Regulating interfacial behavior of zinc metal anode via metal-organic framework functionalized separator

Aqueous zinc ion batteries(AZIBs)are one of the promising energy storage devices.However,uncontrolled dendrite and side reactions have seriously hindered its further application.In this study,the metal-organic framework(MOF)functionalized glass fiber separator(GF-PFC-31)was used to regulate interfacial behavior of zinc metal anode,enabling the development of high-performance AZIBs.In PFC-31,there areπ-πinteractions between two adjacent benzene rings with a spacing of 3.199 A.This spacing can block the passage of[Zn(H_(2)O)_6]^(2+)(8.6 A in diameter)through the GF-PFC-31 separator to a certain extent,which promotes the deposition process of Zn ions.In addition,the sulfonic acid group(-S03H)contained in GF-PFC-31 can form a hydrogen bonding network with H_(2)O,which can provide a desolvation effect and reduce the side reaction.Consequently,GF-PFC-31 separator achieves uniform deposition of Zn ions.The Zn‖GF-PFC-31‖Zn symmetric cell exhibits stable cycle life(3000 h at 1.2 mA cm^(-2),2000 h at 0.3 mA cm^(-2),and 2000 h at 5.0 mA cm^(-2)),and Zn‖GF-PFC-31‖MnO_(2) full cell with GF-PFC-31 separator can cycle for 1000 cycles at 1.2 A g^(-1)with capacity retention rate of 82.5%.This work provides a promising method to achieve high-performance AZIBs.

Understanding the interfacial behaviors of benzene alkylation with butene using chloroaluminate ionic liquid catalyst: A molecular dynamics simulation

To better understand the benzene alkylation with chloroaluminate ionic liquids(ILs) as catalyst, the interfacial properties between the benzene/butene binary reactants and chloroaluminate ILs with varying cation alkyl chain length and different anions were investigated using molecular dynamics(MD) simulations. The results indicate that ILs can obviously improve the interfacial width, solubility and diffusion of reactants compared to H_(2)SO_(4). The longer alkyl chains of cations present a density enrichment at the interface and protrude into the binary reactants phase. Furthermore, the ILs consisting of 1-octyl-3-methylimidazolium cations([Omim]^(+)) and the stronger acidity heptachlorodialuminate anions([Al_(2)Cl_(7)]^(-)) are more beneficial to promote the interfacial width and facilitate the dissolution and diffusion of benzene in both the IL bulk and the interfacial region in comparison to the ones with shorter alkyl chains cations and weaker acidity anions. The information gives us a better guideline for the design of ILs for benzene alkylation.

Interfacial behavior of a thermoelectric film bonded to a graded substrate

To improve the thermoelectric converting performance in applications such as power generation,reutilization of heat energy,refrigeration,and ultrasensitive sensors in scramjet engines,a thermoelectric film/substrate system is widely designed and applied,whose interfacial behavior dominates the strength and service life of thermoelectric devices.Herein,a theoretical model of a thermoelectric film bonded to a graded substrate is proposed.The interfacial shear stress,the normal stress in the thermoelectric film,and the stress intensity factors affected by various material and geometric parameters are comprehensively studied.It is found that adjusting the inhomogeneity parameter of the graded substrate,thermal conductivity,and current density of the thermoelectric film can reduce the risk of interfacial failure of the thermoelectric film/graded substrate system.Selecting a stiffer and thicker thermoelectric film is advantageous to the reliability of the thermoelectric film/graded substrate system.The results should be of great guiding significance for the present and upcoming applications of thermoelectric materials in various fields.

Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film

In this paper,we investigate the interfacial behavior of a thin one-dimensional(1D)hexagonal quasicrystal(QC)film bonded on an elastic substrate subjected to a mismatch strain due to thermal variation.The contact interface is assumed to be nonslipping,with both perfectly bonded and debonded boundary conditions.The Fourier transform technique is adopted to establish the integral equations in terms of interfacial shear stress,which are solved as a linear algebraic system by approximating the unknown phonon interfacial shear stress via the series expansion of the Chebyshev polynomials.The expressions are explicitly obtained for the phonon interfacial shear stress,internal normal stress,and stress intensity factors(SIFs).Finally,based on numerical calculations,we briefly discuss the effects of the material mismatch,the geometry of the QC film,and the debonded length and location on stresses and SIFs.

Growth behavior of interfacial compounds in galvanized steel joints with CuSi_3 filler under arc brazing

The galvanized steels were joined using a TIG arc brazing process with CuSi3 as the filler metal.The arcing time ranged from 1 s to 5 s with arcing current of 70 A in flowing argon.The possible reaction products at the interface were confirmed using thermodynamics,SEM,and EDS methods.The results show that a fragmention behavior in some whisker-like intermetallic compounds happens,and that there are two layers of Fe2Si and Fe5Si3 formed at the interface of the galvanized steel and copper filler.From this,the schematic cycle of the interface growth behavior of Fe/Si compounds and the fragmentation behavior of whisker-like intermetallic compounds are developed.

A visualized study of interfacial behavior of air–water two-phase flow in a rectangular Venturi channel

A visualized investigation was carried out on the effect of the diverging angle on the bubble motion and interfacial behavior in a Venturi-type bubble generator.It was found two or three large vortexes formed in the diverging section,resulting in strong reentrant jet flow in the front of the bubbles or slugs rushing out of the throat.The jet flow in return bumps into the ongoing bubbles or slugs,leading to strong interaction between the gas and liquid phases.The diverging angle has significant influence on the reentrant flow process and the performance of the bubble generator as well.Increasing the diverging angle results in the reentrant flow moving further forward to the upstream and intensifies the interaction between the two phases.As a consequence,the breakup or collapse of bubbles becomes more violent,whereby finer bubbles are generated.As such,the reentrant flow strongly links to the performance of the Venturi channel taken as a bubble generator,and that a moderate increase in the diverging angle can improve its performance without additional increase in flow resistance like that by increasing liquid flow rate.

Interfacial Behavior of Sulfur and Yttrium in Yttrium Modified Ni _3Al Based Alloy IC6 during High Temperature Oxidation Process

The interfacial behavior of sulfur and yttrium in the yttrium modified Ni 3Al based alloy IC6 during oxidation at 1100 ℃ was analyzed by X ray line scan of electron probe microstructural analysis(EPMA). The results show that the migration and segregation of sulfur to the interface between oxide scale and the substrate at high temperature is retarded owing to the presence of yttrium. This is attributed to the desulfurization by yttrium in the melt and the trapping of sulfur by yttrium rich phases during oxidation, which leads to improving the coherence between oxide scale and substrate. Another reason of increasing the high temperature oxidation resistance of alloy IC6 by the addition of yttrium is that yttrium migrates to the grain boundaries of oxides during oxidation and hence improve their strength. This results in the transformation of the oxide scale spallation cracks from intergranular cracks for alloy without yttrium to transgranular ones for yttrium modified alloy.

Interfacial heat transfer behavior at metal/die in finger-plated casting during high pressure die casting process

Heat transfer at the metal-die interface has a great influence on the solidification process and casting structure. As thin-wall components are extensively produced by high pressure die casting process(HPDC), the B390 alloy finger-plate casting was cast against an H13 steel die on a cold-chamber HPDC machine. The interfacial heat transfer behavior at different positions of the die was carefully studied using an inverse approach based on the temperature measurements inside the die. Furthermore, the filling process and the solidification rate in different finger-plates were also given to explain the distribution of interfacial heat flux(q) and interfacial heat transfer coefficient(h). Measurement results at the side of sprue indicates that qmax and hmax could reach 9.2 MW·m^(-2) and 64.3 kW ·m^(-2)·K^(-1), respectively. The simulation of melt flow in the die reveals that the thinnest(T_1) finger plate could accelerate the melt flow from 50 m·s^(-1) to 110 m·s^(-1). Due to this high velocity, the interfacial heat flux at the end of T_1 could firstly reach a highest value 7.92 MW·m^(-2) among the ends of T_n(n=2,3,4,5). In addition, the q_(max) and h_(max) values of T_2, T_4 and T_5 finger-plates increase with the increasing thickness of the finger plate. Finally, at the rapid decreasing stage of interfacial heat transfer coefficient(h), the decreasing rate of h has an exponential relationship with the increasing rate of solid fraction(f).

Influence of Bi Addition on Pure Sn Solder Joints: Interfacial Reaction, Growth Behavior and Thermal Behavior

The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds (IMCs) layer(7/-Cu6Sn5 + e-Cu3Sn) for various soldering time and the influence of Bi addition on the thermal behavior of Sn-xBi solder alloys were investigated. The Cu6Sn5 IMC could be observed as long as the molten solder contacted with the Cu substrate. However, with the longer welding time such as 60 and 300 s, the Cu3Sn IMC was formed at the interface between Cu6Sn5 and Cu substrate. With the increase of soldering time, the thickness of total IMCs increased, meanwhile, the grain size of Cu6Sn5 also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs, but excessive Bi (≥ 5 wt%) inhibited the growth of Cu6Sn5 and Cu3Sn IMC in Sn-xBi/ Cu microelectronic interconnects. Furthermore, with the Bi contents increasing (Sn-l0Bi solder in this present investigation), some Bi particles accumulated at the interface between Cu6Sn5 layer and the solder.

A study of metal/die interfacial heat transfer behavior of vacuum die cast pure copper

High pressure die casting copper is used to produce rotors for induction motors to improve efficiency.Experiments were carried out for a special"step-shape"casting with different step thicknesses.Based on the measured temperature inside the die,the interfacial heat transfer coefficient(IHTC)at the metal/die interface during vacuum die casting was evaluated by solving the inverse problem.The IHTC peak value was 4.5×10^3-11×10^3 W·m^-2·K^-1 under the basic operation condition.The influences of casting pressure,fast shot speed,pouring temperature and initial die surface temperature on the IHTC peak values were investigated.Results show that a greater casting pressure and faster shot speed could only increase the IHTC peak values at the location close to the ingate.An increase of pouring temperature and/or initial die surface temperature significantly increases the IHTC peak values.

Constitutive Behavior of the Interface between UHPC and Steel Plate without Shear Connector:From Experimental to Numerical Study

The application of ultra-high performance concrete(UHPC)as a covering layer for steel bridge decks has gained widespread popularity.By employing a connection without a shear connector between the steel plate and UHPC,namely,the sandblasted interface and the epoxy adhesive with sprinkled basalt aggregate interface,the installation cannot only be simplified but also the stress concentration resulting from the welded shear connectors can be eliminated.This study develops constitutive models for these two interfaces without shear connectors,based on the interfacial pull-off and push-out tests.For validation,three-point bending tests on the steel-UHPC composite plates are conducted.The results indicated that the proposed bilinear traction-separation model for the sandblasted interface and the trapezoidal traction-separation model for the epoxy adhesive with sprinkled basalt aggregate interface can generally calibrate the interfacial behavior.However,the utilization of the experimentally determined pure shear strength underestimates the load-carrying capacity of the composite plates in the case of three-point bending tests.By recalling the Mohr-Coulomb criterion,this underestimation is attributed to the enhancement of the interface shear strength by the presence of normal stress.

Effects of interfacial discontinuity on the fracture behavior in the superconductor-substrate system

This study concerns a two-dimensional model and the corresponding virtual crack closure technique(VCCT) implemented to solve the general boundary value problems that may explain why interface discontinuity has effects on the fracture behavior in the superconductor-substrate system. The interfacial discontinuity can be classified according to the material properties' continuity and their derivatives' continuity at the interface. For nonhomogeneous superconductor and substrate specimens with various material properties, a VCCT method is developed to calculate their fracture behavior. Furthermore, the effects of applied magnetic field amplitude and nonhomogeneous parameters are extensively and parametrically studied in two activation processes(zero-field cooling and field cooling). The integrative and computational study presented here provide a fundamental mechanistic understanding of the fracture mechanism in the superconductor-substrate system and sheds light on the rational design of interfacial continuity.

Evolution of interfacial heat transfer,contact behavior and microstructure during sub-rapid solidification of molten steel with different hydrogen contents

Typical Q235 low-carbon steel samples with different hydrogen contents(0.0004,0.0008,and 0.0013 wt.%)were prepared by adjusting the environment humidity and moisture.The effects of hydrogen on interfacial heat transfer,contact behavior,and microstructure evolution were investigated using a novel droplet solidification technique.The results revealed that when the hydrogen content increases from 0.0004 to 0.0013 wt.%,the maximum heat flux between the molten steel and cooling substrate decreases from 8.01 to 6.19 MW/m^(2),and the total heat removed in the initial 2 s reduces from 10.30 to 8.27 MJ/m^(2).Moreover,the final contact angle between the molten steel and substrate increases from 103.741°to 113.697°,and the number of pores on the droplet bottom surface increases significantly from 21 to 210 with the increase in hydrogen.The surface roughness of the droplet bottom surface increases from 20.902 to 49.181 pm.In addition,the average grain size of the droplet increases from 14.778 to 33.548 pm with the increase in the hydrogen content.The interfacial contact condition becomes worse due to the escape of hydrogen from the steel matrix during the cooling process,which leads to the reduction in the interfacial heat transfer and the increase in the grain size.

Toward accurate density and interfacial tension modeling for carbon dioxide/water mixtures

Phase behavior of carbon dioxide/water binary mixtures plays an important role in various CO2-based industry processes. This work aims to screen a thermodynamic model out of a number of promising candidate models to capture the vapor–liquid equilibria, liquid–liquid equilibria, and phase densities of CO2/H2O mixtures. A comprehensive analysis reveals that Peng–Robinson equation of state (PR EOS) (Peng and Robinson 1976), Twu α function (Twu et al. 1991), Huron–Vidal mixing rule (Huron and Vidal 1979), and Abudour et al. (2013) volume translation model (Abudour et al. 2013) is the best model among the ones examined;it yields average absolute percentage errors of 5.49% and 2.90% in reproducing the experimental phase composition data and density data collected in the literature. After achieving the reliable modeling of phase compositions and densities, a new IFT correlation based on the aforementioned PR EOS model is proposed through a nonlinear regression of the measured IFT data collected from the literature over 278.15–477.59 K and 1.00–1200.96 bar. Although the newly proposed IFT correlation only slightly improves the prediction accuracy yielded by the refitted Chen and Yang (2019)’s correlation (Chen and Yang 2019), the proposed correlation avoids the inconsistent predictions present in Chen and Yang (2019)’s correlation and yields smooth IFT predictions.

氯盐环境下UHPC-NC界面黏结性能试验研究

氯盐环境作为一种较为常见的化学侵蚀环境,研究其对超高性能混凝土(ultra-high performance concrete,UHPC)和普通混凝土(normal concrete,NC)界面耐久性能的影响对于UHPC加固混凝土结构和UHPC-NC组合结构的工程应用均具有重大的现实意义.基于此,通过在常规环境以及氯盐环境下的推出试验,获得了干湿循环次数(0次、25次、50次)、氯盐浸泡天数(0 d、50 d、100 d)及界面处理方式(钢丝刷刷毛、高压水射流冲毛、表面缓凝处理)对UHPC-NC界面黏结强度、界面黏结刚度及界面黏结滑移曲线的影响.结果表明:在100 d试验周期内,干湿循环及氯盐浸泡作用造成的界面黏结强度损失率不超过20%;氯盐环境作用时长的增加会导致界面黏结刚度的降低;随着界面粗糙度的增加,UHPC-NC试件的界面黏结强度以及界面黏结刚度均会增加;界面粗糙度的提高有助于界面抗氯盐侵蚀能力的提升.受到界面处理方法的影响,UHPC-NC试件经历干湿循环及氯盐浸泡后,荷载滑移曲线呈现2种不同的形式,分别对应光滑界面(钢丝刷刷毛界面)和其他界面(高压水射流冲毛界面和缓凝剂处理界面).各组试件的黏结滑移曲线在荷载到达峰值前趋于一致;荷载到达峰值后,前者存在荷载骤降段及持荷段,后者则随着滑移量的增加荷载不断降低.根据UHPC-NC黏结滑移曲线特征,提出了黏结滑移建议模型.

不同酶解条件下大豆分离蛋白结构特性及起泡性研究

以大豆分离蛋白(SPI)为原料,采用碱性蛋白酶(Alcalase)进行酶解(0~180 min),通过凝胶电泳、傅里叶红外光谱(FT-IR)和内源荧光光谱等方法探究酶解产物的结构变化;通过表面张力、界面蛋白吸附量等指标说明酶解产物的界面行为,并分析结构变化和界面行为对泡沫性质的影响。经酶解后,蛋白中7S和11S典型条带消失并有新条带产生(约24 ku);与SPI相比,水解物中α-螺旋含量减少,β-转角和无规则卷曲含量增加;荧光波长发生红移。以上结果说明蛋白结构展开,进而促进蛋白功能性的改变。结果发现,酶解90 min时样品起泡性最好(起泡性指数143.20%),可能由于此时水解物平均粒径最低(208.10 nm),溶解度较高(90.44%),表面张力最低,有利于提升水解物在空气-水界面的吸附速率,但由于酶解作用产生较小的肽段失去了蛋白质网络结构的能力,因而对泡沫稳定性有负面的影响。此外,酶解作用大大提高了蛋白抗氧化性。通过酶解可以有效地改善SPI的起泡性,拓宽了酶解后的SPI作为一种有效的起泡剂在食品中的应用范围。

层板销合木的界面滑移与木梁受弯性能

层板销合木(简称销合木)是一种由规格材通过销组合而成的新型结构用木材,与胶合木相比具有加工快捷、成本低且更加绿色环保等优点。为研究销合木梁的弯曲性能,设计了8组木梁的四点弯试验,试验参数包括销的种类(木销和竹销)、销间距(70、100和140 mm)和层板的数量(3、4和6层)。此外,为揭示层积材界面销连接抗剪性能对销合木梁受弯性能的贡献,开展了木销和竹销连接销合木推出试验研究。研究结果表明:与木销连接相比,竹销连接的抗滑移刚度更高且延性更好;销合木梁的受弯性能介于无销接叠合木梁和胶合木梁之间,其组合效率为0.11~0.15;随层板数量的增加,梁截面的增高使销合木梁的抗弯性能显著上升;减小销间距对销合木梁的抗弯承载力与刚度均有一定的提升作用。采用欧洲规范5中的γ法预测销合木梁的抗弯刚度时结果偏大,因此认为对销合木梁的抗弯刚度进行计算时须对销连接的滑移刚度进行折减。

基于分子动力学方法的致密砂岩储层CO_(2)驱油研究进展

随着致密砂岩储层CO_(2)-EOR项目的不断增加,亟需对CO_(2)与致密砂岩储层流体在孔隙介质中的相互作用机理进行研究,但室内实验难以观察到CO_(2)与流体在孔隙通道中的动态过程,而分子动力学模拟则可以弥补传统实验和数值方法的不足。为此,围绕该方法在CO_(2)-EOR研究中的2大重点——界面行为与受限空间运移行为,对包括萃取、溶胀、降黏、降低界面张力、最小混相压力、润湿性等6个方面界面行为的相关研究成果进行了系统梳理,结合前人对CO_(2)与致密砂岩储层流体在受限空间中运移行为的研究成果,提出了分子动力学在致密砂岩储层CO_(2)-EOR研究中的关键科学问题。研究结果表明:①分子动力学能够很好地将CO_(2)萃取原油中—轻烃组分的过程进行可视化,建议根据原油实际组分构成分析CO_(2)的萃取能力,从而弄清CO_(2)萃取原油中各组分的优先顺序及效率;②有关CO_(2)分子对原油溶胀降黏作用的研究,大多数成果中的原油组分体系较为单一,建议根据实际储层的原油组分,系统探讨高温高压条件下CO_(2)的溶胀降黏作用;③对于CO_(2)与油水两相之间界面张力的研究更多是在体相中进行展开,而在纳米受限空间界面行为的研究还有待完善;④有关地层水在孔隙壁面的润湿性研究,对不同因素之间的协同效应影响润湿性的机理尚不明确。结论认为,随着量子力学研究的不断深入以及计算性能的日益强大,该方法可以在更大尺度上进行复杂体系的计算,以其为基础的油藏、页岩油气藏CO_(2)-EOR机理等研究将会取得较大的突破。

颗粒级配和表面纹理对饱和砂-钢界面剪切强度的影响

钢桩和钢制吸力基础广泛应用于海洋工程,土体与基础结构界面力学特性决定着其承载能力。通过饱和砂-钢界面排水剪切试验,揭示了颗粒级配、表面纹理和法向边界条件对界面剪切特性的影响规律。研究表明:由于颗粒剪切方式和孔隙水压力消散方式的不同,常法向应力(CNL)下剪应力-位移曲线出现明显的应变软化现象。变法向应力(VNL)下,界面剪切强度随法向应力的增大不断提高。对于光滑和凸起构造,界面摩擦角随不均匀系数C_(u)的增加基本呈线性增长。对于凹槽构造,界面摩擦角随C_(u)的增加而减小。饱和砂-粗糙度钢板界面剪切效能的发挥受水的影响显著,砂与钢板之间水膜的存在减弱了砂颗粒和钢界面的摩擦,使得界面摩擦性能不能完全发挥。

Al_(2)O_(3)型壳与DZ125高温合金的润湿性及界面反应研究

DZ125合金因其优异的性能和较低的成本被广泛用于航空发动机的涡轮叶片。航空发动机涡轮叶片通常由熔模铸造技术制备,而陶瓷型壳是熔模铸造技术的基础和保障。陶瓷型壳与高温合金的润湿性及界面反应是高温合金涡轮叶片表面质量及尺寸精度的重要影响因素。以电熔白刚玉粉、EC95粉和电熔白刚玉砂为原料,以1030C硅溶胶为粘结剂,设计了涡轮叶片定向凝固成型用陶瓷型壳浆料配方,并制备了陶瓷型壳。在研究Al_(2)O_(3)型壳的微观结构和表面粗糙度的基础之上,重点研究了Al_(2)O_(3)型壳与DZ125高温合金的润湿性及界面反应。结果表明,制备的Al_(2)O_(3)型壳具有光滑平整的表面,表面粗糙度达1.973μm;Al_(2)O_(3)型壳对DZ125高温合金具有良好的惰性,两者的润湿角为119.54°;DZ125合金表面发生了轻微的化学粘砂,粘砂层厚度仅约0.5μm,化学反应产物主要为合金元素Ta、Cr、W和Ti的氧化物。Al_(2)O_(3)型壳与DZ125高温合金的界面处化学粘砂被有效抑制的主要原因为Al_(2)O_(3)型壳的光滑平整表面及其对DZ125高温合金展现出良好的不润湿性。