Preparation of A Novel Hybrid Type Photosensitive Resin for Stereolithography in 3D Printing and Testing on the Accuracy of the Fabricated Parts

A novel hybrid type photosensitive resin for stereolithography in 3D printing was prepared with bisphenol A type epoxy diacrylate （EA-612）, tripropylene glycol diacrylate （TPGDA）,ethoxylated trimethyolpropane triacrylate（EO3TMPTA）, cycloaliphatic diepoxide（ERL-4221）,polycaprolactonepolyol（Polyol-0301）,1-hydroxy-cyclohphenyl ketone（Irgacure184）, and a mixture of triarylsulfonium hexafluoroantimonate salts （Ar3SSbF6）. The novel hybrid type photosensitive resin was the photosensitive resin of an epoxy-acrylate hybrid system, which proceeded free radical polymerization and cationic polymerization in ultraviolet （UV） laser. Cuboid parts and double-cantilever parts were fabricated by using a stereolithography apparatus with the novel hybrid type photosensitive resin as the processing material,and the dimension shrinkage factor and the curl factor were tested. The shrinkage factor was less than 2.00%,and the curl factor was less than 8.00%, which showed that the accuracy of the fabricated parts was high with the photosensitive resin for stereolithography in 3D printing.

Application of Bis[2-(3,4-epoxycyclohexyl)ethyl]octamethyltetrasiloxane in the Preparation of a Photosensitive Resin for Stereolithography 3D Printing

Bis[2-(3,4-epoxycyclohexyl)ethyl]octamethyltetrasiloxane is also called diepoxycyclohexylethyl octamethyltetrasiloxane. In the present paper, diepoxycyclohexylethyl octamethyltetrasiloxane was synthesized, and the synthesized product was characterized by FTIR and 1 HMR. The synthesized product was compounded with some acrylates and an expoxide as well as photoinitiators to obtain a 3D printing stereolithography resin(3DSLR111). The properties of 3DSLR111 and its UV-cured samples were investigated by some instruments and equipments. The experimental results show that the critical exposure(Ec) of 3DSLR111 is 10.1 mJ/cm^2, its penetration depth(Dp) is 0.15 mm, and its viscosity at 30 ℃ is 319 mPa·s. Some samples were printed with 3DSLR111, and their linear shrinkage and warping factor were evaluated. The linear shrinkage and the curl distortion factor are less than 0.80% and 7.30%, respectively, which indicates that the sample printed with 3DSLR111 has high accuracy, and that the synthesized diepoxycyclohexylethyl octamethyltetrasiloxane can be well applied to the preparation of the photosensitive resin for stereolithography 3D printing.

Preparation of a Novel Cationic Photosensitive Resin(3D-SLR01) for Stereolithography 3D Printing and Determination of Its Some Properties

A novel cationic photosensitive resin(3 DSLR-01) for stereolithography 3 D printing was prepared with 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexane carboxylate(2021 P),1,4-cyclohexanedimethanol glycidyl ether(JX-026), diglycidyl 4,5-epoxycyclohexane-1,2-dicarboxylate(S-186), polycaprolactone polyol(Polyol-0305), novolac epoxy resin(F-51), bis(3-ethyl-3-oxetanylmethyl) ether(S-221) and a mixture of triarylsulfonium hexafluoroantimonate salts solution(UVI-6976). The properties of the photosensitive resin and its UV-cured films were investigated by some instruments and equipment.The experimental results show that the critical exposure(Ec) of the photosensitive resin is 16.3 mJ/cm^2, the penetration depth(Dp) is 0.14 mm, and the optical property of the photosensitive resin is excellent. Rectangle plates were printed by using a stereolithography apparatus(HRPL-150 A) with the photosensitive resin as the manufacturing material, and the shrinkage rates of the plates were less than 0.60%, which showed that the accuracy of the manufactured plates was very high.