The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of ayial-symmetrical lamps-array is designed to guarantee that the irr...The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of ayial-symmetrical lamps-array is designed to guarantee that the irradiation on the edge is approximately the same as the one on the center of the wafer. The magnitude of temperature on the wafer vs. the power of tungsten-halogen lamps is calculated numerically.展开更多
SiGe offers a low-cost alternative to conventional infrared sensor material systems such as InGaAs, InSb, and HgCdTe for developing near-infrared (NIR) photodetector devices that do not require cooling and can operate...SiGe offers a low-cost alternative to conventional infrared sensor material systems such as InGaAs, InSb, and HgCdTe for developing near-infrared (NIR) photodetector devices that do not require cooling and can operate with relatively low dark current. As a result of the significant difference in thermal expansion coefficients between germanium (Ge) and silicon (Si), tensile strain incorporated into SiGe detector devices through specialized growth processes can extend their NIR wavelength range of operation. We have utilized high throughput, large-area complementary metal-oxide semiconductor (CMOS) technology to fabricate Ge based p-i-n (PIN) detector devices on 300 mm Si wafers. The two-step device fabrication process, designed to effectively reduce the density of defects and dislocations arising during deposition that form recombination centers which can result in higher dark current, involves low temperature epitaxial deposition of Ge to form a thin p<sup>+</sup> seed layer, followed by higher temperature deposition of a thicker Ge intrinsic layer. Phosphorus was then ion-implanted to create devices with n<sup>+</sup> regions of various doping concentrations. Secondary ion mass spectroscopy (SIMS) has been utilized to determine the doping profiles and material compositions of the layers. In addition, electrical characterization of the I-V photoresponse of different devices from the same wafer with various n<sup>+</sup> region doping concentrations has demonstrated low dark current levels (down to below 1 nA at -1 V bias) and comparatively high photocurrent at reverse biases, with optimal response for doping concentration of 5 × 10<sup>19</sup> cm<sup>-3</sup>.展开更多
基金Foundationfor Key Youth Teachers from Hunan Province(521105237) Natural Science Foundation of HunanUniversity(521101805)
文摘The relationship between the arrangement of tungsten-halogen lamps and the uniformity of irradiance received by the wafer is discussed, and a sort of ayial-symmetrical lamps-array is designed to guarantee that the irradiation on the edge is approximately the same as the one on the center of the wafer. The magnitude of temperature on the wafer vs. the power of tungsten-halogen lamps is calculated numerically.
文摘SiGe offers a low-cost alternative to conventional infrared sensor material systems such as InGaAs, InSb, and HgCdTe for developing near-infrared (NIR) photodetector devices that do not require cooling and can operate with relatively low dark current. As a result of the significant difference in thermal expansion coefficients between germanium (Ge) and silicon (Si), tensile strain incorporated into SiGe detector devices through specialized growth processes can extend their NIR wavelength range of operation. We have utilized high throughput, large-area complementary metal-oxide semiconductor (CMOS) technology to fabricate Ge based p-i-n (PIN) detector devices on 300 mm Si wafers. The two-step device fabrication process, designed to effectively reduce the density of defects and dislocations arising during deposition that form recombination centers which can result in higher dark current, involves low temperature epitaxial deposition of Ge to form a thin p<sup>+</sup> seed layer, followed by higher temperature deposition of a thicker Ge intrinsic layer. Phosphorus was then ion-implanted to create devices with n<sup>+</sup> regions of various doping concentrations. Secondary ion mass spectroscopy (SIMS) has been utilized to determine the doping profiles and material compositions of the layers. In addition, electrical characterization of the I-V photoresponse of different devices from the same wafer with various n<sup>+</sup> region doping concentrations has demonstrated low dark current levels (down to below 1 nA at -1 V bias) and comparatively high photocurrent at reverse biases, with optimal response for doping concentration of 5 × 10<sup>19</sup> cm<sup>-3</sup>.
