SAC305 solder joints into the structures based onβ-Sn matrix with intermetallic compounds(IMCs)distributed.By doping 0.07 wt.%Mn,the Cu_(6)Sn_(5) growth along the SAC305/Cu interface during thermal aging can be inhibited to some extent.During isothermal aging at 170°C,the maximum shear force of solder joint decreases continuously with aging time increasing,while the fracture energy rises first and then decreases,reaching the maximum at 500 h compared by that with the microstructure homogenization.Cu_(3)Sn growth between Cu_(3)Sn_(5)/Cu interface has been retarded most at the aging time of 250 h with 0.07 wt.%Mn-doped joints.With the aging time prolonging,the inhibition effect of Mn on CusSn IMC layer becomes worse.The strengthening effect of Mn can be explained by precipitation strengthening,and its mechanical behavior can be predicted by particle strengthening model proposed by Orowan.

Research of the Interface Microstructure and Thermal Treatment of Cold-Rolled Cu-Al Composite Strip Under Magnetic Field

The thermal treatment process of cold-rolled Cu-Al composite strip under magnetic field conditions is systematically investigated by means of metallographic microscope and universal testing machine to observe the interface microstructure and test the mechanical properties.The heat treatment parameters' effects to the interface structure and mechanical properties of Al-Cu cold-rolled strip are discussed.The conclusions is showed as follows:(1)when the magnetic field intensity is greater than 0.1 T,the interface layer grow widely and stimulate the interfacial compounds' generation,the shear strength is reduced.(2)When the Cu-Al specimen's annealing temperature is at the condition of 300℃,the interfacial layer narrows when the magnetic field strength stay 0.1T than that without magnetic field,the magnetic filed restrains the interfacial compounds' generation,the shear strength reaches as high as 124Mpa;(3)The interfacial compounds are meanly brittleness intermetallic compounds such as CuAl,CuAl_2,Cu_9Al.