Thermal self-compressing bonding(TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has prove...Thermal self-compressing bonding(TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of TSCB. However, the thermal stress–strain process during bonding, which is of very important significance in revealing the mechanism of TSCB, was not analysed. In this paper, finite element analysis method is adopted to numerically study the thermal elasto-plastic stress–strain cycle of thermal self-compressing bonding. It is found that due to the localized heating, a non-uniform temperature distribution is formed during bonding, with the highest temperature existed on the bond interface. The expansion of high temperature materials adjacent to the bond interface are restrained by surrounding cool materials and rigid restraints, and thus an internal elasto-plastic stress–strain field is developed by itself which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints. Due to the relatively large plastic deformation, rigid restraint TSCB obtains sound joints in relatively short time compared to diffusion bonding.展开更多
Selective Laser Melting (SLM) shows a big potential among metal additive manufacturing (AM) technologies. However, the large thermal gradients and the local melting and solidification processes of SLM result in the pr...Selective Laser Melting (SLM) shows a big potential among metal additive manufacturing (AM) technologies. However, the large thermal gradients and the local melting and solidification processes of SLM result in the presence of a significant amount of residual stresses in the as built parts. These internal stresses will not only affect mechanical properties, but also increase the risk of Stress Corrosion Cracking (SCC). A twister used in an air extraction pump of a condenser to create a swirl in the water, was chosen as a candidate component to be produced by SLM in 316 L stainless steel. Since the main expected damage mechanism of this component in service is corrosion, corrosion tests were carried out on an as-built twister as well as on heat treated components. It was shown that a low temperature heat treatment at 450℃ had only a limited effect on the residual stress reduction and concomitant corrosion properties, while the internal stresses were significantly reduced when a high temperature heat treatment at 950℃ was applied. Furthermore, a specific stress corrosion sensitivity test proved to be a useful tool to evaluate the internal stress distribution in a specific component.展开更多
基金Supported by National Natural Science Foundation of China(Grant No.51705491)
文摘Thermal self-compressing bonding(TSCB) is a new solid-state bonding method pioneered by the authors. With electron beam as the non-melted heat source, previous experimental study performed on titanium alloys has proved the feasibility of TSCB. However, the thermal stress–strain process during bonding, which is of very important significance in revealing the mechanism of TSCB, was not analysed. In this paper, finite element analysis method is adopted to numerically study the thermal elasto-plastic stress–strain cycle of thermal self-compressing bonding. It is found that due to the localized heating, a non-uniform temperature distribution is formed during bonding, with the highest temperature existed on the bond interface. The expansion of high temperature materials adjacent to the bond interface are restrained by surrounding cool materials and rigid restraints, and thus an internal elasto-plastic stress–strain field is developed by itself which makes the bond interface subjected to thermal compressive action. This thermal self-compressing action combined with the high temperature on the bond interface promotes the atom diffusion across the bond interface to produce solid-state joints. Due to the relatively large plastic deformation, rigid restraint TSCB obtains sound joints in relatively short time compared to diffusion bonding.
文摘Selective Laser Melting (SLM) shows a big potential among metal additive manufacturing (AM) technologies. However, the large thermal gradients and the local melting and solidification processes of SLM result in the presence of a significant amount of residual stresses in the as built parts. These internal stresses will not only affect mechanical properties, but also increase the risk of Stress Corrosion Cracking (SCC). A twister used in an air extraction pump of a condenser to create a swirl in the water, was chosen as a candidate component to be produced by SLM in 316 L stainless steel. Since the main expected damage mechanism of this component in service is corrosion, corrosion tests were carried out on an as-built twister as well as on heat treated components. It was shown that a low temperature heat treatment at 450℃ had only a limited effect on the residual stress reduction and concomitant corrosion properties, while the internal stresses were significantly reduced when a high temperature heat treatment at 950℃ was applied. Furthermore, a specific stress corrosion sensitivity test proved to be a useful tool to evaluate the internal stress distribution in a specific component.
