Structure and Tribological Property of TiBN Nanocomposite Multilayer Synthesized by Ti-BN Composite Cathode Plasma Immersion Ion Implantation and Deposition

A Ti-BN complex cathode is made from Ti and h-BN powders by the powder metallurgy technology, and TiBN coating is obtained by plasma immersion ion implantation and deposition with this Ti-BN composite cathode. The TiBN coating shows a self-forming multilayered nanocomposite structure while with relative uniform elemental distributions. High resolution transmission electron microscopy images reveal that the multilayered structure is derived from different grain sizes in the nanocomposite. Due to the existence of h-BN phase, the friction coefficient of the coating is about 0.25.

Diamond-like carbon films synthesized on bearing steel surface by plasma immersion ion implantation and deposition

Diamond-like carbon (DLC) films were synthesized by plasma immersion ion implantation and deposition (PIIID) on 9Cr18 bearing steel surface. Influences of working gas pressure and pulse width of the bias voltage on properties of the thin film were investigated. The chemical compositions of the as-deposited films were characterized by Raman spectroscopy. The micro-hardness, friction and wear behavior, corrosion resistance of the samples were evaluated, respectively. Compared with uncoated substrates, micro-hardness results reveal that the maximum is increased by 88.7%. In addition, the friction coefficient decreases to about 0.1, and the corrosion resistance of treated coupons surface are improved significantly.

Low temperature soldering alloy using Sn63 Pb37 implantation of silica ceramics and copper solder assisted by ion and deposition

Copper ion implantation and deposition technique was applied as a pretreatment method for low temperature joining of silica ceramic （ SiO2 ） and copper alloy. The effect of copper ion implantation and deposition parameters on the microstructures and mechanical behavior of the soldering joints was investigated by scanning electron microscope （SEM） , X- ray diffraction （ XRD ） and shearing test. The copper implantation depth was about 90 nm with peak concentration of 70% for the SiO2 sample implanted for 90 rain. If copper film was deposited for 4 rain using magnetron sputtering, copper layer with thickness of 150 nm and peak concentration of 80% was obtained. After pretreatment of ion implantation and deposition, SiO2 and copper were joined successfully at low temperature directly using SnPb solder. The SnPb solder filling ratio along joining seams was up to 100% without defects with smooth soldering toes. With the increase of implantation dose, the shear strength of the Si02/Cu joints increases accordingly. After a special pretreatment on SiO2 （ Cu implantation for 30min, following Cu deposition for 4 rain, then Cu implantation for 60 rain and finally Cu deposition for 120 min） , a maximum soldering strength of 22 MPa was achieved, and the soldering joints fractured at the SiO2 base material.

Electrochemical Corrosion Behavior of the DLC Coated and Uncoated NiTi Alloys

A dense and well-adhered diamond-like carbon （DLC） coating was prepared on the nickel-titanium （NiTi） alloys by plasma immersion ion implantation and deposition （PIIID）. Potentiodynamic polarization tests indicated the corrosion resistance of the NiTi alloys was markedly improved by the DLC coating. The Ni ions release of the NiTi alloys was effectively blocked by the DLC coating.