Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233~1573 K, the wetting angles of CuNi-0~56 at pct Ti alloys on Si3N4 have been measured by the ses...Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233~1573 K, the wetting angles of CuNi-0~56 at pct Ti alloys on Si3N4 have been measured by the sessile drop method. With the increase of Ti content, the wetting angles decreased. The equilibrium wetting angle was 5° when Ti content ≥32 at pct.In the case of same Ti content, the activity of Ti in CuNiTi alloy was weaker than that in CuTi alloy The cross-section of the CuNiTi-Si3N4 interface and the elements distribution were examined by scanning electron microscope with X-ray wave-dispersion spectrometer, and the reaction products formed at the interface were determined by X-ray diffiaction analysis method.展开更多
In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K.Current findings...In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K.Current findings demonstrate that adequate wettability and satisfactory bonding have been achieved via chemical reactions between Ti and N,B.More importantly,we report,for the first time,the formation of a three-layer juxtaposition of reaction products,namely,TiN,TiB2 and TiB,along the diffusion path of Ti.Meanwhile,we determine the average layer thickness to be 1.24 μm.Through deep etching,we unambiguously present morphologies of the newly formed TiN and TiB2,which are columnar and bulky,re spectively,and constitute the formation of a high strength metallu rgical interfacial bonding layer,and is crucial towards gaining enhanced grinding performance.Finally,we propose a possible reaction sequence and mechanism that govern the nucleation and growth of corre s ponding crystals.展开更多
文摘Based on the alloy Cu55Ni45 (at pct), holding the proportion of Cu to Ni in constant and in the temperature range of 1233~1573 K, the wetting angles of CuNi-0~56 at pct Ti alloys on Si3N4 have been measured by the sessile drop method. With the increase of Ti content, the wetting angles decreased. The equilibrium wetting angle was 5° when Ti content ≥32 at pct.In the case of same Ti content, the activity of Ti in CuNiTi alloy was weaker than that in CuTi alloy The cross-section of the CuNiTi-Si3N4 interface and the elements distribution were examined by scanning electron microscope with X-ray wave-dispersion spectrometer, and the reaction products formed at the interface were determined by X-ray diffiaction analysis method.
基金financially supported by the National Natural Science Foundation of China (Nos.51622401,51861130361,51861145312 and 51850410522)the Newton Advanced Fellowship by Royal Society (No.RP12G0414)+4 种基金the Research Fund for Central Universities (Nos.N172502004 and N2025025)the Xing Liao Talents Program (Nos.XLYC1807024 and XLYC1802024)the NEU Innovation Team Projectthe Global Talents Recruitment Program endowed by the Chinese GovernmentState Key Laboratory of Solidification Processing,Northwestern Polytechnical University (No.SKLSP201805)。
文摘In the present study,we offer an in-depth analysis over the microstructure,thickness and product composition of the interfacial reaction layer generated upon CBN/Cu-Sn-Ti active filler metal at 1223 K.Current findings demonstrate that adequate wettability and satisfactory bonding have been achieved via chemical reactions between Ti and N,B.More importantly,we report,for the first time,the formation of a three-layer juxtaposition of reaction products,namely,TiN,TiB2 and TiB,along the diffusion path of Ti.Meanwhile,we determine the average layer thickness to be 1.24 μm.Through deep etching,we unambiguously present morphologies of the newly formed TiN and TiB2,which are columnar and bulky,re spectively,and constitute the formation of a high strength metallu rgical interfacial bonding layer,and is crucial towards gaining enhanced grinding performance.Finally,we propose a possible reaction sequence and mechanism that govern the nucleation and growth of corre s ponding crystals.
