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Microstructures and interfacial quality of diffusion bonded TC21 titanium alloy joints 被引量:7
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作者 刘会杰 冯秀丽 《Transactions of Nonferrous Metals Society of China》 SCIE EI CAS CSCD 2011年第1期58-64,共7页
Diffusion bonding of TC21 titanium alloy was carried out at temperature ranging from 780 ℃ to 980 ℃ for 5-90 min.The interfacial bonding ratio,deformation ratio,microstructures and microhardness of the diffusion bon... Diffusion bonding of TC21 titanium alloy was carried out at temperature ranging from 780 ℃ to 980 ℃ for 5-90 min.The interfacial bonding ratio,deformation ratio,microstructures and microhardness of the diffusion bonded joints were investigated.Results show that joints with high bonding quality can be obtained when bonded at 880 ℃ for 15?30 min.The microhardness increases with increasing the bonding temperature,while it has a peak value(HV367) when bonding time is prolonged up to 90 min.Fully equiaxed microstructures,bi-modal microstructures and fully lamellar microstructures were observed when bonded in temperature range of 780-880 ℃,at 930 ℃ or 980 ℃,respectively.The volume fraction of α phase first increases and achieves the maximum when bonded at 880 ℃ for 60 min,and then descended. 展开更多
关键词 TC21 titanium alloy diffusion bonding MICROSTRUCTURE interfacial quality
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